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Developmental psychology, 2021-12, Vol.57 (12), p.2250-2264
2021
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Journal of instrumentation, 2020-06, Vol.15 (6), p.C06063-C06063
2020
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Physical review letters, 2000-06, Vol.84 (23), p.5451-5454
2000
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Journal of composite materials, 2010-12, Vol.44 (25), p.2933-2951
2010
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Journal of composite materials, 2009-08, Vol.43 (17), p.1803-1818
2009
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Microelectronics and reliability, 2013-07, Vol.53 (7), p.1002-1008
2013
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Microelectronic engineering, 2009-10, Vol.86 (10), p.2094-2103
2009
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Metallurgical and materials transactions. A, Physical metallurgy and materials science, 2006-10, Vol.37 (10), p.3085-3097
2006
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Physical review letters, 2021-02, Vol.126 (6), Article 062501
- Hayakawa, S. H.
- Agari, K.
- Ahn, J. K.
- Akaishi, T.
- Akazawa, Y.
- Ashikaga, S.
- Bassalleck, B.
- Bleser, S.
- Ekawa, H.
- Endo, Y.
- Fujikawa, Y.
- Fujioka, N.
- Fujita, M.
- Goto, R.
- Han, Y.
- Hasegawa, S.
- Hashimoto, T.
- Hayakawa, T.
- Hayata, E.
- Hicks, K.
- Hirose, E.
- Hirose, M.
- Honda, R.
- Hoshino, K.
- Hoshino, S.
- Hosomi, K.
- Hwang, S. H.
- Ichikawa, Y.
- Ichikawa, M.
- Imai, K.
- Inaba, K.
- Ishikawa, Y.
- Ito, H.
- Ito, K.
- Jung, W. S.
- Kanatsuki, S.
- Kanauchi, H.
- Kasagi, A.
- Kawai, T.
- Kim, M. H.
- Kim, S. H.
- Kinbara, S.
- Kiuchi, R.
- Kobayashi, H.
- Kobayashi, K.
- Koike, T.
- Koshikawa, A.
- Lee, J. Y.
- Ma, T. L.
- Matsumoto, S. Y.
- Minakawa, M.
- Miwa, K.
- Moe, A. T.
- Moon, T. J.
- Moritsu, M.
- Nagase, Y.
- Nakada, Y.
- Nakagawa, M.
- Nakashima, D.
- Nakazawa, K.
- Nanamura, T.
- Naruki, M.
- Nyaw, A. N. L.
- Ogura, Y.
- Ohashi, M.
- Oue, K.
- Ozawa, S.
- Pochodzalla, J.
- Ryu, S. Y.
- Sako, H.
- Sato, S.
- Sato, Y.
- Schupp, F.
- Shirotori, K.
- Soe, M. M.
- Soe, M. K.
- Sohn, J. Y.
- Sugimura, H.
- Suzuki, K. N.
- Takahashi, H.
- Takahashi, T.
- Takeda, T.
- Tamura, H.
- Tanida, K.
- Theint, A. M. M.
- Tint, K. T.
- Toyama, Y.
- Ukai, M.
- Umezaki, E.
- Watabe, T.
- Watanabe, K.
- Yamamoto, T. O.
- Yang, S. B.
- Yoon, C. S.
- Yoshida, J.
- Yoshimoto, M.
- Zhang, D. H.
- Zhang, Z.
2021
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Journal of materials science. Materials in electronics, 2009-11, Vol.20 (11), p.1144-1149
2009
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Journal of controlled release, 2021-02, Vol.330, p.1095-1105
2021
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IEEE transactions on electron devices, 2004-12, Vol.51 (12), p.1984-1988
2004
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The Journal of early adolescence, 2024-06, Vol.44 (6), p.732-761
2024
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Metallurgical and materials transactions. A, Physical metallurgy and materials science, 2003-05, Vol.34 (5), p.1113-1125
2003
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Applied physics letters, 2006-05, Vol.88 (20), p.202102-202102-3
2006
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Journal of crystal growth, 2003-07, Vol.254 (3-4), p.443-448
2003
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Journal of crystal growth, 2003-05, Vol.252 (4), p.565-569
2003
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Physical review letters, 2023-05, Vol.130 (18)
- Aihara, H.
- Atmacan, H.
- Aushev, T.
- Ayad, R.
- Babu, V.
- Bahinipati, S.
- Behera, P.
- Bessner, M.
- Bhuyan, B.
- Bilka, T.
- Borah, J.
- Bozek, A.
- Bračko, M.
- Branchini, P.
- Budano, A.
- Chekelian, V.
- Cheon, B. G.
- Choi, Y.
- Czank, T.
- Das, S.
- De Nardo, G.
- De Pietro, G.
- Di Capua, F.
- Doležal, Z.
- Dong, T. V.
- Ferber, T.
- Garg, R.
- Gaur, V.
- Gabyshev, N.
- Giri, A.
- Goldenzweig, P.
- Graziani, E.
- Gu, T.
- Gudkova, K.
- Halder, S.
- Hayashii, H.
- Iwasaki, M.
- Jacobs, W. W.
- Jia, S.
- Kaliyar, A. B.
- Kim, C. H.
- Kinoshita, K.
- Kodyš, P.
- Kovalenko, E.
- Križan, P.
- Krokovny, P.
- Kumar, M.
- Kumara, K.
- Lam, T.
- Laurenza, M.
- Levit, D.
- Lieret, K.
- Masuda, M.
- Mizuk, R.
- Mohanty, G. B.
- Mrvar, M.
- Nayak, L.
- Nisar, N. K.
- Nishida, S.
- Ogawa, S.
- Pakhlova, G.
- Pardi, S.
- Park, S. -H.
- Passeri, A.
- Pedlar, T. K.
- Pestotnik, R.
- Piilonen, L. E.
- Podobnik, T.
- Rostomyan, A.
- Rout, N.
- Russo, G.
- Sakai, Y.
- Sandilya, S.
- Sangal, A.
- Santelj, L.
- Savinov, V.
- Seino, Y.
- Shen, C. P.
- Shiu, J. -G.
- Sokolov, A.
- Solovieva, E.
- Sumihama, M.
- Sumisawa, K.
- Sutcliffe, W.
- Tanida, K.
- Tenchini, F.
- Uglov, T.
- Unno, Y.
- Uno, K.
- Uno, S.
- Urquijo, P.
- van Tonder, R.
- Vinokurova, A.
- Waheed, E.
- Wang, C. H.
- Wang, X. L.
- Yabsley, B. D.
- Yang, S. B.
- Zhilich, V.
- Zhukova, V.
2023
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IEEE transactions on electronics packaging manufacturing, 2009-07, Vol.32 (3), p.176-184
2009
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Applied physics letters, 2006-06, Vol.88 (23)
2006
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Physical review letters, 2020-03, Vol.124 (12), p.122001-122001
- Adachi, I
- Aihara, H
- Aushev, T
- Badhrees, I
- Bhardwaj, V
- Bhuyan, B
- Bobrov, A
- Bračko, M
- Chen, A
- Chilikin, K
- Cho, H E
- Cho, K
- Choi, S-K
- Choudhury, S
- Cunliffe, S
- Doležal, Z
- Dong, T V
- Eidelman, S
- Epifanov, D
- Garg, R
- Gaur, V
- Gabyshev, N
- Garmash, A
- Giri, A
- Golob, B
- Grzymkowska, O
- Hayasaka, K
- Hou, W-S
- Inami, K
- Iwasaki, M
- Iwasaki, Y
- Joffe, D
- Joo, K K
- Karyan, G
- Kim, D Y
- Kim, K T
- Kinoshita, K
- Kodyš, P
- Korpar, S
- Križan, P
- Kuhr, T
- Lee, S C
- Lewis, P
- Li Gioi, L
- Lieret, K
- MacQueen, C
- Masuda, M
- Matvienko, D
- Merola, M
- Miyabayashi, K
- Miyata, H
- Mizuk, R
- Mohanty, G B
- Mussa, R
- Nakano, T
- Nishida, S
- Ono, H
- Oskin, P
- Pakhlov, P
- Pakhlova, G
- Pang, T
- Pardi, S
- Park, C W
- Park, H
- Park, S-H
- Paul, S
- Pedlar, T K
- Piilonen, L E
- Ritter, M
- Rostomyan, A
- Rout, N
- Russo, G
- Schneider, O
- Schwanda, C
- Seino, Y
- Senyo, K
- Shiu, J-G
- Solovieva, E
- Starič, M
- Stottler, Z S
- Takizawa, M
- Tamponi, U
- Tanida, K
- Trabelsi, K
- Uchida, M
- Uehara, S
- Uglov, T
- Unno, Y
- Urquijo, P
- Van Tonder, R
- Varner, G
- Vossen, A
- Wang, C H
- Wang, X L
- Yang, S B
- Yelton, J
- Yuan, C Z
- Yusa, Y
- Zhilich, V
- Zhukova, V
2020
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Biophysical journal, 2001-08, Vol.81 (2), p.767-784
2001
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Progress of theoretical and experimental physics, 2019-02, Vol.2019 (2)
- Ekawa, H
- Agari, K
- Akaishi, T
- Akazawa, Y
- Ashikaga, S
- Bassalleck, B
- Bleser, S
- Endo, Y
- Fujikawa, Y
- Fujioka, N
- Fujita, M
- Goto, R
- Han, Y
- Hasegawa, S
- Hashimoto, T
- Hayakawa, S H
- Hayakawa, T
- Hayata, E
- Hicks, K
- Hirose, E
- Hirose, M
- Honda, R
- Hoshino, K
- Hoshino, S
- Hosomi, K
- Hwang, S H
- Ichikawa, M
- Ieiri, M
- Imai, K
- Inaba, K
- Ishikawa, Y
- Iskendir, A
- Ito, H
- Ito, K
- Jung, W S
- Kanatsuki, S
- Kanauchi, H
- Kasagi, A
- Kawai, T
- Kim, M H
- Kim, S H
- Kinbara, S
- Kiuchi, R
- Kobayashi, H
- Kobayashi, K
- Koike, T
- Koshikawa, A
- Lee, J Y
- Lee, J W
- Ma, T L
- Matsumoto, S Y
- Minakawa, M
- Miwa, K
- Moe, A T
- Moon, T J
- Moritsu, M
- Nagase, Y
- Nakada, Y
- Nakagawa, M
- Nakashima, D
- Nakazawa, K
- Nanamura, T
- Naruki, M
- Nyaw, A N L
- Ogura, Y
- Ohashi, M
- Oue, K
- Ozawa, S
- Pochodzalla, J
- Ryu, S Y
- Sako, H
- Sasaki, Y
- Sato, S
- Sato, Y
- Schupp, F
- Shirotori, K
- Soe, M M
- Soe, M K
- Sohn, J Y
- Sugimura, H
- Suzuki, K N
- Takahashi, H
- Takahashi, T
- Takahashi, Y
- Tamura, H
- Tanida, K
- Theint, A M M
- Tint, K T
- Toyama, Y
- Ukai, M
- Umezaki, E
- Watabe, T
- Watanabe, K
- Yamamoto, T O
- Yang, S B
- Yoon, C S
- Yoshida, J
- Yoshimoto, M
- Zhang, D H
- Zhang, Z
2019
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Microelectronic engineering, 2008-09, Vol.85 (9), p.1851-1857
2008
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IEEE transactions on electronics packaging manufacturing, 2009-07, Vol.32 (3), p.157-163
2009
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