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1st ed. 2017 edition., 2017
Link zum Volltext
1, 2017
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IEEE transactions on very large scale integration (VLSI) systems, 2012-01, Vol.20 (1), p.186-191
2012
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2013 IEEE 63rd Electronic Components and Technology Conference, 2013, p.77-80
2013
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2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), 2016, p.98-98
2016
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2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2015, p.1566-1573
2015
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Managing More-Than-Moore Integration Technology Development, 2018
2018
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Managing More-Than-Moore Integration Technology Development, 2018
2018
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Managing More-Than-Moore Integration Technology Development, 2018
2018
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Managing More-Than-Moore Integration Technology Development, 2018
2018
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2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC), 2013, p.1-4
2013
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More-than-Moore 2.5D and 3D SiP Integration, 2017, p.69-115
2017
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More-than-Moore 2.5D and 3D SiP Integration, 2017, p.159-180
2017
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More-than-Moore 2.5D and 3D SiP Integration, 2017, p.1-4
2017
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More-than-Moore 2.5D and 3D SiP Integration, 2017, p.5-67
2017
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More-than-Moore 2.5D and 3D SiP Integration, 2017, p.117-157
2017
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2012 IEEE Hot Chips 24 Symposium (HCS), 2012, p.1-21
2012
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IEEE Custom Integrated Circuits Conference 2010, 2010, p.1-4
2010
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2007 IEEE Custom Integrated Circuits Conference, 2007, p.249-252
2007
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2008 45th ACM/IEEE Design Automation Conference, 2008, p.593-593
2008
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Annual ACM IEEE Design Automation Conference: Proceedings of the 42nd annual conference on Design automation; 13-17 June 2005, 2005, p.767-768
2005
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2009 46th ACM/IEEE Design Automation Conference, 2009, p.202-203
2009
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Design Automation Conference, 2010, p.298-299
2010
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