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ON-state characteristics of proton irradiated 4H–SiC Schottky diode: The calibration of model parameters for device simulation

Solid-state electronics, 2014-04, Vol.94, p.32-38

2014

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La bande dessinée : quelle lecture, quelle culture ?

2015

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Small signal thermal analysis of local multibarrier behaviour in SiC Schottky diodes

Journal of physics. D, Applied physics, 2014-09, Vol.47 (38), p.385101-10

2014

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Structural analysis of SiC Schottky diodes failure mechanism under current overload

Journal of physics. D, Applied physics, 2014-02, Vol.47 (5), p.55102

2014

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Microstructure evolution observation for SAC solder joint: Comparison between thermal cycling and thermal storage

Microelectronics and reliability, 2009-09, Vol.49 (9), p.1267-1272

2009

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Study of 4H-SiC JBS Diodes Fabricated with Tungsten Schottky Barrier

Journal of electronic materials, 2011-12, Vol.40 (12), p.2355-2362

2011

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Temperature effects on the ruggedness of SiC Schottky diodes under surge current

Microelectronics and reliability, 2014-09, Vol.54 (9-10), p.2207-2212

2014

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Characterization of solid–liquid suspensions (real, large non-spherical particles in non-Newtonian carrier fluid) flowing in horizontal and vertical pipes

Journal of food engineering, 2007, Vol.78 (1), p.345-355

2007

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Monolithically Integrated Temperature Sensor in Silicon Carbide Power MOSFETs

IEEE transactions on power electronics, 2014-09, Vol.29 (9), p.4970-4977

2014

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IEEE_Xplore

Thermal performance of a flat ohmic cell under non-fouling and whey protein fouling conditions

Food science & technology, 2008-01, Vol.41 (6), p.1073-1081

2008

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Continuous ohmic heating unit under whey protein fouling

Innovative food science & emerging technologies, 2004-12, Vol.5 (4), p.465-473

2004

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Bande dessinée et numérique

2016

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Heat Treatment of Whole Milk by the Direct Joule Effect—Experimental and Numerical Approaches to Fouling Mechanisms

Journal of dairy science, 2006-12, Vol.89 (12), p.4475-4489

2006

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Rapid and Efficient Oxidation Process of SiC by In Situ Multiple RTP Steps

Materials science forum, 2010-01, Vol.645-648, p.817-820

2010

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Experimental study of hydrodynamics in a flat ohmic cell—impact on fouling by dairy products

Journal of food engineering, 2005-10, Vol.70 (4), p.489-498

2005

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Fundamental principles of electrochemical ohmic heating of solutions

Journal of electroanalytical chemistry (Lausanne, Switzerland), 1998-10, Vol.457 (1), p.191-203

1998

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Cryogenic to High Temperature Exploration of 4H-SiC W-SBD

Materials science forum, 2015-06, Vol.821-823, p.583-587

2015

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Bulk Thickness and Short Circuit Capacity of a 1200V 4H-SiC VJFET

Materials science forum, 2015-06, Vol.821-823, p.797-800

2015

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Study of 4H-SiC Schottky Diode Designs for 3.3kV Applications

Materials science forum, 2014-02, Vol.778-780, p.795-799

2014

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An Ultrafast I-V Measurement Technique Accounting for Capacitive and Leakage Currents in Reverse Mode for SiC Power Devices

Materials Science Forum, 2016-05, Vol.858, p.422-425

2016

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Electrical conductivity of whey protein deposit Xanthan Gum effect on temperature dependency

Food and bioproducts processing, 2004-12, Vol.82 (4), p.320-325

2004

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Studies on Floating Contact Press-Pack Diodes Surge Current Capability

Materials Science Forum, 2016-05, Vol.858, p.1053-1056

2016

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Comparison of 5kV SiC JBS and PiN Diodes

Materials science forum, 2014-02, Vol.778-780, p.867-870

2014

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High Temperature Capability of High Voltage 4H-SiC JBS

Materials science forum, 2012, Vol.711, p.124-128

2012

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Gate Oxide Stability of 4H-SiC MOSFETs under On/Off-State Bias-Temperature Stress

Materials science forum, 2013-01, Vol.740-742, p.553-556

2013

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ON-state characteristics of proton irradiated 4H–SiC Schottky diode: The calibration of model parameters for device simulation

La bande dessinée : quelle lecture, quelle culture ?

Small signal thermal analysis of local multibarrier behaviour in SiC Schottky diodes

Structural analysis of SiC Schottky diodes failure mechanism under current overload

Microstructure evolution observation for SAC solder joint: Comparison between thermal cycling and thermal storage

Study of 4H-SiC JBS Diodes Fabricated with Tungsten Schottky Barrier

Temperature effects on the ruggedness of SiC Schottky diodes under surge current

Characterization of solid–liquid suspensions (real, large non-spherical particles in non-Newtonian carrier fluid) flowing in horizontal and vertical pipes

Monolithically Integrated Temperature Sensor in Silicon Carbide Power MOSFETs

Thermal performance of a flat ohmic cell under non-fouling and whey protein fouling conditions

Continuous ohmic heating unit under whey protein fouling

Bande dessinée et numérique

Heat Treatment of Whole Milk by the Direct Joule Effect—Experimental and Numerical Approaches to Fouling Mechanisms

Rapid and Efficient Oxidation Process of SiC by In Situ Multiple RTP Steps

Experimental study of hydrodynamics in a flat ohmic cell—impact on fouling by dairy products

Fundamental principles of electrochemical ohmic heating of solutions

Cryogenic to High Temperature Exploration of 4H-SiC W-SBD

Bulk Thickness and Short Circuit Capacity of a 1200V 4H-SiC VJFET

Study of 4H-SiC Schottky Diode Designs for 3.3kV Applications

An Ultrafast I-V Measurement Technique Accounting for Capacitive and Leakage Currents in Reverse Mode for SiC Power Devices

Electrical conductivity of whey protein deposit Xanthan Gum effect on temperature dependency

Studies on Floating Contact Press-Pack Diodes Surge Current Capability

Comparison of 5kV SiC JBS and PiN Diodes

High Temperature Capability of High Voltage 4H-SiC JBS

Gate Oxide Stability of 4H-SiC MOSFETs under On/Off-State Bias-Temperature Stress

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