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Microelectronics and reliability, 2024-02, Vol.153, p.115310, Article 115310
2024
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IEEE transactions on electron devices, 2014-07, Vol.61 (7), p.2278-2286
2014
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Microelectronics and reliability, 2021-10, Vol.125, p.114362, Article 114362
2021
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Microelectronics and reliability, 2022-11, Vol.138, p.114711, Article 114711
2022
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Microelectronics and reliability, 2020-11, Vol.114, p.113752, Article 113752
2020
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Microelectronics and reliability, 2022-11, Vol.138, p.114686, Article 114686
2022
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IEEE transactions on device and materials reliability, 2023-12, Vol.23 (4), p.544-563
2023
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Advanced functional materials, 2024-03, Vol.34 (11), p.n/a
2024
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Journal of alloys and compounds, 2023-12, Vol.968, p.171866, Article 171866
2023
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Case studies in thermal engineering, 2021-08, Vol.26, p.100986, Article 100986
2021
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IOP conference series. Materials Science and Engineering, 2020-03, Vol.756 (1), p.12009
2020
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International journal of molecular sciences, 2023-05, Vol.24 (11), p.9564
2023
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Catalysts, 2021-12, Vol.11 (12), p.1546
2021
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- Silicon Carbide
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- Microelectronics And Reliability
- Advanced Functional Materials
- Advances In Cryogenic Engineering - Materials
- Case Studies In Thermal Engineering
- Catalysts
- Ieee Transactions On Device And Materials Reliability
- Ieee Transactions On Electron Devices
- International Journal Of Molecular Sciences
- Iop Conference Series. Materials Science And Engineering
- Iop Conference Series: Materials Science And Engineering