Details

Autor(en) / Beteiligte

• Suryadevara, Babu

Titel

Advances in Chemical Mechanical Planarization (CMP)

Auflage

1

Ort / Verlag

San Diego: Elsevier

Erscheinungsjahr

2016

Link zum Volltext

Quelle

ScienceDirect eBooks

Beschreibungen/Notizen

• This book provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planarization of multiple metal and dielectric materials and layers both at the device and the metallization levels, using different tools and parameters, requiring improvements in the control of topography and defects. This important book offers a systematic review of fundamentals and advances in the area.