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2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2016, p.1-6

2016

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Heat-removal performance scaling of interlayer cooled chip stacks

2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2010, p.1-12

2010

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Internet of the body and cognitive hypervisor

2017 IEEE/ACM International Conference on Connected Health: Applications, Systems and Engineering Technologies (CHASE), 2017, p.296-297

2017

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Advances in percolated thermal underfill (PTU) simulations for 3D-integration

2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2015, p.1-8

2015

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Waste heat recovery in supercomputers and 3D integrated liquid cooled electronics

13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2012, p.545-551

2012

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Enhanced centrifugal percolating thermal underfills based on neck formation by capillary bridging

13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2012, p.1234-1241

2012

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Antenna coupled far-infrared/THz detector in CMOS

Electronics letters, 2009-12, Vol.45 (25), p.1-1

2009

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Extended tensor description to design non-uniform heat-removal in interlayer cooled chip stacks

13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2012, p.574-587

2012

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Comparison of transient and static test methods for chip-to-sink thermal interface characterization

Microelectronics, 2009-09, Vol.40 (9), p.1379-1386

2009

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Towards thermally-aware design of 3D MPSoCs with inter-tier cooling

2011 Design, Automation & Test in Europe, 2011, p.1-6

2011

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Experimental Investigation of an Ultrathin Manifold Microchannel Heat Sink for Liquid-Cooled Chips

On the Cooling of Electronics With Nanofluids

Interlayer cooling potential in vertically integrated packages

Hysteretic electroluminescence in organic light-emitting diodes for spin injection

Combined local microchannel-scale CFD modeling and global chip scale network modeling for electronics cooling design

Self-Contained, Oscillating Flow Liquid Cooling System for Thin Form Factor High Performance Electronics

Electrical and Thermal Characterization of an Inductor-Based ANPC-Type Buck Converter in 14 nm CMOS Technology for Microprocessor Applications

Antenna coupled far-infrared/THz detector in CMOS

Angle-of-attack investigation of pin-fin arrays in nonuniform heat-removal cavities for interlayer cooled chip stacks

3D-ICE: fast compact transient thermal modeling for 3D ICs with inter-tier liquid cooling

Hierarchical Nested Surface Channels for Reduced Particle Stacking and Low-Resistance Thermal Interfaces

Energy-Efficient Multiobjective Thermal Control for Liquid-Cooled 3-D Stacked Architectures

Hierarchically Nested Channels for Fast Squeezing Interfaces With Reduced Thermal Resistance

Polarization-independent thermooptic phase shifters in silicon-oxynitride waveguides

Hierarchically nested channels for fast squeezing interfaces with reduced thermal resistance [IC cooling applications]

Stress investigations in 3D-integrated silicon microstructures

Heat-removal performance scaling of interlayer cooled chip stacks

Internet of the body and cognitive hypervisor

Advances in percolated thermal underfill (PTU) simulations for 3D-integration

Waste heat recovery in supercomputers and 3D integrated liquid cooled electronics

Enhanced centrifugal percolating thermal underfills based on neck formation by capillary bridging

Antenna coupled far-infrared/THz detector in CMOS

Extended tensor description to design non-uniform heat-removal in interlayer cooled chip stacks

Comparison of transient and static test methods for chip-to-sink thermal interface characterization

Towards thermally-aware design of 3D MPSoCs with inter-tier cooling

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