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Si-Based Hybrid Microcooler With Multiple Drainage Microtrenches for High Heat Flux Cooling

IEEE transactions on components, packaging, and manufacturing technology (2011), 2017-01, Vol.7 (1), p.50-57

2017

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Au-In-based Hermetic Sealing for MEMS Packaging for Down-Hole Application

Journal of electronic materials, 2014-07, Vol.43 (7), p.2498-2509

2014

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Cyanate Ester-Based Encapsulation Material for High-Temperature Applications

Journal of electronic materials, 2013-09, Vol.42 (9), p.2803-2812

2013

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Effect of surface treatment on adhesion strength between magnetron sputtered copper thin films and alumina substrate

Applied surface science, 2015-11, Vol.355, p.509-515

2015

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Development of a Compact and Efficient Liquid Cooling System With Silicon Microcooler for High-Power Microelectronic Devices

IEEE transactions on components, packaging, and manufacturing technology (2011), 2016-05, Vol.6 (5), p.729-739

2016

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Numerical Analysis of Narrow-gap Underfill Flow in the Flip-chip Process Using the Lattice Boltzmann Method

IMAPSource Proceedings, 2024-02, Vol.2023 (Symposium)

2024

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Curekinetic Modeling of Interfacial Reactions between Epoxy and Silica Filler Suspension System in Non-Conductive Paste (NCP) for 3DIC Packaging

2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020, p.2040-2047

Woo Rhee, Daniel Min

2020

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Direct Patterning of Conductive Fine Line in Dielectric Layer for Semiconductor Package

2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC), 2020, p.472-478

2020

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Numerical study of edge condensation in wafer to wafer bonding process with lattice Boltzmann approach

2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020, p.1646-1652

2020

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Modeling and characterization of the thermal performance of advanced packaging materials in the flip-chip BGA and QFN packages

2012 IEEE 14th Electronics Packaging Technology Conference (EPTC), 2012, p.525-532

2012

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Process characterization of highly conductive silver paste die attach materials for thin die on QFN

2012 IEEE 14th Electronics Packaging Technology Conference (EPTC), 2012, p.372-378

2012

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Performance enhancement of Au-Ge eutectic alloys for high-temperature electronics

2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 2013, p.202-207

2013

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Flow modeling of die attach process and the optimization of process parameters in advance packaging

2012 IEEE 14th Electronics Packaging Technology Conference (EPTC), 2012, p.379-383

2012

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Introducing novel film type adhesives into thin wafer handling technology for 3D TSV packaging applications

2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 2013, p.710-713

2013

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Impact of advanced materials on power cycling performance and process dependent stresses of QFN

2012 IEEE 14th Electronics Packaging Technology Conference (EPTC), 2012, p.119-124

2012

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Characterization of thermally conductive underfill materials for high performance flip-chip applications

2012 IEEE 14th Electronics Packaging Technology Conference (EPTC), 2012, p.283-290

2012

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Extreme high pressure and high temperature package development

2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 2013, p.379-383

2013

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A Development of Finite Element Analysis Model of 3DIC TSV Package Warpage Considering Cure Dependent Viscoelasticity with Heat Generation

2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, p.1475-1480

2021

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Novel Characterization Method of Chip Level Hybrid Bonding Strength

2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, p.1754-1760

2021

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Numerical Study of Metal Ink Behavior on the Wettability Pattern for Conductive Line Inkjet-Printing with Lattice Boltzmann Approach

2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, p.1590-1595

2021

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Miniaturized Double Side Cooling Packaging for High Power 3 Phase SiC Inverter Module with Junction Temperature over 220°C

2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2016, p.1190-1196

2016

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Thermal management solutions and design guidelines for silicon based photonic integrated modules

2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), 2015, p.1-6

2015

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Thermal modeling and characterization of SiC power module under both air cooling and liquid cooling conditions

2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 2014, p.618-623

2014

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Process development of multi-die stacking using 20 um pitch micro bumps on large scale dies

2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 2014, p.318-321

2014

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Study on power cycling reliability of power module with single metal layer flexible substrate by finite element analysis

2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), 2015, p.1-7

2015

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Si-Based Hybrid Microcooler With Multiple Drainage Microtrenches for High Heat Flux Cooling

Au-In-based Hermetic Sealing for MEMS Packaging for Down-Hole Application

Cyanate Ester-Based Encapsulation Material for High-Temperature Applications

Effect of surface treatment on adhesion strength between magnetron sputtered copper thin films and alumina substrate

Development of a Compact and Efficient Liquid Cooling System With Silicon Microcooler for High-Power Microelectronic Devices

Numerical Analysis of Narrow-gap Underfill Flow in the Flip-chip Process Using the Lattice Boltzmann Method

Curekinetic Modeling of Interfacial Reactions between Epoxy and Silica Filler Suspension System in Non-Conductive Paste (NCP) for 3DIC Packaging

Direct Patterning of Conductive Fine Line in Dielectric Layer for Semiconductor Package

Numerical study of edge condensation in wafer to wafer bonding process with lattice Boltzmann approach

Modeling and characterization of the thermal performance of advanced packaging materials in the flip-chip BGA and QFN packages

Process characterization of highly conductive silver paste die attach materials for thin die on QFN

Performance enhancement of Au-Ge eutectic alloys for high-temperature electronics

Flow modeling of die attach process and the optimization of process parameters in advance packaging

Introducing novel film type adhesives into thin wafer handling technology for 3D TSV packaging applications

Impact of advanced materials on power cycling performance and process dependent stresses of QFN

Characterization of thermally conductive underfill materials for high performance flip-chip applications

Extreme high pressure and high temperature package development

A Development of Finite Element Analysis Model of 3DIC TSV Package Warpage Considering Cure Dependent Viscoelasticity with Heat Generation

Novel Characterization Method of Chip Level Hybrid Bonding Strength

Numerical Study of Metal Ink Behavior on the Wettability Pattern for Conductive Line Inkjet-Printing with Lattice Boltzmann Approach

Miniaturized Double Side Cooling Packaging for High Power 3 Phase SiC Inverter Module with Junction Temperature over 220°C

Thermal management solutions and design guidelines for silicon based photonic integrated modules

Thermal modeling and characterization of SiC power module under both air cooling and liquid cooling conditions

Process development of multi-die stacking using 20 um pitch micro bumps on large scale dies

Study on power cycling reliability of power module with single metal layer flexible substrate by finite element analysis

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