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IEEE transactions on applied superconductivity, 2022-11, Vol.32 (8), p.1-5
2022
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IEEE transactions on pattern analysis and machine intelligence, 2022-04, Vol.44 (4), p.2058-2073
2022
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IEEE journal of solid-state circuits, 2019-01, Vol.54 (1), p.173-185
2019
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IEEE transactions on geoscience and remote sensing, 2017-01, Vol.55 (1), p.502-525
2017
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IEEE transactions on industry applications, 2019-05, Vol.55 (3), p.2992-3002
2019
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IEEE transactions on industry applications, 2019-07, Vol.55 (4), p.3781-3790
2019
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IEEE transactions on power electronics, 2018-12, Vol.33 (12), p.10970-10978
2018
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IEEE transactions on energy conversion, 2024, p.1-9
2024
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IEEE journal of solid-state circuits, 2024-01, Vol.59 (1), p.143-156
2024
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IEEE transactions on circuits and systems. II, Express briefs, 2021-05, Vol.68 (5), p.1566-1570
2021
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IEEE transactions on industrial electronics (1982), 2021-10, Vol.68 (10), p.10316-10320
2021
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IEEE transactions on industrial electronics (1982), 2023-05, Vol.70 (5), p.4516-4525
2023
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Journal of lightwave technology, 2022-07, Vol.40 (13), p.4224-4236
2022
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IEEE transactions on circuits and systems. I, Regular papers, 2021-01, Vol.68 (1), p.336-349
2021
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IEEE microwave and wireless components letters, 2022-09, Vol.32 (9), p.1131-1134
2022
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IEEE journal of solid-state circuits, 2023-04, Vol.58 (4), p.1-14
2023
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IEEE transactions on computer-aided design of integrated circuits and systems, 2022-02, Vol.41 (2), p.211-224
2022
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IEEE transactions on applied superconductivity, 2021-04, Vol.31 (3), p.1-6
2021
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IEEE transactions on vehicular technology, 2022-07, Vol.71 (7), p.7258-7273
2022
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IEEE transactions on microwave theory and techniques, 2017-03, Vol.65 (3), p.980-987
2017
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IEEE transactions on power electronics, 2021-06, Vol.36 (6), p.6188-6191
2021
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IEEE transactions on very large scale integration (VLSI) systems, 2020-12, Vol.28 (12), p.2540-2550
2020
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IEEE/ASME transactions on mechatronics, 2020-06, Vol.25 (3), p.1612-1621
2020
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IEEE transactions on microwave theory and techniques, 2022-03, Vol.70 (3), p.1745-1756
2022
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IEEE transactions on instrumentation and measurement, 2019-01, Vol.68 (1), p.291-293
2019
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