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Compact stochastic models for multidimensional quasiballistic thermal transport

Journal of applied physics, 2016-11, Vol.120 (17)

Vermeersch, Bjorn

2016

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almaBTE : A solver of the space–time dependent Boltzmann transport equation for phonons in structured materials

Computer physics communications, 2017-11, Vol.220, p.351-362

2017

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Cross-plane heat conduction in thin films with ab-initio phonon dispersions and scattering rates

Applied physics letters, 2016-05, Vol.108 (19)

2016

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Temperature and Thickness Dependences of the Anisotropic In‐Plane Thermal Conductivity of Black Phosphorus

Advanced materials (Weinheim), 2017-02, Vol.29 (5), p.np-n/a

2017

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Full-field thermal imaging of quasiballistic crosstalk reduction in nanoscale devices

Nature communications, 2018-01, Vol.9 (1), p.255-7, Article 255

2018

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Quasi-ballistic thermal transport in Al0.1Ga0.9N thin film semiconductors

Applied physics letters, 2016-12, Vol.109 (24)

2016

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Direct Observation of Nanoscale Peltier and Joule Effects at Metal–Insulator Domain Walls in Vanadium Dioxide Nanobeams

Nano letters, 2014-05, Vol.14 (5), p.2394-2400

2014

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Thermal interfacial transport in the presence of ballistic heat modes

Physical review. B, Condensed matter and materials physics, 2014-07, Vol.90 (1), Article 014306

2014

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Superdiffusive heat conduction in semiconductor alloys. I. Theoretical foundations

Physical review. B, Condensed matter and materials physics, 2015-02, Vol.91 (8), Article 085202

2015

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Quasiballistic heat removal from small sources studied from first principles

Physical review. B, 2018-01, Vol.97 (4), Article 045205

2018

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Thermal Resistance of Ga N / Al N Graded Interfaces

Physical review applied, 2019-03, Vol.11 (3), Article 034036

2019

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Frequency-Dependent Thermal Conductivity in Time Domain Thermoreflectance Analysis of Thin Films

MRS proceedings, 2011, Vol.1347 (1), Article mrss11-1347-bb07-07

2011

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Impact of FEOL cross-heating on the thermal performance of advanced BEOL

2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2022, p.1-9

2022

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Impact of 3-D Integration on Thermal Performance of RISC-V MemPool Multicore SOC

IEEE transactions on very large scale integration (VLSI) systems, 2023-12, Vol.31 (12), p.1896-1904

2023

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Thermal Performance Analysis of Mempool RISC-V Multicore SoC

IEEE transactions on very large scale integration (VLSI) systems, 2022-11, Vol.30 (11), p.1668-1676

2022

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Temperature and Thickness Dependences of the Anisotropic In-Plane Thermal Conductivity of Black Phosphorus

Advanced materials (Weinheim), 2016-11, Vol.29 (5)

2016

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Package level thermal analysis of backside power delivery network (BS-PDN) configurations

2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2022, p.1-7

2022

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Relativistic stable processes in quasiballistic heat conduction in semiconductors

Physical review. E, 2020-04, Vol.101 (4-1), p.042110-042110, Article 042110

2020

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Thermoreflectance imaging of sub 100 ns pulsed cooling in high-speed thermoelectric microcoolers

Journal of applied physics, 2013-03, Vol.113 (10)

2013

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A Fixed-Angle Dynamic Heat Spreading Model for (An)Isotropic Rear-Cooled Substrates

Journal of heat transfer, 2008-12, Vol.130 (12), p.121301(9)-121301(9)

2008

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Fractal Lévy Heat Transport in Nanoparticle Embedded Semiconductor Alloys

Nano letters, 2015-07, Vol.15 (7), p.4269-4273

2015

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Thermal analysis of advanced back-end-of-line structures and the impact of design parameters

2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2022, p.1-8

2022

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Thermoreflectance imaging of sub 100 ns pulsed cooling in high-speed thermoelectric microcoolers

Journal of applied physics, 2013-03, Vol.113 (10)

2013

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Performance Trade-Off Scenarios for GAA Nanosheet FETs Considering Inner-spacers and Epi-induced Stress: Understanding & Mitigating Process Risks

ESSCIRC 2021 - IEEE 47th European Solid State Circuits Conference (ESSCIRC), 2021, p.55-58

2021

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Performance Trade-Off Scenarios for GAA Nanosheet FETs Considering Inner-spacers and Epi-induced Stress: Understanding & Mitigating Process Risks

ESSDERC 2021 - IEEE 51st European Solid-State Device Research Conference (ESSDERC), 2021, p.55-58

2021

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Compact stochastic models for multidimensional quasiballistic thermal transport

almaBTE : A solver of the space–time dependent Boltzmann transport equation for phonons in structured materials

Cross-plane heat conduction in thin films with ab-initio phonon dispersions and scattering rates

Temperature and Thickness Dependences of the Anisotropic In‐Plane Thermal Conductivity of Black Phosphorus

Full-field thermal imaging of quasiballistic crosstalk reduction in nanoscale devices

Quasi-ballistic thermal transport in Al0.1Ga0.9N thin film semiconductors

Direct Observation of Nanoscale Peltier and Joule Effects at Metal–Insulator Domain Walls in Vanadium Dioxide Nanobeams

Thermal interfacial transport in the presence of ballistic heat modes

Superdiffusive heat conduction in semiconductor alloys. I. Theoretical foundations

Quasiballistic heat removal from small sources studied from first principles

Thermal Resistance of Ga N / Al N Graded Interfaces

Frequency-Dependent Thermal Conductivity in Time Domain Thermoreflectance Analysis of Thin Films

Impact of FEOL cross-heating on the thermal performance of advanced BEOL

Impact of 3-D Integration on Thermal Performance of RISC-V MemPool Multicore SOC

Thermal Performance Analysis of Mempool RISC-V Multicore SoC

Temperature and Thickness Dependences of the Anisotropic In-Plane Thermal Conductivity of Black Phosphorus

Package level thermal analysis of backside power delivery network (BS-PDN) configurations

Relativistic stable processes in quasiballistic heat conduction in semiconductors

Thermoreflectance imaging of sub 100 ns pulsed cooling in high-speed thermoelectric microcoolers

A Fixed-Angle Dynamic Heat Spreading Model for (An)Isotropic Rear-Cooled Substrates

Fractal Lévy Heat Transport in Nanoparticle Embedded Semiconductor Alloys

Thermal analysis of advanced back-end-of-line structures and the impact of design parameters

Thermoreflectance imaging of sub 100 ns pulsed cooling in high-speed thermoelectric microcoolers

Performance Trade-Off Scenarios for GAA Nanosheet FETs Considering Inner-spacers and Epi-induced Stress: Understanding & Mitigating Process Risks

Performance Trade-Off Scenarios for GAA Nanosheet FETs Considering Inner-spacers and Epi-induced Stress: Understanding & Mitigating Process Risks

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