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Adhesive wafer bonding

Journal of applied physics, 2006-02, Vol.99 (3), p.031101-031101-28

2006

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Side-opened out-of-plane microneedles for microfluidic transdermal liquid transfer

Journal of microelectromechanical systems, 2003-06, Vol.12 (3), p.296-301

2003

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A packaged optical slot-waveguide ring resonator sensor array for multiplex label-free assays in labs-on-chips

Lab on a chip, 2010-01, Vol.10 (3), p.281-290

2010

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Unconventional applications of wire bonding create opportunities for microsystem integration

Journal of micromechanics and microengineering, 2013-08, Vol.23 (8), p.83001-18

2013

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Painless Drug Delivery Through Microneedle-Based Transdermal Patches Featuring Active Infusion

IEEE transactions on biomedical engineering, 2008-03, Vol.55 (3), p.1063-1071

2008

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Penetration-Enhanced Ultrasharp Microneedles and Prediction on Skin Interaction for Efficient Transdermal Drug Delivery

Journal of microelectromechanical systems, 2007-12, Vol.16 (6), p.1429-1440

2007

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Zero-insertion-loss optical shutter based on electrowetting-on-dielectric actuation of opaque ionic liquid microdroplets

Applied physics letters, 2019-08, Vol.115 (7)

2019

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Binary-Coded 4.25-bit W-Band Monocrystalline-Silicon MEMS Multistage Dielectric-Block Phase Shifters

IEEE transactions on microwave theory and techniques, 2009-11, Vol.57 (11), p.2834-2840

2009

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Very high aspect ratio through-silicon vias (TSVs) fabricated using automated magnetic assembly of nickel wires

Journal of micromechanics and microengineering, 2012-10, Vol.22 (10), p.105001-9

2012

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Active Opening Force and Passive Contact Force Electrostatic Switches for Soft Metal Contact Materials

Journal of microelectromechanical systems, 2006-10, Vol.15 (5), p.1235-1242

2006

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Fabrication of an infrared emitter using a generic integration platform based on wire bonding

Journal of micromechanics and microengineering, 2016-10, Vol.26 (11), p.115010

2016

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A comparative study of the bonding energy in adhesive wafer bonding

Journal of micromechanics and microengineering, 2013-08, Vol.23 (8), p.85019-7

2013

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Micromachined flat-walled valveless diffuser pumps

Journal of microelectromechanical systems, 1997-06, Vol.6 (2), p.161-166

1997

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Room-Temperature Sealing of Microcavities by Cold Metal Welding

Journal of microelectromechanical systems, 2009-12, Vol.18 (6), p.1318-1325

2009

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Selective wafer-level adhesive bonding with benzocyclobutene for fabrication of cavities

Sensors and actuators. A. Physical., 2003-08, Vol.105 (3), p.297-304

2003

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Low-temperature full wafer adhesive bonding

Journal of micromechanics and microengineering, 2001-03, Vol.11 (2), p.100-107

2001

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Micromachined electrodes for biopotential measurements

Journal of microelectromechanical systems, 2001-03, Vol.10 (1), p.10-16

2001

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BCB contact printing for patterned adhesive full-wafer bonded 0-level packages

Journal of microelectromechanical systems, 2005-04, Vol.14 (2), p.419-425

2005

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Characterization of micromachined spiked biopotential electrodes

IEEE transactions on biomedical engineering, 2002-06, Vol.49 (6), p.597-604

2002

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Mechanically tri-stable, true single-pole-double-throw (SPDT) switches

Journal of micromechanics and microengineering, 2006-11, Vol.16 (11), p.2251-2258

2006

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High-Yield Passive Plasma Filtration from Human Finger Prick Blood

Analytical chemistry (Washington), 2018-11, Vol.90 (22), p.13393-13399

2018

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Wafer-Scale Manufacturing of Bulk Shape-Memory-Alloy Microactuators Based on Adhesive Bonding of Titanium-Nickel Sheets to Structured Silicon Wafers

Journal of microelectromechanical systems, 2009-12, Vol.18 (6), p.1309-1317

2009

Volltextzugriff (PDF)

Heterogeneous 3D integration of 17 μm pitch Si SiGe quantum well bolometer arrays for infrared imaging systems

Journal of micromechanics and microengineering, 2013-04, Vol.23 (4), p.45017-8

2013

Volltextzugriff (PDF)

An Autonomous Microfluidic Device for Generating Volume-Defined Dried Plasma Spots

Analytical chemistry (Washington), 2019-06, Vol.91 (11), p.7125-7130

2019

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Arrays of monocrystalline silicon micromirrors fabricated using CMOS compatible transfer bonding

Journal of microelectromechanical systems, 2003-08, Vol.12 (4), p.465-469

2003

Volltextzugriff (PDF)

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Adhesive wafer bonding

Side-opened out-of-plane microneedles for microfluidic transdermal liquid transfer

A packaged optical slot-waveguide ring resonator sensor array for multiplex label-free assays in labs-on-chips

Unconventional applications of wire bonding create opportunities for microsystem integration

Painless Drug Delivery Through Microneedle-Based Transdermal Patches Featuring Active Infusion

Penetration-Enhanced Ultrasharp Microneedles and Prediction on Skin Interaction for Efficient Transdermal Drug Delivery

Zero-insertion-loss optical shutter based on electrowetting-on-dielectric actuation of opaque ionic liquid microdroplets

Binary-Coded 4.25-bit W-Band Monocrystalline-Silicon MEMS Multistage Dielectric-Block Phase Shifters

Very high aspect ratio through-silicon vias (TSVs) fabricated using automated magnetic assembly of nickel wires

Active Opening Force and Passive Contact Force Electrostatic Switches for Soft Metal Contact Materials

Fabrication of an infrared emitter using a generic integration platform based on wire bonding

A comparative study of the bonding energy in adhesive wafer bonding

Micromachined flat-walled valveless diffuser pumps

Room-Temperature Sealing of Microcavities by Cold Metal Welding

Selective wafer-level adhesive bonding with benzocyclobutene for fabrication of cavities

Low-temperature full wafer adhesive bonding

Micromachined electrodes for biopotential measurements

BCB contact printing for patterned adhesive full-wafer bonded 0-level packages

Characterization of micromachined spiked biopotential electrodes

Mechanically tri-stable, true single-pole-double-throw (SPDT) switches

High-Yield Passive Plasma Filtration from Human Finger Prick Blood

Wafer-Scale Manufacturing of Bulk Shape-Memory-Alloy Microactuators Based on Adhesive Bonding of Titanium-Nickel Sheets to Structured Silicon Wafers

Heterogeneous 3D integration of 17 μm pitch Si SiGe quantum well bolometer arrays for infrared imaging systems

An Autonomous Microfluidic Device for Generating Volume-Defined Dried Plasma Spots

Arrays of monocrystalline silicon micromirrors fabricated using CMOS compatible transfer bonding

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