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Sensors (Basel, Switzerland), 2021-05, Vol.21 (11), p.3764
2021
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Microelectronics and reliability, 2019-02, Vol.93, p.61-71
2019
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IEEE transactions on components, packaging, and manufacturing technology (2011), 2022-11, Vol.12 (11), p.1-1
2022
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Sensors and actuators. A. Physical., 2013-05, Vol.194, p.247-251
2013
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Microelectronics and reliability, 2015-04, Vol.55 (5), p.722-732
2015
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2014 4th International Electric Drives Production Conference (EDPC), 2014, p.1-8
2014
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Physica status solidi. C, 2012-03, Vol.9 (3-4), p.960-963
2012
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2022 IMAPS Nordic Conference on Microelectronics Packaging (NordPac), 2022, p.1-7
2022
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Thermal Simulations and Experimental Verification of Power Modules Designed for Double Sided Cooling
2016
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The energetic NeUtral Atom Detector Unit (NUADU) for China's Double Star Mission and its calibration
2004
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2021 24th Euromicro Conference on Digital System Design (DSD), 2021, p.311-318
2021
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2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017, p.1-10
2017
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2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013, p.1-11
2013
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2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2015, p.1-6
2015
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COSIVU, 2016, p.1063
2016
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2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2014, p.1-9
2014
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2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2015, p.1-7
2015
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2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2014, p.1-6
2014
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2016 Pan Pacific Microelectronics Symposium (Pan Pacific), 2016, p.1-10
2016
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Advanced Microsystems for Automotive Applications 2015, 2015, p.157-171
2015
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2011 IEEE 24th International Conference on Micro Electro Mechanical Systems, 2011, p.597-600
2011
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2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2012, p.1/5-5/5
2012
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12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 2011, p.1/7-7/7
2011
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- Science & Technology
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- Silicon Carbide
- Physics
- Physics, Applied
- Cooling
- Microelectronics
- Reliability
- Devices
- Double-Sided Cooling
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Kollektion
Zeitschrift / Serie
- Microelectronics And Reliability
- Ieee Transactions On Components, Packaging, And Manufacturing Technology
- Nuclear Instruments & Methods In Physics Research. Section A, Accelerators, Spectrometers, Detectors And Associated Equipment
- Physica Status Solidi C: Current Topics In Solid State Physics, Vol 9, No 3-4
- Physica Status Solidi. C
- Sensors
- Sensors And Actuators. A. Physical.