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(Invited) How to Integrate MEMS on Foundry-Fabricated CMOS Backplanes

ECS transactions, 2017, Vol.80 (4), p.147-155

2017

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Introduction of zirconium oxide in a hardmask concept for highly selective patterning of scaled high aspect ratio trenches in silicon

Thin solid films, 2012-05, Vol.520 (14), p.4527-4531

2012

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Chemically Amplified Main Chain Scission: New Concept to Reduce Line Edge Roughness and Outgassing

Journal of Photopolymer Science and Technology, 2002, Vol.15(4), pp.673-676

2002

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Evaluation of direct patternable inorganic spin-on hard mask materials using electron beam lithography

Microelectronic engineering, 2012-10, Vol.98, p.226-229

2012

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15days electron beam exposure for manufacturing of large area silicon based NIL master

Microelectronic engineering, 2013-10, Vol.110, p.119-122

2013

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15 days electron beam exposure for manufacturing of large area silicon based NIL master

Microelectronic engineering, 2013-10, Vol.110, p.119-122

2013

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Chemically Amplified Main Chain Scission: Chopping the Influence of Polymer Dimensions on Line Edge Roughness

Journal of Photopolymer Science and Technology, 2003, Vol.16(1), pp.13-18

2003

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High Resolution Patterning for Sub 30 nm Technology Nodes Using a Ceramic Based Dual Hard Mask

ECS transactions, 2013, Vol.50 (46), p.21-31

2013

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Recent Advances in the Design of Resist Materials for 157 nm Lithography

Journal of Photopolymer Science and Technology, 2004, Vol.17(4), pp.621-630

2004

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Variable-shaped e-beam lithography enabling process development for future copper damascene technology

Microelectronic engineering, 2011-08, Vol.88 (8), p.1978-1981

2011

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Fast characterization of line end shortening and application of novel correction algorithms in e-beam direct write

Journal of micro/nanolithography, MEMS, and MOEMS, 2011-10, Vol.10 (4), p.43012

Freitag, Martin

2011

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Novel functional materials based on triarylamines–synthesis and application in electroluminescent devices and photorefractive systems

Physical chemistry chemical physics : PCCP, 1999-04, Vol.1 (8), p.1693-1698

1999

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15 days electron beam exposure for manufacturing of large area silicon based NIL master : Nanolithography 2012

Microelectronic engineering, 2013, Vol.110, p.119-122

2013

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High-density capacitors for SiP and SoC applications based on three-dimensional integrated metal-isolator-metal structures

Proceedings of 2013 International Conference on IC Design & Technology (ICICDT), 2013, p.227-230

2013

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Determination of best focus and optimum dose for variable shaped e-beam systems by applying the isofocal dose method

Microelectronic engineering, 2008-05, Vol.85 (5-6), p.778-781

2008

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(Invited) How to Integrate MEMS on Foundry-Fabricated CMOS Backplanes

Meeting abstracts (Electrochemical Society), 2017-09, Vol.MA2017-02 (26), p.1148-1148

2017

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Surface roughness investigation of 157- and 193-nm polymer platforms using different etch conditions

Journal of micro/nanolithography, MEMS, and MOEMS, 2005-10, Vol.4 (4), p.43009

Hohle, Christoph

2005

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Efficient Synthesis of a Multifunctional Dye Conjugate for Photorefractive Applications

Synthesis (Stuttgart), 2002-07, Vol.2002 (9)

2002

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Chemically Amplified Main Chain Scission

Journal of photopolymer science and technology, 2002-08, Vol.15 (4), p.673

2002

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Chemically Amplified Main Chain Scission

Journal of photopolymer science and technology, 2003-01, Vol.16 (1), p.13

2003

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Advanced Dual Hard Mask Patterning Scheme to Enable High Resolution Lithography for sub 30 nm Technology Nodes

Meeting abstracts (Electrochemical Society), 2012-06, Vol.MA2012-02 (39), p.2928-2928

2012

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Scaling and optimization of high-density integrated Si-capacitors

2013 International Semiconductor Conference Dresden - Grenoble (ISCDG), 2013, p.1-4

2013

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Metasurfaces for colour printing

2014 16th International Conference on Transparent Optical Networks (ICTON), 2014, p.1-4

2014

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Efficient Synthesis of a Multifunctional Dye Conjugate for Photorefractive Applications

ChemInform, 2002-10, Vol.33 (40), p.179-179

2002

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Influence of the Charge Transport Characteristics on the Holographic Response of Organic Photorefractive Materials

Molecular crystals and liquid crystals science and technology. Section A, Molecular crystals and liquid crystals, 2001-04, Vol.358 (1), p.15-22

2001

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(Invited) How to Integrate MEMS on Foundry-Fabricated CMOS Backplanes

Introduction of zirconium oxide in a hardmask concept for highly selective patterning of scaled high aspect ratio trenches in silicon

Chemically Amplified Main Chain Scission: New Concept to Reduce Line Edge Roughness and Outgassing

Evaluation of direct patternable inorganic spin-on hard mask materials using electron beam lithography

15days electron beam exposure for manufacturing of large area silicon based NIL master

15 days electron beam exposure for manufacturing of large area silicon based NIL master

Chemically Amplified Main Chain Scission: Chopping the Influence of Polymer Dimensions on Line Edge Roughness

High Resolution Patterning for Sub 30 nm Technology Nodes Using a Ceramic Based Dual Hard Mask

Recent Advances in the Design of Resist Materials for 157 nm Lithography

Variable-shaped e-beam lithography enabling process development for future copper damascene technology

Fast characterization of line end shortening and application of novel correction algorithms in e-beam direct write

Novel functional materials based on triarylamines–synthesis and application in electroluminescent devices and photorefractive systems

15 days electron beam exposure for manufacturing of large area silicon based NIL master : Nanolithography 2012

High-density capacitors for SiP and SoC applications based on three-dimensional integrated metal-isolator-metal structures

Determination of best focus and optimum dose for variable shaped e-beam systems by applying the isofocal dose method

(Invited) How to Integrate MEMS on Foundry-Fabricated CMOS Backplanes

Surface roughness investigation of 157- and 193-nm polymer platforms using different etch conditions

Efficient Synthesis of a Multifunctional Dye Conjugate for Photorefractive Applications

Chemically Amplified Main Chain Scission

Chemically Amplified Main Chain Scission

Advanced Dual Hard Mask Patterning Scheme to Enable High Resolution Lithography for sub 30 nm Technology Nodes

Scaling and optimization of high-density integrated Si-capacitors

Metasurfaces for colour printing

Efficient Synthesis of a Multifunctional Dye Conjugate for Photorefractive Applications

Influence of the Charge Transport Characteristics on the Holographic Response of Organic Photorefractive Materials

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