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A novel in-situ approach to monitor the variations in the on-resistance of power transistors during switching operation

Microelectronics and reliability, 2023-11, Vol.150, p.115199, Article 115199

2023

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Reliability prediction of a 30 kW power electronics converter

Microelectronics and reliability, 2023-11, Vol.150, p.115083, Article 115083

2023

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A review of lead-free solders for electronics applications

Microelectronics and reliability, 2017-08, Vol.75, p.77-95

2017

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Embedded systems and printed circuit boards as weak spots in HV-H3TRB tests

Microelectronics and reliability, 2022-11, Vol.138, p.114687, Article 114687

2022

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Testing single via related defects in digital VLSI designs

Microelectronics and reliability, 2021-05, Vol.120, p.114100, Article 114100

2021

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Improved HV-H3TRB robustness of a 1700 V IGBT chip set in standard power modules

Microelectronics and reliability, 2021-11, Vol.126, p.114211, Article 114211

2021

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Evaluating the performance of 6T SRAM cells by deep learning

Microelectronics and reliability, 2024-05, Vol.156, Article 115374

2024

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Designing a Deep Neural Network engine for LLC block reuse prediction to mitigate Soft Error in Multicore

Microelectronics and reliability, 2024-05, Vol.156, Article 115377

2024

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A theoretical investigation of mole fraction-based N+ pocket doped stack oxide TFET considering ideal conditions for reliability issues

Microelectronics and reliability, 2024-04, Vol.155, Article 115357

2024

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Impact of SiC power MOSFET interface trap charges on UIS reliability under single pulse

Microelectronics and reliability, 2024-04, Vol.155, Article 115375

2024

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Crosstalk optimization and gate oxide reliability analysis in intercalation doped MLGNR with reduced vertical thickness

Microelectronics and reliability, 2024-04, Vol.155, Article 115363

2024

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Highly reliable micro-scale Cu sintered joint by oxidation-reduction bonding process under thermal cycling

Microelectronics and reliability, 2023-11, Vol.150, p.115123, Article 115123

2023

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In-situ delamination detection in multi-layered semiconductor packages

Microelectronics and reliability, 2023-11, Vol.150, p.115098, Article 115098

2023

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The TETRISC SoC—A resilient quad-core system based on the ResiliCell approach

Microelectronics and reliability, 2023-09, Vol.148, p.115173, Article 115173

2023

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ECS an endeavor towards providing similar cache reliability behavior in different programs

Microelectronics and reliability, 2024-01, Vol.152, p.115295, Article 115295

2024

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Soft errors in DNN accelerators: A comprehensive review

Microelectronics and reliability, 2020-12, Vol.115, p.113969, Article 113969

2020

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Reliability of automotive and consumer MEMS sensors - An overview

Microelectronics and reliability, 2021-11, Vol.126, p.114252, Article 114252

2021

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SiC power MOSFETs performance, robustness and technology maturity

Microelectronics and reliability, 2016-03, Vol.58, p.164-176

2016

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A review on discoloration and high accelerated testing of optical materials in LED based-products

Microelectronics and reliability, 2018-02, Vol.81, p.136-142

2018

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On the influence of lid materials for flip-chip ball grid array package applications

Microelectronics and reliability, 2023-01, Vol.140, p.114869, Article 114869

2023

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Finite element analysis of the effect of process-induced voids on the fatigue lifetime of a lead-free solder joint under thermal cycling

Microelectronics and reliability, 2016-10, Vol.65, p.243-254

2016

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Mission profile simplification method for reliability analysis of PV converters

Microelectronics and reliability, 2022-11, Vol.138, p.114651, Article 114651

2022

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Effect of thermal loading definitions on the mission profile-based reliability evaluation of power devices in PV inverters

Microelectronics and reliability, 2022-11, Vol.138, p.114650, Article 114650

2022

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A general approach for degradation modeling to enable a widespread use of aging simulations in IC design

Microelectronics and reliability, 2022-10, Vol.137, p.114775, Article 114775

2022

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Thermal fatigue reliability improvement of leadless ceramic chip carrier solder joints

Microelectronics and reliability, 2022-05, Vol.132, p.114532, Article 114532

2022

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A novel in-situ approach to monitor the variations in the on-resistance of power transistors during switching operation

Reliability prediction of a 30 kW power electronics converter

A review of lead-free solders for electronics applications

Embedded systems and printed circuit boards as weak spots in HV-H3TRB tests

Testing single via related defects in digital VLSI designs

Improved HV-H3TRB robustness of a 1700 V IGBT chip set in standard power modules

Evaluating the performance of 6T SRAM cells by deep learning

Designing a Deep Neural Network engine for LLC block reuse prediction to mitigate Soft Error in Multicore

A theoretical investigation of mole fraction-based N+ pocket doped stack oxide TFET considering ideal conditions for reliability issues

Impact of SiC power MOSFET interface trap charges on UIS reliability under single pulse

Crosstalk optimization and gate oxide reliability analysis in intercalation doped MLGNR with reduced vertical thickness

Highly reliable micro-scale Cu sintered joint by oxidation-reduction bonding process under thermal cycling

In-situ delamination detection in multi-layered semiconductor packages

The TETRISC SoC—A resilient quad-core system based on the ResiliCell approach

ECS an endeavor towards providing similar cache reliability behavior in different programs

Soft errors in DNN accelerators: A comprehensive review

Reliability of automotive and consumer MEMS sensors - An overview

SiC power MOSFETs performance, robustness and technology maturity

A review on discoloration and high accelerated testing of optical materials in LED based-products

On the influence of lid materials for flip-chip ball grid array package applications

Finite element analysis of the effect of process-induced voids on the fatigue lifetime of a lead-free solder joint under thermal cycling

Mission profile simplification method for reliability analysis of PV converters

Effect of thermal loading definitions on the mission profile-based reliability evaluation of power devices in PV inverters

A general approach for degradation modeling to enable a widespread use of aging simulations in IC design

Thermal fatigue reliability improvement of leadless ceramic chip carrier solder joints

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