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Installieren Sie die LibKey Nomad-Browsererweiterung und erhalten Sie von vielen Webseiten einfachen Zugriff auf lizenzierte Volltexte oder Open Access Publikationen. Mehr erfahren...Microelectronics and reliability, 2024-06, Vol.157, p.115403, Article 115403
2024
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2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023, p.1-5
2023
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Microelectronics and reliability, 2022-08, Vol.135, p.114585, Article 114585
2022
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2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023, p.1-6
2023
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2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2021, p.1-8
2021
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2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2020, p.1-6
2020
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2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2016, p.1335-1341
2016
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Journal of microelectronics and electronic packaging, 2020-04, Vol.17 (2), p.35-44
2020
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IMAPSource Proceedings, 2024-03, Vol.2023 (EMPC)
2024
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2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC), 2023, p.1-7
2023
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2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2022, p.1-6
2022
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2022, p.1770-1776
2022
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2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, p.2165-2170
2021
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023, p.1332-1338
2023
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2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC), 2020, p.1-6
2020
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2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC), 2019, p.1-5
2019
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International Symposium on Microelectronics, 2019-10, Vol.2019 (1), p.19-26
2019
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2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2019, p.1-6
2019
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020, p.101-107
2020
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2018 7th Electronic System-Integration Technology Conference (ESTC), 2018, p.1-9
2018
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Technologies Enabling Future Mobile Connectivity and Sensing, 2023, p.71-85
1, 2023
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2016 6th Electronic System-Integration Technology Conference (ESTC), 2016, p.1-6
2016
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Proceedings of the 5th Electronics System-integration Technology Conference (ESTC), 2014, p.1-7
2014
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IMAPS other content, 2016-01, Vol.2016 (HiTEC), p.1-10
- Vogt, Holger
- Altmann, Frank
- Braun, Sebastian
- Celik, Yusuf
- Dietrich, Lothar
- Dietz, Dorothee
- van Dijk, Marius
- Dreiner, Stefan
- Doering, Ralf
- Gabler, Felix
- Goehlich, Andreas
- Hutter, Matthias
- Ihle, Martin
- Kappert, Holger
- Kordas, Norbert
- Kokozinski, Rainer
- Naumann, Falk
- Nowak, Torsten
- Oppermann, Hermann
- Partsch, Uwe
- Petzold, Matthias
- Roscher, Frank
- Rzepka, Sven
- Schubert, Ralph
- Weber, Constanze
- Wiemer, Maik
- Wittler, Olaf
- Ziesche, Steffen
2016
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Cell metabolism, 2016-04, Vol.23 (4), p.712-724
2016
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