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Identification and characterization of TLR7, TLR8a2, TLR8b1 and TLR8b2 genes in Atlantic salmon (Salmo salar)

Developmental and comparative immunology, 2013-10, Vol.41 (2), p.295-305

2013

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High-temperature stability of Au/Pd/Cu and Au/Pd(P)/Cu surface finishes

Applied surface science, 2018-03, Vol.434, p.1353-1360

2018

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Analysis of the direct causes of death in patients with acute stemi treated with primary PCI from 2005 to 2014

Atherosclerosis, 2016-09, Vol.252, p.e16-e17

2016

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IMC microstructure modification and mechanical reinforcement of Sn–Ag–Cu/Cu microelectronic joints through an advanced surface finish technique

Journal of materials research and technology, 2021-03, Vol.11, p.1895-1910

2021

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Artifact-free microstructures of the Cu–In reaction by using cryogenic broad argon beam ion polishing

Journal of materials research and technology, 2020-11, Vol.9 (6), p.12946-12954

2020

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Significant improvement of the thermal stability and electrochemical corrosion resistance of the Au/Pd surface finish through catalytic modification

Corrosion science, 2019-01, Vol.146, p.112-120

2019

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Small-Subthreshold-Swing and Low-Voltage Flexible Organic Thin-Film Transistors Which Use HfLaO as the Gate Dielectric

IEEE electron device letters, 2009-02, Vol.30 (2), p.133-135

2009

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Low Subthreshold Swing HfLaO/Pentacene Organic Thin-Film Transistors

IEEE electron device letters, 2008-03, Vol.29 (3), p.215-217

2008

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Low-Threshold-Voltage MoN/HfAlO/SiON p-MOSFETs With 0.85-nm EOT

IEEE electron device letters, 2009-08, Vol.30 (8), p.861-863

2009

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Lithographic tuning of a two-dimensional photonic crystal laser array

IEEE photonics technology letters, 2000-09, Vol.12 (9), p.1126-1128

2000

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Selective electrochemical detection of thiol biomarkers in saliva using multiwalled carbon nanotube screen-printed electrodes

Sensors and actuators. B, Chemical, 2015-03, Vol.209, p.983-988

2015

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Electrochemical Detection of NADH, Cysteine, or Glutathione Using a Caffeic Acid Modified Glassy Carbon Electrode

Electroanalysis (New York, N.Y.), 2013-07, Vol.25 (7), p.1613-1620

2013

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Serial Changes in Knee Muscle Strength After Anterior Cruciate Ligament Reconstruction Using Hamstring Tendon Autografts

Arthroscopy, 2015-05, Vol.31 (5), p.890-895

2015

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Identification and characterisation of TLR18-21 genes in Atlantic salmon (Salmo salar)

Fish & shellfish immunology, 2014-12, Vol.41 (2), p.549-559

2014

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Phylogeny and expression analysis of C-reactive protein (CRP) and serum amyloid-P (SAP) like genes reveal two distinct groups in fish

Fish & shellfish immunology, 2017-06, Vol.65, p.42-51

2017

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High-speed Cu electrodeposition and its solderability

Surface & coatings technology, 2017-06, Vol.320, p.559-567

2017

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TEM investigation of interfacial microstructure and fracture mode of the Sn-Ag-Cu/Ni joint system

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2017-10, Vol.706, p.269-278

2017

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Interfacial reaction and mechanical reliability between Sn-3Ag-0.5Cu alloy and ultrathin-Ni(P)-type Au/Pd(P)/Ni(P)/Cu metallization pad

Surface & coatings technology, 2019-02, Vol.359, p.374-383

2019

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Comparative study between Au/Pd/Cu and Au/Pd(P)/Cu films in soldering applications

Surface & coatings technology, 2016-10, Vol.303, p.103-111

2016

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Quadriceps Strength and Endurance After Posterior Cruciate Ligament Tears Versus Matched Group With Anterior Cruciate Ligament Tears

Arthroscopy, 2015-06, Vol.31 (6), p.1097-1101

2015

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TEM characterization of Cu self-annealing and direct proof of pinhole formation mechanism in a Cu film

Surface & coatings technology, 2018-09, Vol.350, p.1010-1019

2018

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Reaction of Au/Pd/Cu and Au/Pd/Au/Cu multilayers with Sn-Ag-Cu alloy

Surface & coatings technology, 2019-01, Vol.358, p.753-761

2019

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Real-time study of electromigration in Sn Blech structure

Applied surface science, 2016-12, Vol.388, p.339-344

2016

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Effect of Pd(P) thickness on the soldering reaction between Sn–3Ag–0.5Cu alloy and ultrathin-Ni(P)-type Au/Pd(P)/Ni(P)/Cu metallization pad

Thin solid films, 2015-06, Vol.584, p.257-264

2015

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Study on Preparation of Flexible Semiconductor Electrode for Dye-sensitized Solar Cells by EPD

Manufacturing Science and Technology, 2015-12, Vol.3 (4), p.170-176

2015

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Identification and characterization of TLR7, TLR8a2, TLR8b1 and TLR8b2 genes in Atlantic salmon (Salmo salar)

High-temperature stability of Au/Pd/Cu and Au/Pd(P)/Cu surface finishes

Analysis of the direct causes of death in patients with acute stemi treated with primary PCI from 2005 to 2014

IMC microstructure modification and mechanical reinforcement of Sn–Ag–Cu/Cu microelectronic joints through an advanced surface finish technique

Artifact-free microstructures of the Cu–In reaction by using cryogenic broad argon beam ion polishing

Significant improvement of the thermal stability and electrochemical corrosion resistance of the Au/Pd surface finish through catalytic modification

Small-Subthreshold-Swing and Low-Voltage Flexible Organic Thin-Film Transistors Which Use HfLaO as the Gate Dielectric

Low Subthreshold Swing HfLaO/Pentacene Organic Thin-Film Transistors

Low-Threshold-Voltage MoN/HfAlO/SiON p-MOSFETs With 0.85-nm EOT

Lithographic tuning of a two-dimensional photonic crystal laser array

Selective electrochemical detection of thiol biomarkers in saliva using multiwalled carbon nanotube screen-printed electrodes

Electrochemical Detection of NADH, Cysteine, or Glutathione Using a Caffeic Acid Modified Glassy Carbon Electrode

Serial Changes in Knee Muscle Strength After Anterior Cruciate Ligament Reconstruction Using Hamstring Tendon Autografts

Identification and characterisation of TLR18-21 genes in Atlantic salmon (Salmo salar)

Phylogeny and expression analysis of C-reactive protein (CRP) and serum amyloid-P (SAP) like genes reveal two distinct groups in fish

High-speed Cu electrodeposition and its solderability

TEM investigation of interfacial microstructure and fracture mode of the Sn-Ag-Cu/Ni joint system

Interfacial reaction and mechanical reliability between Sn-3Ag-0.5Cu alloy and ultrathin-Ni(P)-type Au/Pd(P)/Ni(P)/Cu metallization pad

Comparative study between Au/Pd/Cu and Au/Pd(P)/Cu films in soldering applications

Quadriceps Strength and Endurance After Posterior Cruciate Ligament Tears Versus Matched Group With Anterior Cruciate Ligament Tears

TEM characterization of Cu self-annealing and direct proof of pinhole formation mechanism in a Cu film

Reaction of Au/Pd/Cu and Au/Pd/Au/Cu multilayers with Sn-Ag-Cu alloy

Real-time study of electromigration in Sn Blech structure

Effect of Pd(P) thickness on the soldering reaction between Sn–3Ag–0.5Cu alloy and ultrathin-Ni(P)-type Au/Pd(P)/Ni(P)/Cu metallization pad

Study on Preparation of Flexible Semiconductor Electrode for Dye-sensitized Solar Cells by EPD

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