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Influence of Zn addition on the microstructure, melt properties and creep behavior of low Ag-content Sn–Ag–Cu lead-free solders

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2014-07, Vol.608, p.130-138

2014

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Microstructural modifications and properties of low-Ag-content Sn–Ag–Cu solder joints induced by Zn alloying

Journal of alloys and compounds, 2015-12, Vol.653, p.402-410

2015

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Synthesis of Al/SiC nanocomposite and evaluation of its mechanical properties using pulse echo overlap method

Journal of alloys and compounds, 2012-11, Vol.542, p.51-58

2012

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Thermal and mechanical properties of Sn–Zn–Bi lead-free solder alloys

Journal of alloys and compounds, 2009-09, Vol.484 (1), p.134-142

2009

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Creep behavior of near-peritectic Sn–5Sb solders containing small amount of Ag and Cu

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2011-01, Vol.528 (3), p.1055-1062

2011

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Sm-substituted copper-cobalt ferrite nanoparticles: Preparation and assessment of structural, magnetic and photocatalytic properties for wastewater treatment applications

Journal of alloys and compounds, 2021-11, Vol.883, p.160796, Article 160796

2021

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Combination of enhanced strength-ductility trade-off and stress relaxation resistance of MWCNTs reinforced Sn–5Sb-0.3Cu matrix composite

Materials chemistry and physics, 2023-02, Vol.295, p.127209, Article 127209

2023

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Structure, stability and optical parameters of cobalt zinc borate glasses

Ceramics international, 2021-11, Vol.47 (22), p.31470-31475

2021

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Synergic effect of Te, Ni and MWCNT on creep behavior and microstructural evolution of Sn-1.0Ag-0.7Cu low-Ag solder

Journal of alloys and compounds, 2022-05, Vol.902, p.163808, Article 163808

2022

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Impact of cobalt ions on the phonon energy and ligand field parameters of some borate glasses

Journal of non-crystalline solids, 2021-03, Vol.555, p.120535, Article 120535

2021

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The linear and nonlinear optical variations in Na2O-rich borosilicate glass doped with constant CrO3 content

Optical materials, 2024-03, Vol.149, Article 115106

2024

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Assessment of room-temperature short-term stress relaxation and strain relaxation with recovery in Sn-Bi lead-free solders solidified under rotating magnetic field

Journal of alloys and compounds, 2018-01, Vol.730, p.47-56

2018

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Investigation on multi-temperature short-term stress and creep relaxation of Sn-Ag-Cu-In solder alloys under the effect of rotating magnetic field

Microelectronics and reliability, 2019-07, Vol.98, p.10-18

2019

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Environmental influence of high Na2O additions on microstructure and ligand field parameters of Cr3+ inside borosilicate glass

Ceramics international, 2023-08, Vol.49 (16), p.27201-27213

2023

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Influence of rotating magnetic field on solidification microstructure and tensile properties of Sn-Bi lead-free solders

Microelectronics and reliability, 2018-02, Vol.81, p.352-361

2018

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Gamma ray shielding characteristics of Sn-20Bi and Sn-20Bi-0.4Cu lead-free alloys

Progress in nuclear energy (New series), 2020-05, Vol.123, p.103304, Article 103304

2020

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The role of delayed elasticity and stress relaxation in Sn-Bi-Cu lead-free solders solidified under permanent magnet stirring

Journal of alloys and compounds, 2018-04, Vol.740, p.801-809

2018

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Novel SiC nanoparticles-containing Sn―1.0Ag―0.5Cu solder with good drop impact performance

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2013-08, Vol.578, p.62-71

2013

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Impact of permanent magnet stirring on dendrite growth and elastic properties of Sn–Bi alloys revealed by pulse echo overlap method

Journal of alloys and compounds, 2018-10, Vol.767, p.464-473

2018

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Improved creep resistance and thermal behavior of Ni-doped Sn–3.0Ag–0.5Cu lead-free solder

Journal of alloys and compounds, 2014-02, Vol.587, p.32-39

2014

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Development of high strength Sn–0.7Cu solders with the addition of small amount of Ag and In

Journal of alloys and compounds, 2011-08, Vol.509 (34), p.8554-8560

2011

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Properties enhancement of low Ag-content Sn–Ag–Cu lead-free solders containing small amount of Zn

Journal of alloys and compounds, 2014-11, Vol.614, p.20-28

2014

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Fabrication of silicon carbide reinforced aluminum matrix nanocomposites and characterization of its mechanical properties using non-destructive technique

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2013-01, Vol.559, p.384-393

2013

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Effects of small addition of Ag and/or Cu on the microstructure and properties of Sn–9Zn lead-free solders

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2010-07, Vol.527 (20), p.5212-5219

2010

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Elastic properties and thermal behavior of Sn–Zn based lead-free solder alloys

Journal of alloys and compounds, 2010-09, Vol.505 (2), p.793-800

2010

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Influence of Zn addition on the microstructure, melt properties and creep behavior of low Ag-content Sn–Ag–Cu lead-free solders

Microstructural modifications and properties of low-Ag-content Sn–Ag–Cu solder joints induced by Zn alloying

Synthesis of Al/SiC nanocomposite and evaluation of its mechanical properties using pulse echo overlap method

Thermal and mechanical properties of Sn–Zn–Bi lead-free solder alloys

Creep behavior of near-peritectic Sn–5Sb solders containing small amount of Ag and Cu

Sm-substituted copper-cobalt ferrite nanoparticles: Preparation and assessment of structural, magnetic and photocatalytic properties for wastewater treatment applications

Combination of enhanced strength-ductility trade-off and stress relaxation resistance of MWCNTs reinforced Sn–5Sb-0.3Cu matrix composite

Structure, stability and optical parameters of cobalt zinc borate glasses

Synergic effect of Te, Ni and MWCNT on creep behavior and microstructural evolution of Sn-1.0Ag-0.7Cu low-Ag solder

Impact of cobalt ions on the phonon energy and ligand field parameters of some borate glasses

The linear and nonlinear optical variations in Na2O-rich borosilicate glass doped with constant CrO3 content

Assessment of room-temperature short-term stress relaxation and strain relaxation with recovery in Sn-Bi lead-free solders solidified under rotating magnetic field

Investigation on multi-temperature short-term stress and creep relaxation of Sn-Ag-Cu-In solder alloys under the effect of rotating magnetic field

Environmental influence of high Na2O additions on microstructure and ligand field parameters of Cr3+ inside borosilicate glass

Influence of rotating magnetic field on solidification microstructure and tensile properties of Sn-Bi lead-free solders

Gamma ray shielding characteristics of Sn-20Bi and Sn-20Bi-0.4Cu lead-free alloys

The role of delayed elasticity and stress relaxation in Sn-Bi-Cu lead-free solders solidified under permanent magnet stirring

Novel SiC nanoparticles-containing Sn―1.0Ag―0.5Cu solder with good drop impact performance

Impact of permanent magnet stirring on dendrite growth and elastic properties of Sn–Bi alloys revealed by pulse echo overlap method

Improved creep resistance and thermal behavior of Ni-doped Sn–3.0Ag–0.5Cu lead-free solder

Development of high strength Sn–0.7Cu solders with the addition of small amount of Ag and In

Properties enhancement of low Ag-content Sn–Ag–Cu lead-free solders containing small amount of Zn

Fabrication of silicon carbide reinforced aluminum matrix nanocomposites and characterization of its mechanical properties using non-destructive technique

Effects of small addition of Ag and/or Cu on the microstructure and properties of Sn–9Zn lead-free solders

Elastic properties and thermal behavior of Sn–Zn based lead-free solder alloys

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