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Wearable All-Solid-State Potentiometric Microneedle Patch for Intradermal Potassium Detection

Analytical chemistry (Washington), 2019-01, Vol.91 (2), p.1578-1586

2019

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Large-area integration of two-dimensional materials and their heterostructures by wafer bonding

Nature communications, 2021-02, Vol.12 (1), p.917-917, Article 917

2021

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Massively parallel fabrication of crack-defined gold break junctions featuring sub-3 nm gaps for molecular devices

Nature communications, 2018-08, Vol.9 (1), p.3433-10, Article 3433

2018

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Scalable Manufacturing of Single Nanowire Devices Using Crack-Defined Shadow Mask Lithography

ACS applied materials & interfaces, 2019-02, Vol.11 (8), p.8217-8226

2019

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Nanoelectromechanical relay without pull-in instability for high-temperature non-volatile memory

Nature communications, 2020-03, Vol.11 (1), p.1181-1181, Article 1181

2020

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Flexible and Stretchable Microneedle Patches with Integrated Rigid Stainless Steel Microneedles for Transdermal Biointerfacing

PloS one, 2016-12, Vol.11 (12), p.e0166330-e0166330

2016

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Three-dimensional printing of silica glass with sub-micrometer resolution

Nature communications, 2023-06, Vol.14 (1), p.3305-3305, Article 3305

2023

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Nanoelectromechanical Sensors Based on Suspended 2D Materials

Research (Washington), 2020, Vol.2020, p.8748602-8748602

2020

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Carbon-Based Electrode Materials for Microsupercapacitors in Self-Powering Sensor Networks: Present and Future Development

Sensors (Basel, Switzerland), 2019-09, Vol.19 (19), p.4231

2019

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Micro 3D printing of a functional MEMS accelerometer

Microsystems & nanoengineering, 2022-09, Vol.8 (1), p.105-105, Article 105

2022

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Probabilistic cell seeding and non-autofluorescent 3D-printed structures as scalable approach for multi-level co-culture modeling

Materials today bio, 2023-08, Vol.21, p.100706-100706, Article 100706

2023

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Deformation Behavior and Mechanical Properties of Suspended Double‐Layer Graphene Ribbons Induced by Large Atomic Force Microscopy Indentation Forces

Advanced engineering materials, 2022-03, Vol.24 (3), p.2100826-n/a

2022

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Performance Analysis of Nanoelectromechanical Relay-Based Field-Programmable Gate Arrays

IEEE access, 2018-01, Vol.6, p.15997-16009

2018

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Integrated silicon photonic MEMS

Microsystems & nanoengineering, 2023, Vol.9 (1), p.27-27, Article 27

2023

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Small footprint wafer-level vacuum packaging using compressible gold sealing rings

Journal of micromechanics and microengineering, 2011-08, Vol.21 (8), p.085011-6

2011

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3D Free-Form Patterning of Silicon by Ion Implantation, Silicon Deposition, and Selective Silicon Etching

Advanced functional materials, 2012-10, Vol.22 (19), p.4004-4008

2012

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Through-Glass Vias for Glass Interposers and MEMS Packaging Applications Fabricated Using Magnetic Assembly of Microscale Metal Wires

IEEE access, 2018-01, Vol.6, p.44306-44317

2018

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Correction: Integrated silicon photonic MEMS

Microsystems & nanoengineering, 2024, Vol.10 (1), p.17-17, Article 17

2024

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A large-area single-filament infrared emitter and its application in a spectroscopic ethanol gas sensing system

Microsystems & nanoengineering, 2021, Vol.7 (1), p.87-87, Article 87

2021

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High-Aspect-Ratio Through Silicon Vias for High-Frequency Application Fabricated by Magnetic Assembly of Gold-Coated Nickel Wires

IEEE transactions on components, packaging, and manufacturing technology (2011), 2015-01, Vol.5 (1), p.21-27

2015

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Direct observation of grain boundaries in graphene through vapor hydrofluoric acid (VHF) exposure

Science advances, 2018-05, Vol.4 (5), p.eaar5170-eaar5170

2018

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Vertical integration of microchips by magnetic assembly and edge wire bonding

Microsystems & nanoengineering, 2020-02, Vol.6 (1), p.12-12, Article 12

2020

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Electromechanical Piezoresistive Sensing in Suspended Graphene Membranes

Nano letters, 2013-07, Vol.13 (7), p.3237-3242

2013

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Cost-Efficient Wafer-Level Capping for MEMS and Imaging Sensors by Adhesive Wafer Bonding

Micromachines (Basel), 2016-10, Vol.7 (10), p.192-192

2016

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Crack-Defined Electronic Nanogaps

Advanced materials (Weinheim), 2016-03, Vol.28 (11), p.2178-2182

2016

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Wearable All-Solid-State Potentiometric Microneedle Patch for Intradermal Potassium Detection

Large-area integration of two-dimensional materials and their heterostructures by wafer bonding

Massively parallel fabrication of crack-defined gold break junctions featuring sub-3 nm gaps for molecular devices

Scalable Manufacturing of Single Nanowire Devices Using Crack-Defined Shadow Mask Lithography

Nanoelectromechanical relay without pull-in instability for high-temperature non-volatile memory

Flexible and Stretchable Microneedle Patches with Integrated Rigid Stainless Steel Microneedles for Transdermal Biointerfacing

Three-dimensional printing of silica glass with sub-micrometer resolution

Nanoelectromechanical Sensors Based on Suspended 2D Materials

Carbon-Based Electrode Materials for Microsupercapacitors in Self-Powering Sensor Networks: Present and Future Development

Micro 3D printing of a functional MEMS accelerometer

Probabilistic cell seeding and non-autofluorescent 3D-printed structures as scalable approach for multi-level co-culture modeling

Deformation Behavior and Mechanical Properties of Suspended Double‐Layer Graphene Ribbons Induced by Large Atomic Force Microscopy Indentation Forces

Performance Analysis of Nanoelectromechanical Relay-Based Field-Programmable Gate Arrays

Integrated silicon photonic MEMS

Small footprint wafer-level vacuum packaging using compressible gold sealing rings

3D Free-Form Patterning of Silicon by Ion Implantation, Silicon Deposition, and Selective Silicon Etching

Through-Glass Vias for Glass Interposers and MEMS Packaging Applications Fabricated Using Magnetic Assembly of Microscale Metal Wires

Correction: Integrated silicon photonic MEMS

A large-area single-filament infrared emitter and its application in a spectroscopic ethanol gas sensing system

High-Aspect-Ratio Through Silicon Vias for High-Frequency Application Fabricated by Magnetic Assembly of Gold-Coated Nickel Wires

Direct observation of grain boundaries in graphene through vapor hydrofluoric acid (VHF) exposure

Vertical integration of microchips by magnetic assembly and edge wire bonding

Electromechanical Piezoresistive Sensing in Suspended Graphene Membranes

Cost-Efficient Wafer-Level Capping for MEMS and Imaging Sensors by Adhesive Wafer Bonding

Crack-Defined Electronic Nanogaps

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