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Experimental investigation of heat transfer characteristics in a miniature flat heat pipe with multi-channels

International journal of heat and mass transfer, 2024-04, Vol.221, p.125066, Article 125066

2024

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Heat pipe with PCM for electronic cooling

Applied energy, 2011-05, Vol.88 (5), p.1825-1833

2011

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Enhanced Flow Boiling Over Open Microchannels With Uniform and Tapered Gap Manifolds

Journal of heat transfer, 2013-06, Vol.135 (6)

2013

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Modeling and Performance Optimization of Double-Resonance Electronic Cooling Device with Three Electron Reservoirs

Journal of non-equilibrium thermodynamics, 2021-07, Vol.46 (3), p.273-289

2021

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Experimental Investigation of an Ultrathin Manifold Microchannel Heat Sink for Liquid-Cooled Chips

Journal of heat transfer, 2010-08, Vol.132 (8)

2010

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A semi-empirical model for preheater design to trigger CO2 boiling for detector cooling

International journal of refrigeration, 2021-08, Vol.128, p.12-21

2021

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Simulation and Experimental Study of Flexible Cooling System Based on Microchannel in PDMS

IEEE transactions on components, packaging, and manufacturing technology (2011), 2020-12, Vol.10 (12), p.2027-2036

2020

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Performance and flow characteristics of miniature EHD air blowers for thermal management applications

Journal of electrostatics, 2018-06, Vol.93, p.31-42

2018

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Steady and Unsteady Air Impingement Heat Transfer for Electronics Cooling Applications

Journal of heat transfer, 2013-11, Vol.135 (11)

2013

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Parametric Study of Electronic Cooling by Means of a Combination of Crossflow and an Impinging Jet

IEEE access, 2022, Vol.10, p.103749-103764

2022

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On the Cooling of Electronics With Nanofluids

Journal of heat transfer, 2011-05, Vol.133 (5)

2011

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Thermal Resistance in a Rectangular Flux Channel With Nonuniform Heat Convection in the Sink Plane

Journal of heat transfer, 2015-11, Vol.137 (11)

2015

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Assessment of high-heat-flux thermal management schemes

IEEE transactions on components and packaging technologies, 2001-06, Vol.24 (2), p.122-141

Mudawar, I.

2001

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A Numerical and Experimental Study of Staggered Submerged Liquid Jet Arrays Using Variable Angle Discharge Manifolds

IEEE transactions on components, packaging, and manufacturing technology (2011), 2019-11, Vol.9 (11), p.2168-2176

2019

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Cooling Performance of Arrays of Vibrating Cantilevers

Journal of heat transfer, 2009-11, Vol.131 (11), p.111401 (8 )-111401 (8 )

2009

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Exergy Analysis of Data Center Thermal Management Systems

Journal of heat transfer, 2008-02, Vol.130 (2), p.021401 (10)-021401 (10)

2008

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Micro- and Nanoscale Conductive Tree-Structures for Cooling a Disk-Shaped Electronic Piece

Journal of heat transfer, 2013-03, Vol.135 (3)

2013

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Electronics cooling with nanofluids: A critical review

Energy conversion and management, 2018-09, Vol.172, p.438-456

2018

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Electronics Cooling System and Component Design According to the Second Law

Journal of heat transfer, 2014-05, Vol.136 (5)

2014

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Heat Pipe Integrated in Direct Bonded Copper (DBC) Technology for Cooling of Power Electronics Packaging

IEEE transactions on power electronics, 2006-11, Vol.21 (6), p.1541-1547

2006

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Design of a Porous Electroosmotic Pump Used in Power Electronic Cooling

IEEE transactions on industry applications, 2009-11, Vol.45 (6), p.2073-2079

2009

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Single-Phase Microscale Jet Stagnation Point Heat Transfer

Journal of heat transfer, 2009-11, Vol.131 (11), p.111402 (8 )-111402 (8 )

2009

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Spray Cooling With Ammonia on Microstructured Surfaces: Performance Enhancement and Hysteresis Effect

Journal of heat transfer, 2009-07, Vol.131 (7), p.9-9

2009

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Experimental study of an aluminum based three-dimensional thermosyphon heat sink with microscale enhancement structure

Applied thermal engineering, 2024-12, Vol.257, p.124273, Article 124273

2024

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Efficient Microchannel Cooling of Multiple Power Devices With Compact Flow Distribution for High Power-Density Converters

IEEE transactions on power electronics, 2020-07, Vol.35 (7), p.7235-7245

2020

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Experimental investigation of heat transfer characteristics in a miniature flat heat pipe with multi-channels

Heat pipe with PCM for electronic cooling

Enhanced Flow Boiling Over Open Microchannels With Uniform and Tapered Gap Manifolds

Modeling and Performance Optimization of Double-Resonance Electronic Cooling Device with Three Electron Reservoirs

Experimental Investigation of an Ultrathin Manifold Microchannel Heat Sink for Liquid-Cooled Chips

A semi-empirical model for preheater design to trigger CO2 boiling for detector cooling

Simulation and Experimental Study of Flexible Cooling System Based on Microchannel in PDMS

Performance and flow characteristics of miniature EHD air blowers for thermal management applications

Steady and Unsteady Air Impingement Heat Transfer for Electronics Cooling Applications

Parametric Study of Electronic Cooling by Means of a Combination of Crossflow and an Impinging Jet

On the Cooling of Electronics With Nanofluids

Thermal Resistance in a Rectangular Flux Channel With Nonuniform Heat Convection in the Sink Plane

Assessment of high-heat-flux thermal management schemes

A Numerical and Experimental Study of Staggered Submerged Liquid Jet Arrays Using Variable Angle Discharge Manifolds

Cooling Performance of Arrays of Vibrating Cantilevers

Exergy Analysis of Data Center Thermal Management Systems

Micro- and Nanoscale Conductive Tree-Structures for Cooling a Disk-Shaped Electronic Piece

Electronics cooling with nanofluids: A critical review

Electronics Cooling System and Component Design According to the Second Law

Heat Pipe Integrated in Direct Bonded Copper (DBC) Technology for Cooling of Power Electronics Packaging

Design of a Porous Electroosmotic Pump Used in Power Electronic Cooling

Single-Phase Microscale Jet Stagnation Point Heat Transfer

Spray Cooling With Ammonia on Microstructured Surfaces: Performance Enhancement and Hysteresis Effect

Experimental study of an aluminum based three-dimensional thermosyphon heat sink with microscale enhancement structure

Efficient Microchannel Cooling of Multiple Power Devices With Compact Flow Distribution for High Power-Density Converters

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