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Earthquake Engineering and Engineering Vibration, 2014-09, Vol.13 (3), p.437-454
2014
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Applied physics letters, 2018-06, Vol.112 (26)
2018
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Review of scientific instruments, 2016-03, Vol.87 (3), p.036104
2016
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Bulletin of earthquake engineering, 2014-10, Vol.12 (5), p.2299-2331
2014
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Soil dynamics and earthquake engineering (1984), 2001-02, Vol.21 (2), p.113-137
2001
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Microelectronic engineering, 2010-05, Vol.87 (5), p.1015-1018
2010
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Nanotechnology, 2011-09, Vol.22 (36), p.365701-1-10
2011
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Physical review letters, 1998-11, Vol.81 (18), p.3968-3971
1998
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Earthquake engineering & structural dynamics, 1998-12, Vol.27 (12), p.1503-1522
1998
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Bulletin of earthquake engineering, 2011-10, Vol.9 (5), p.1617-1642
2011
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Microelectronic engineering, 2009-04, Vol.86 (4), p.596-599
2009
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Microelectronic engineering, 2004-06, Vol.73-74, p.233-237
2004
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Applied physics letters, 1999-12, Vol.75 (24), p.3859-3861
1999
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Meccanica (Milan), 2006-02, Vol.41 (1), p.23-46
2006
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Journal of cell science, 2020-03, Vol.133 (6)
2020
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Microelectronic engineering, 2004-06, Vol.73, p.233-237
2004
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Microelectronic engineering, 2010-05, Vol.87 (5-8), p.1015-1018
2010
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Physical review. B, Condensed matter, 1998-06, Vol.57 (22), p.14320-14331
1998
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Applied physics letters, 1997-05, Vol.70 (21), p.2912-2914
1997
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Soil dynamics and earthquake engineering (1984), 2003-08, Vol.23 (6), p.455-471
2003
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Applied physics letters, 2000-08, Vol.77 (6), p.770-772
2000
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Physical review letters, 1999-02, Vol.82 (6), p.1305-1308
1999
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Europhysics letters, 2019-06, Vol.126 (6), p.64004
2019
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Engineering failure analysis, 2013-12, Vol.34, p.629-647
2013
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Applied Mechanics and Materials, 2014-08, Vol.621 (Applied Research in Materials and Mechanics Engineering), p.137-142
2014
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