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Applied Sciences, 2016-12, Vol.6 (12), p.426
2016
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IEEE photonics journal, 2017-06, Vol.9 (3), p.1-10
2017
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IEEE transactions on components, packaging, and manufacturing technology (2011), 2014-02, Vol.4 (2), p.352-359
2014
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Journal of electronic materials, 2015-01, Vol.44 (1), p.435-441
2015
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Sensors and actuators. B, Chemical, 2018-01, Vol.254, p.542-550
2018
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Journal of electronic materials, 2015, Vol.44 (1), p.435-441
2015
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128 × 128 silicon photonic MEMS switch package using glass interposer and pitch reducing fibre array
2017
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2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2016, p.1190-1196
2016
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2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 2014, p.31-35
2014
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2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), 2015, p.1-7
2015
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2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 2014, p.487-491
2014
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2016 IEEE 18th Electronics Packaging Technology Conference (EPTC), 2016, p.245-249
2016
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2016 IEEE Photonics Conference (IPC), 2016, p.629-630
2016
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2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), 2015, p.1-4
2015
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2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), 2015, p.1-5
2015
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2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 2014, p.618-623
2014
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2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 2014, p.225-228
2014
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2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 2014, p.229-234
2014
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2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 2014, p.606-610
2014
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2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), 2015, p.1-4
2015
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2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), 2015, p.1-4
2015
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2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 2013, p.498-503
2013
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2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 2013, p.379-383
2013
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2023 28th Microoptics Conference (MOC), 2023, p.1-2
2023
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2018 IEEE 20th Electronics Packaging Technology Conference (EPTC), 2018, p.46-49
2018
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