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Journal of applied physics, 2019-08, Vol.126 (5)
2019
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IEEE transactions on electron devices, 2019-12, Vol.66 (12), p.5278-5283
2019
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IEEE transactions on components, packaging, and manufacturing technology (2011), 2016-04, Vol.6 (4), p.653-662
2016
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IEEE transactions on electron devices, 2020-12, Vol.67 (12), p.5349-5354
- Gupta, Anshul
- Pedreira, Olalla Varela
- Arutchelvan, Goutham
- Zahedmanesh, Houman
- Devriendt, Katia
- Mertens, Hans
- Tao, Zheng
- Ritzenthaler, Romain
- Wang, Shouhua
- Radisic, Dunja
- Kenis, Karine
- Teugels, Lieve
- Sebai, Farid
- Lorant, Christophe
- Jourdan, Nicolas
- Chan, Boon Teik
- Subramanian, Sujith
- Schleicher, Filip
- Hopf, Toby
- Peter, Antony Premkumar
- Rassoul, Nouredine
- Debruyn, Haroen
- Demonie, Ingrid
- Siew, Yong Kong
- Chiarella, Thomas
- Briggs, Basoene
- Zhou, Xiuju
- Rosseel, Erik
- De Keersgieter, An
- Capogreco, Elena
- Litta, Eugenio Dentoni
- Boccardi, Guillaume
- Baudot, Sylvain
- Mannaert, Geert
- Bontemps, Noemie
- Sepulveda, A.
- Mertens, Sofie
- Kim, Min-Soo
- Dupuy, Emmanuel
- Vandersmissen, Kevin
- Paolillo, Sara
- Yakimets, Dmitry
- Chehab, Bilal
- Favia, Paola
- Drijbooms, Christel
- Cousserier, Joris
- Jaysankar, Manoj
- Lazzarino, Frederic
- Morin, Pierre
- Altamirano, Efrain
- Mitard, Jerome
- Wilson, Christopher J.
- Holsteyns, Frank
- Boemmels, Juergen
- Demuynck, Steven
- Tokei, Zsolt
- Horiguchi, Naoto
2020
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Journal of microelectromechanical systems, 2010-02, Vol.19 (1), p.202-214
2010
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Proceedings of the 2023 International Symposium on Physical Design, 2023, p.106-106
2023
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2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), 2016, p.34-36
2016
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ACS applied materials & interfaces, 2016-10, Vol.8 (39), p.26119-26125
- Wen, Liang Gong
- Roussel, Philippe
- Pedreira, Olalla Varela
- Briggs, Basoene
- Groven, Benjamin
- Dutta, Shibesh
- Popovici, Mihaela I
- Heylen, Nancy
- Ciofi, Ivan
- Vanstreels, Kris
- Østerberg, Frederik W
- Hansen, Ole
- Petersen, Dirch H
- Opsomer, Karl
- Detavernie, Christophe
- Wilson, Christopher J
- Elshocht, Sven Van
- Croes, Kristof
- Bömmels, Jürgen
- Tőkei, Zsolt
- Adelmann, Christoph
2016
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2021 IEEE International Reliability Physics Symposium (IRPS), 2021, p.1-6
2021
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Semiconductor science and technology, 2019-07, Vol.34 (7), p.75002
2019
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2023 IEEE International Reliability Physics Symposium (IRPS), 2023, p.1-7
2023
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2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2022, p.1-8
2022
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2019 IEEE International Reliability Physics Symposium (IRPS), 2019, p.1-6
2019
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2013 IEEE 63rd Electronic Components and Technology Conference, 2013, p.586-591
2013
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2018 IEEE International Reliability Physics Symposium (IRPS), 2018, p.6D.7-1-6D.7-9
2018
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2018 IEEE International Interconnect Technology Conference (IITC), 2018, p.4-6
2018
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2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM), 2023, p.1-3
2023
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2021 IEEE International Interconnect Technology Conference (IITC), 2021, p.1-3
2021
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2023 International Electron Devices Meeting (IEDM), 2023, p.1-4
2023
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2020 IEEE International Interconnect Technology Conference (IITC), 2020, p.4-6
2020
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IEEE design and test, 2016-06, Vol.33 (3), p.37-45
2016
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2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 2014, p.613-619
2014
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2022 IEEE International Interconnect Technology Conference (IITC), 2022, p.58-60
2022
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IEEE transactions on device and materials reliability, 2022-09, Vol.22 (3), p.417-423
2022
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IEEE transactions on device and materials reliability, 2017-09, Vol.17 (3), p.549-559
2017
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Kollektion
Zeitschrift / Serie
- Ieee Transactions On Device And Materials Reliability
- Ieee Transactions On Electron Devices
- Acs Applied Materials & Interfaces
- Ieee Design And Test
- Ieee Transactions On Components, Packaging, And Manufacturing Technology
- Journal Of Applied Physics
- Journal Of Microelectromechanical Systems
- Scientific Reports
- Semiconductor Science And Technology