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Effect of alloying and cladding on the failure of silver metallization under high temperature and current stressing

Applied physics letters, 2005-10, Vol.87 (17), p.172111-172111-3

2005

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Current-Density Dependence on Ag eFUSEs With TiN Underlayers

IEEE electron device letters, 2009-11, Vol.30 (11), p.1134-1136

2009

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Failure mechanisms of pure silver, pure aluminum and silver–aluminum alloy under high current stress

Microelectronics and reliability, 2006-12, Vol.46 (12), p.2096-2103

2006

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Failure mechanisms of silver and aluminum on titanium nitride under high current stress

Thin solid films, 2005-03, Vol.474 (1-2), p.235-244

2005

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Drug complexation, in vitro release and cellular entry of dendrimers and hyperbranched polymers

International journal of pharmaceutics, 2003-06, Vol.259 (1), p.143-160

2003

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Smart Techniques for a Smarter Planet: Towards Smarter Algorithms

1st ed. 2019., 2019

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The strength of BEOL structures fabricated using low K materials and its impact on CPI failures

2015 IEEE International Integrated Reliability Workshop (IIRW), 2015, p.115-118

2015

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Evaluation of diffusion barrier and electrical properties of tantalum oxynitride thin films for silver metallization

Thin solid films, 2004-06, Vol.457 (2), p.338-345

2004

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Formation and characterization of silicon films on flexible polymer substrates

Materials letters, 2005-04, Vol.59 (8), p.872-875

2005

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Effectiveness of reactive sputter-deposited Ta–N films as diffusion barriers for Ag metallization

Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, 2004-09, Vol.22 (5), p.2345-2352

2004

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Value-Based Payment for Clinicians Treating Cardiovascular Disease: A Policy Statement From the American Heart Association

Circulation (New York, N.Y.), 2023-08, Vol.148 (6), p.543-563

2023

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Percolative approach for failure time prediction of thin film interconnects under high current stress

Microelectronics and reliability, 2005-02, Vol.45 (2), p.391-395

2005

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A nondestructive approach to predict the failure time of thin-film interconnects under high-stress current

IEEE electron device letters, 2004-01, Vol.25 (1), p.19-21

2004

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Influence of Joule heating during electromigration evaluation of silver lines

Thin solid films, 2009, Vol.517 (5), p.1833-1836

2009

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Minimally manipulated autologous adherent bone marrow cells （ABMCs）：a promising cell therapy of spinal cord injury

中国神经再生研究：英文版, 2015, Vol.10 (7), p.1058-1060

Kamana Misra Hatem E. Sabaawy

2015

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Bayesian Statistics and Marketing

2, 2024

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The projection of the incidence of dielectric cracking during chip joining with lead free solder bumps

2016 IEEE International Reliability Physics Symposium (IRPS), 2016, p.6B-4-1-6B-4-6

2016

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Pakistan's Stability Paradox: Domestic, regional and international dimensions

1, 2012

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Nonlinear time series analysis of the light curves from the black hole system GRS1915+105

Research in astronomy and astrophysics, 2011-01, Vol.11 (1), p.71-90

2011

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The Implications of Interdiction at Sea: for Refugees, Canada and Canadians

Refuge (Toronto. English edition), 1988-03, Vol.7 (3), p.4-8

Misra, Gail E.

1988

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FBEOL no-aluminum pad integration in Pb-free C4 products for environmental, cost and reliability benefits

2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 2014, p.1949-1954

2014

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Effect of recycling on the properties of poly(ethylene terephthalate) films

Polymer international, 2000-12, Vol.49 (12), p.1636-1640

2000

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C4 EM and CPI Reliability Benefits and Process Challenges of FBEOL Integration Changes Implemented in Lead-free C4 Products

International Symposium on Microelectronics, 2015-10, Vol.2015 (1), p.787-792

2015

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Role of FBEOL Al pads and hard dielectric for improved mechanical performance in lead-free C4 products

2013 IEEE 63rd Electronic Components and Technology Conference, 2013, p.2208-2213

2013

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Novel design and integration enhancements in the final polymeric passivation for improved mechanical performance and C4 electromigration in lead-free C4 products

2012 IEEE 62nd Electronic Components and Technology Conference, 2012, p.571-576

2012

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Effect of alloying and cladding on the failure of silver metallization under high temperature and current stressing

Current-Density Dependence on Ag eFUSEs With TiN Underlayers

Failure mechanisms of pure silver, pure aluminum and silver–aluminum alloy under high current stress

Failure mechanisms of silver and aluminum on titanium nitride under high current stress

Drug complexation, in vitro release and cellular entry of dendrimers and hyperbranched polymers

Smart Techniques for a Smarter Planet: Towards Smarter Algorithms

The strength of BEOL structures fabricated using low K materials and its impact on CPI failures

Evaluation of diffusion barrier and electrical properties of tantalum oxynitride thin films for silver metallization

Formation and characterization of silicon films on flexible polymer substrates

Effectiveness of reactive sputter-deposited Ta–N films as diffusion barriers for Ag metallization

Value-Based Payment for Clinicians Treating Cardiovascular Disease: A Policy Statement From the American Heart Association

Percolative approach for failure time prediction of thin film interconnects under high current stress

A nondestructive approach to predict the failure time of thin-film interconnects under high-stress current

Influence of Joule heating during electromigration evaluation of silver lines

Minimally manipulated autologous adherent bone marrow cells （ABMCs）：a promising cell therapy of spinal cord injury

Bayesian Statistics and Marketing

The projection of the incidence of dielectric cracking during chip joining with lead free solder bumps

Pakistan's Stability Paradox: Domestic, regional and international dimensions

Nonlinear time series analysis of the light curves from the black hole system GRS1915+105

The Implications of Interdiction at Sea: for Refugees, Canada and Canadians

FBEOL no-aluminum pad integration in Pb-free C4 products for environmental, cost and reliability benefits

Effect of recycling on the properties of poly(ethylene terephthalate) films

C4 EM and CPI Reliability Benefits and Process Challenges of FBEOL Integration Changes Implemented in Lead-free C4 Products

Role of FBEOL Al pads and hard dielectric for improved mechanical performance in lead-free C4 products

Novel design and integration enhancements in the final polymeric passivation for improved mechanical performance and C4 electromigration in lead-free C4 products

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