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Journal of materials science, 2011-06, Vol.46 (11), p.3868-3882
2011
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Journal of micromechanics and microengineering, 2010-04, Vol.20 (4), p.045032-045032
2010
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Journal of applied physics, 2014-05, Vol.115 (18)
2014
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Progress in photovoltaics, 2012-09, Vol.20 (6), p.770-784
- Dross, Frederic
- Baert, Kris
- Bearda, Twan
- Deckers, Jan
- Depauw, Valerie
- El Daif, Ounsi
- Gordon, Ivan
- Gougam, Adel
- Govaerts, Jonathan
- Granata, Stefano
- Labie, Riet
- Loozen, Xavier
- Martini, Roberto
- Masolin, Alex
- O'Sullivan, Barry
- Qiu, Yu
- Vaes, Jan
- Van Gestel, Dries
- Van Hoeymissen, Jan
- Vanleenhove, Anja
- Van Nieuwenhuysen, Kris
- Venkatachalam, Srisaran
- Meuris, Marc
- Poortmans, Jef
2012
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Intermetallics, 2007-03, Vol.15 (3), p.396-403
2007
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Biosensors & bioelectronics, 2022-12, Vol.217, p.114663-114663, Article 114663
- Stakenborg, Tim
- Raymenants, Joren
- Taher, Ahmed
- Marchal, Elisabeth
- Verbruggen, Bert
- Roth, Sophie
- Jones, Ben
- Yurt, Abdul
- Duthoo, Wout
- Bombeke, Klaas
- Fauvart, Maarten
- Verplanken, Julien
- Wiederkehr, Rodrigo S
- Humbert, Aurelie
- Dang, Chi
- Vlassaks, Evi
- Jáuregui Uribe, Alejandra L
- Luo, Zhenxiang
- Liu, Chengxun
- Zinoviev, Kirill
- Labie, Riet
- Frederiks, Aduen Darriba
- Saldien, Jelle
- Covens, Kris
- Berden, Pieter
- Schreurs, Bert
- Van Duppen, Joost
- Hanifa, Rabea
- Beuscart, Megane
- Pham, Van
- Emmen, Erik
- Dewagtere, Annelien
- Lin, Ziduo
- Peca, Marco
- El Jerrari, Youssef
- Nawghane, Chinmay
- Arnett, Chad
- Lambrechts, Andy
- Deshpande, Paru
- Lagrou, Katrien
- De Munter, Paul
- André, Emmanuel
- Van den Wijngaert, Nik
- Peumans, Peter
2022
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IEEE journal of solid-state circuits, 2011-01, Vol.46 (1), p.293-307
- Van der Plas, G
- Limaye, P
- Loi, I
- Mercha, A
- Oprins, H
- Torregiani, C
- Thijs, S
- Linten, D
- Stucchi, M
- Katti, G
- Velenis, D
- Cherman, V
- Vandevelde, B
- Simons, V
- De Wolf, I
- Labie, R
- Perry, D
- Bronckers, S
- Minas, N
- Cupac, M
- Ruythooren, W
- Van Olmen, J
- Phommahaxay, A
- de Potter de ten Broeck, M
- Opdebeeck, A
- Rakowski, M
- De Wachter, B
- Dehan, M
- Nelis, M
- Agarwal, R
- Pullini, A
- Angiolini, F
- Benini, L
- Dehaene, W
- Travaly, Y
- Beyne, E
- Marchal, P
2011
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2011 International Reliability Physics Symposium, 2011, p.5F.4.1-5F.4.5
2011
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Energy procedia, 2017, Vol.124, p.862-868
2017
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Microelectronics and reliability, 2017-07, Vol.74, p.131-135
2017
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Energy procedia, 2014, Vol.55, p.649-655
2014
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2012 IEEE 62nd Electronic Components and Technology Conference, 2012, p.331-337
2012
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2008 IEEE International Electron Devices Meeting, 2008, p.1-4
2008
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2010 IEEE International Solid-State Circuits Conference - (ISSCC), 2010, p.148-149
- Van der Plas, G.
- Limaye, P.
- Mercha, A.
- Oprins, H.
- Torregiani, C.
- Thijs, S.
- Linten, D.
- Stucchi, M.
- Guruprasad, K.
- Velenis, D.
- Shinichi, D.
- Cherman, V.
- Vandevelde, B.
- Simons, V.
- De Wolf, I.
- Labie, R.
- Perry, D.
- Bronckers, S.
- Minas, N.
- Cupac, M.
- Ruythooren, W.
- Van Olmen, J.
- Phommahaxay, A.
- de Potter de ten Broeck, M.
- Opdebeeck, A.
- Rakowski, M.
- De Wachter, B.
- Dehan, M.
- Nelis, M.
- Agarwal, R.
- Dehaene, W.
- Travaly, Y.
- Marchal, P.
- Beyne, E.
2010
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IMAPSource Proceedings, 2024-03, Vol.2023 (EMPC)
2024
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Energy procedia, 2014, Vol.55, p.715-723
2014
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 2024, p.678-684
2024
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2008 International Interconnect Technology Conference, 2008, p.19-21
2008
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IEEE journal of photovoltaics, 2013-04, Vol.3 (2), p.684-689
2013
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2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC), 2023, p.1-5
2023
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2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2020, p.1-3
2020
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2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2022, p.1-6
2022
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2012 38th IEEE Photovoltaic Specialists Conference, 2012, p.001833-001836
2012
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2021 Smart Systems Integration (SSI), 2021, p.1-4
2021
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2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2019, p.1-5
2019
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