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The Effect of Electrothermal Nonuniformities on Parallel Connected SiC Power Devices Under Unclamped and Clamped Inductive Switching

IEEE transactions on power electronics, 2016-06, Vol.31 (6), p.4526-4535, Article 4526

2016

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High-Temperature Electrical and Thermal Aging Performance and Application Considerations for SiC Power DMOSFETs

IEEE transactions on power electronics, 2017-10, Vol.32 (10), p.7967-7979

2017

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A Fast Loss and Temperature Simulation Method for Power Converters, Part II: 3-D Thermal Model of Power Module

IEEE transactions on power electronics, 2012-01, Vol.27 (1), p.258-268

2012

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An Investigation of Temperature-Sensitive Electrical Parameters for SiC Power MOSFETs

IEEE transactions on power electronics, 2017-10, Vol.32 (10), p.7954-7966

2017

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Epitaxial trench refill of 4H-SiC by chlorinated chemistry

Applied physics letters, 2024-05, Vol.124 (19)

2024

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Power module with large short-term current capability by using phase change material

Journal of engineering (Stevenage, England), 2019-03, Vol.2019 (16), p.3225-3229

2019

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Improved Electrothermal Ruggedness in SiC MOSFETs Compared With Silicon IGBTs

IEEE transactions on electron devices, 2014-07, Vol.61 (7), p.2278-2286

2014

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Distributed Thermal Monitoring of Wind Turbine Power Electronic Modules Using FBG Sensing Technology

IEEE sensors journal, 2020-09, Vol.20 (17), p.9886-9894

2020

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Analysis of Linear-Doped Si/SiC Power LDMOSFETs Based on Device Simulation

IEEE transactions on electron devices, 2016-06, Vol.63 (6), p.2442-2448

2016

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In Situ Contact Pressure Monitoring of Press Pack Power Module Using FBG Sensors

IEEE transactions on instrumentation and measurement, 2022, Vol.71, p.1-11

2022

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Quasi-Distributed Temperature Detection of Press-Pack IGBT Power Module Using FBG Sensing

IEEE journal of emerging and selected topics in power electronics, 2022-10, Vol.10 (5), p.4981-4992

2022

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The Potential of SiC Cascode JFETs in Electric Vehicle Traction Inverters

IEEE transactions on transportation electrification, 2019-12, Vol.5 (4), p.1349-1359

2019

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Evaluation of SiC Schottky Diodes Using Pressure Contacts

IEEE transactions on industrial electronics (1982), 2017-10, Vol.64 (10), p.8213-8223

2017

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A Fast Loss and Temperature Simulation Method for Power Converters, Part I: Electrothermal Modeling and Validation

IEEE transactions on power electronics, 2012-01, Vol.27 (1), p.248-257

2012

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Compact Electrothermal Reliability Modeling and Experimental Characterization of Bipolar Latchup in SiC and CoolMOS Power MOSFETs

IEEE transactions on power electronics, 2015-12, Vol.30 (12), p.6978-6992

2015

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Heteroepitaxial Beta-Ga2O3 on 4H-SiC for an FET With Reduced Self Heating

IEEE journal of the Electron Devices Society, 2017-07, Vol.5 (4), p.256-261

2017

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Functional oxide as an extreme high-k dielectric towards 4H-SiC MOSFET incorporation

2016 European Conference on Silicon Carbide & Related Materials (ECSCRM), 2017-05, Vol.897, p.1-1

2017

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Improved Performance of 4H-SiC PiN Diodes Using a Novel Combined High Temperature Oxidation and Annealing Process

IEEE transactions on semiconductor manufacturing, 2014-08, Vol.27 (3), p.443-451

2014

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Characteristics and aging of SiC MOSFETs operated at very high temperatures

MRS proceedings, 2014, Vol.1693 (1), p.113-118, Article mrss14-1693-dd03-03

2014

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Fast 3D thermal simulation of power module packaging

International journal of numerical modelling, 2012-07, Vol.25 (4), p.378-399

2012

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Monitoring Power Module Solder Degradation From Heat Dissipation in Two Opposite Directions

IEEE transactions on power electronics, 2022-08, Vol.37 (8), p.9754-9766

2022

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Heat-Flux-Based Condition Monitoring of Multichip Power Modules Using a Two-Stage Neural Network

IEEE transactions on power electronics, 2021-07, Vol.36 (7), p.7489-7500

2021

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A Power Module for Grid Inverter With In-Built Short-Circuit Fault Current Capability

IEEE transactions on power electronics, 2020-10, Vol.35 (10), p.10567-10579

2020

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Compact Trench Floating Field Rings Termination for 10kV+ Rated SiC n-IGBTs

Materials science forum, 2022-05, Vol.1062, p.598-602

2022

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Novel Method for Evaluation of Negative Bias Temperature Instability of SiC MOSFETs

Materials science forum, 2019-07, Vol.963, p.749-752

2019

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The Effect of Electrothermal Nonuniformities on Parallel Connected SiC Power Devices Under Unclamped and Clamped Inductive Switching

High-Temperature Electrical and Thermal Aging Performance and Application Considerations for SiC Power DMOSFETs

A Fast Loss and Temperature Simulation Method for Power Converters, Part II: 3-D Thermal Model of Power Module

An Investigation of Temperature-Sensitive Electrical Parameters for SiC Power MOSFETs

Epitaxial trench refill of 4H-SiC by chlorinated chemistry

Power module with large short-term current capability by using phase change material

Improved Electrothermal Ruggedness in SiC MOSFETs Compared With Silicon IGBTs

Distributed Thermal Monitoring of Wind Turbine Power Electronic Modules Using FBG Sensing Technology

Analysis of Linear-Doped Si/SiC Power LDMOSFETs Based on Device Simulation

In Situ Contact Pressure Monitoring of Press Pack Power Module Using FBG Sensors

Quasi-Distributed Temperature Detection of Press-Pack IGBT Power Module Using FBG Sensing

The Potential of SiC Cascode JFETs in Electric Vehicle Traction Inverters

Evaluation of SiC Schottky Diodes Using Pressure Contacts

A Fast Loss and Temperature Simulation Method for Power Converters, Part I: Electrothermal Modeling and Validation

Compact Electrothermal Reliability Modeling and Experimental Characterization of Bipolar Latchup in SiC and CoolMOS Power MOSFETs

Heteroepitaxial Beta-Ga2O3 on 4H-SiC for an FET With Reduced Self Heating

Functional oxide as an extreme high-k dielectric towards 4H-SiC MOSFET incorporation

Improved Performance of 4H-SiC PiN Diodes Using a Novel Combined High Temperature Oxidation and Annealing Process

Characteristics and aging of SiC MOSFETs operated at very high temperatures

Fast 3D thermal simulation of power module packaging

Monitoring Power Module Solder Degradation From Heat Dissipation in Two Opposite Directions

Heat-Flux-Based Condition Monitoring of Multichip Power Modules Using a Two-Stage Neural Network

A Power Module for Grid Inverter With In-Built Short-Circuit Fault Current Capability

Compact Trench Floating Field Rings Termination for 10kV+ Rated SiC n-IGBTs

Novel Method for Evaluation of Negative Bias Temperature Instability of SiC MOSFETs

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