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Examining the Relationship Between School Academic Optimism, Enabling School Structures, and Student Achievement in New Jersey Public Schools During the Post-Pandemic Period

Schwarz, Mark

2023

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A Model of Decarburization and Boil of Iron/Carbon Droplets

AIP conference proceedings, 2012-03

Schwarz, Mark

2012

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CFD Modeling of Splash in Molten Materials Processing Operations

AIP conference proceedings, 2012-03

Schwarz, Mark

2012

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Numerical investigation of solid circulation flux in an internally circulating fluidized bed with different gas distributor designs

Powder technology, 2016-11, Vol.301, p.1103-1111

2016

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Mobile health (mHealth) based medication adherence measurement – a pilot trial using electronic blisters in diabetes patients

British journal of clinical pharmacology, 2013-09, Vol.76 (S1), p.47-55

2013

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Modeling as a Tool for Scale-Up of an Iron Smelt-Reduction Process

AIP conference proceedings, 2012-03

2012

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Shams 1 - Design and operational experiences of the 100MW - 540°C CSP plant in Abu Dhabi

AIP Conference Proceedings, 2017, Vol.1850 (1)

2017

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California Central Valley Water Rights in a Changing Climate

San Francisco estuary and watershed science, 2015, Vol.13 (2), p.1-11

Schwarz, Andrew M.

2015

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Liederkunde Zum Evangelischen Gesangbuch. Heft 27

1, 2020

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Development of high damage threshold laser-machined apodizers and gain filters for laser applications

High power laser science and engineering, 2016, Vol.4, Article e32

2016

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Non-Nucleotide Hint1-Labile Phosphoramidates for the Interrogation of Pin1 Biology

Schwarz, Daniel Mark Comins

2021

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Should Firms Go “Beyond Profits”? Milton Friedman versus Broad CSR1

Business and society review (1974), 2012, Vol.117 (1), p.1-31

2012

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Investigation of the Factors Affecting the Warpage Prediction of Multi-Chip Package

2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, p.1514-1520

2021

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Feasibility of mHealth and Near Field Communication technology based medication adherence monitoring

2012 Annual International Conference of the IEEE Engineering in Medicine and Biology Society, 2012, Vol.2012, p.272-275

2012

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Numerical Model for Understanding Failure Mechanism of Back End of Line (BEOL) in Bump Shear

2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020, p.229-235

2020

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Study of BEOL Failure Mode in Flip Chip Packages at High Temperature Conditions

2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2019, p.392-396

2019

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Warpage Variation Analysis and Model Prediction for Molded Packages

2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2019, p.819-824

2019

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Study of Polyimide in Chip Package Interaction for Flip-Chip Cu-Pillar Packages

2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2018, p.1039-1043

2018

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0.35mm pitch wafer level package board level reliability: Studying effect of ball de-population with varying ball size

2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2015, p.1090-1095

2015

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Design and evaluation of a multimodal mHealth based medication management system for patient self administration

2013 35th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), 2013, Vol.2013, p.7270-7273

2013

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Board level reliability and surface mount assembly of 0.35mm and 0.3mm pitch wafer level packages

2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 2014, p.925-930

2014

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Recent introduction of an allodapine bee into Fiji： A new model system for understanding biological invasions by pollinators

Insect science, 2015-08, Vol.22 (4), p.532-540

2015

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Interconnect reliability prediction for wafer level packages (WLP) for temperature cycle and drop load conditions

2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 2014, p.100-107

2014

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Electrical Chip-Board Interaction (e-CBI) of Wafer Level Packaging Technology

International Symposium on Microelectronics, 2017-10, Vol.2017 (1), p.325-330

2017

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Deterministic chaos in the gas inlet pressure of gas–liquid bubbling systems

Physics of fluids (1994), 1995-04, Vol.7 (4), p.891-893

1995

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Examining the Relationship Between School Academic Optimism, Enabling School Structures, and Student Achievement in New Jersey Public Schools During the Post-Pandemic Period

A Model of Decarburization and Boil of Iron/Carbon Droplets

CFD Modeling of Splash in Molten Materials Processing Operations

Numerical investigation of solid circulation flux in an internally circulating fluidized bed with different gas distributor designs

Mobile health (mHealth) based medication adherence measurement – a pilot trial using electronic blisters in diabetes patients

Modeling as a Tool for Scale-Up of an Iron Smelt-Reduction Process

Shams 1 - Design and operational experiences of the 100MW - 540°C CSP plant in Abu Dhabi

California Central Valley Water Rights in a Changing Climate

Liederkunde Zum Evangelischen Gesangbuch. Heft 27

Development of high damage threshold laser-machined apodizers and gain filters for laser applications

Non-Nucleotide Hint1-Labile Phosphoramidates for the Interrogation of Pin1 Biology

Should Firms Go “Beyond Profits”? Milton Friedman versus Broad CSR1

Investigation of the Factors Affecting the Warpage Prediction of Multi-Chip Package

Feasibility of mHealth and Near Field Communication technology based medication adherence monitoring

Numerical Model for Understanding Failure Mechanism of Back End of Line (BEOL) in Bump Shear

Study of BEOL Failure Mode in Flip Chip Packages at High Temperature Conditions

Warpage Variation Analysis and Model Prediction for Molded Packages

Study of Polyimide in Chip Package Interaction for Flip-Chip Cu-Pillar Packages

0.35mm pitch wafer level package board level reliability: Studying effect of ball de-population with varying ball size

Design and evaluation of a multimodal mHealth based medication management system for patient self administration

Board level reliability and surface mount assembly of 0.35mm and 0.3mm pitch wafer level packages

Recent introduction of an allodapine bee into Fiji： A new model system for understanding biological invasions by pollinators

Interconnect reliability prediction for wafer level packages (WLP) for temperature cycle and drop load conditions

Electrical Chip-Board Interaction (e-CBI) of Wafer Level Packaging Technology

Deterministic chaos in the gas inlet pressure of gas–liquid bubbling systems

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