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Punch-through in short-channel AlGaN/GaN HFETs

IEEE transactions on electron devices, 2006-02, Vol.53 (2), p.395-398

2006

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Power Performance of AlGaN/GaN High-Electron-Mobility Transistors on (110) Silicon Substrate at 40 GHz

IEEE electron device letters, 2013-04, Vol.34 (4), p.490-492

2013

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Effects of Self-Heating on Performance Degradation in AlGaN/GaN-Based Devices

IEEE transactions on electron devices, 2009-10, Vol.56 (10), p.2178-2185

2009

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InAlN/GaN HEMTs on Sapphire Substrate With 2.9-W/mm Output Power Density at 18 GHz

IEEE electron device letters, 2011-11, Vol.32 (11), p.1537-1539

2011

Volltextzugriff (PDF)

Thermodynamic analysis of energy storage with a liquid air Rankine cycle

Applied thermal engineering, 2013-04, Vol.52 (1), p.130-140

2013

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Output power density of 5.1/mm at 18 GHz with an AlGaN/GaN HEMT on Si substrate

IEEE electron device letters, 2006-01, Vol.27 (1), p.7-9

2006

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Experimental study of buoyancy-driven flow in open-cell aluminium foam heat sinks

Applied thermal engineering, 2013-09, Vol.59 (1-2), p.30-40

2013

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Evaluating the efficiency of municipalities in collecting and processing municipal solid waste: A shared input DEA-model

Waste management (Elmsford), 2012-10, Vol.32 (10), p.1968-1978

2012

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On the Correct Extraction of Interface Trap Density of MOS Devices With High-Mobility Semiconductor Substrates

IEEE transactions on electron devices, 2008-02, Vol.55 (2), p.547-556

2008

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Thermo-hydraulic study of a single row heat exchanger consisting of metal foam covered round tubes

International journal of heat and mass transfer, 2010-07, Vol.53 (15), p.3262-3274

2010

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Electrical TCAD Simulations of a Germanium pMOSFET Technology

IEEE transactions on electron devices, 2010-10, Vol.57 (10), p.2539-2546

2010

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Impact of Donor Concentration, Electric Field, and Temperature Effects on the Leakage Current in Germanium p +/n Junctions

IEEE transactions on electron devices, 2008-09, Vol.55 (9), p.2287-2296

2008

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Assessing the influence of four bonding methods on the thermal contact resistance of open-cell aluminum foam

International journal of heat and mass transfer, 2012-10, Vol.55 (21-22), p.6200-6210

2012

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Cost-efficiency in packaging waste management: The case of Belgium

Resources, conservation and recycling, 2014-04, Vol.85, p.106-115

2014

Volltextzugriff (PDF)

Recent developments of wide-bandgap semiconductor based UV sensors

Diamond and related materials, 2009-05, Vol.18 (5), p.860-864

2009

Volltextzugriff (PDF)

Power Performance at 40 GHz on Quaternary Barrier InAlGaN/GaN HEMT

IEEE electron device letters, 2013-08, Vol.34 (8), p.978-980

2013

Volltextzugriff (PDF)

Wasteful waste-reducing policies? The impact of waste reduction policy instruments on collection and processing costs of municipal solid waste

Waste management (Elmsford), 2011-07, Vol.31 (7), p.1429-1440

2011

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Beamforming in the Presence of Mutual Coupling Based on Constrained Particle Swarm Optimization

IEEE transactions on antennas and propagation, 2009-06, Vol.57 (6), p.1655-1666

2009

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High-Performance Deep Submicron Ge pMOSFETs With Halo Implants

IEEE transactions on electron devices, 2007-09, Vol.54 (9), p.2503-2511

2007

Volltextzugriff (PDF)

Development and analysis of low resistance ohmic contact to n-AlGaN/GaN HEMT

Diamond and related materials, 2007-02, Vol.16 (2), p.262-266

2007

Volltextzugriff (PDF)

Manufacturing Challenges of GaN-on-Si HEMTs in a 200 mm CMOS Fab

IEEE transactions on semiconductor manufacturing, 2013-08, Vol.26 (3), p.361-367

2013

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Au-Free AlGaN/GaN Power Diode on 8-in Si Substrate With Gated Edge Termination

IEEE electron device letters, 2013-08, Vol.34 (8), p.1035-1037

2013

Volltextzugriff (PDF)

Analysis of Thermal Effect Influence in Gallium-Nitride-Based TLM Structures by Means of a Transport-Thermal Modeling

IEEE transactions on electron devices, 2006-09, Vol.53 (9), p.2237-2242

2006

Volltextzugriff (PDF)

Defect assessment and leakage control in Ge junctions

Microelectronic engineering, 2014-08, Vol.125, p.33-37

2014

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Thermal hydraulic performance of 10 PPI aluminium foam as alternative for louvered fins in an HVAC heat exchanger

Applied thermal engineering, 2013-03, Vol.51 (1-2), p.371-382

2013

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Punch-through in short-channel AlGaN/GaN HFETs

Power Performance of AlGaN/GaN High-Electron-Mobility Transistors on (110) Silicon Substrate at 40 GHz

Effects of Self-Heating on Performance Degradation in AlGaN/GaN-Based Devices

InAlN/GaN HEMTs on Sapphire Substrate With 2.9-W/mm Output Power Density at 18 GHz

Thermodynamic analysis of energy storage with a liquid air Rankine cycle

Output power density of 5.1/mm at 18 GHz with an AlGaN/GaN HEMT on Si substrate

Experimental study of buoyancy-driven flow in open-cell aluminium foam heat sinks

Evaluating the efficiency of municipalities in collecting and processing municipal solid waste: A shared input DEA-model

On the Correct Extraction of Interface Trap Density of MOS Devices With High-Mobility Semiconductor Substrates

Thermo-hydraulic study of a single row heat exchanger consisting of metal foam covered round tubes

Electrical TCAD Simulations of a Germanium pMOSFET Technology

Impact of Donor Concentration, Electric Field, and Temperature Effects on the Leakage Current in Germanium p +/n Junctions

Assessing the influence of four bonding methods on the thermal contact resistance of open-cell aluminum foam

Cost-efficiency in packaging waste management: The case of Belgium

Recent developments of wide-bandgap semiconductor based UV sensors

Power Performance at 40 GHz on Quaternary Barrier InAlGaN/GaN HEMT

Wasteful waste-reducing policies? The impact of waste reduction policy instruments on collection and processing costs of municipal solid waste

Beamforming in the Presence of Mutual Coupling Based on Constrained Particle Swarm Optimization

High-Performance Deep Submicron Ge pMOSFETs With Halo Implants

Development and analysis of low resistance ohmic contact to n-AlGaN/GaN HEMT

Manufacturing Challenges of GaN-on-Si HEMTs in a 200 mm CMOS Fab

Au-Free AlGaN/GaN Power Diode on 8-in Si Substrate With Gated Edge Termination

Analysis of Thermal Effect Influence in Gallium-Nitride-Based TLM Structures by Means of a Transport-Thermal Modeling

Defect assessment and leakage control in Ge junctions

Thermal hydraulic performance of 10 PPI aluminium foam as alternative for louvered fins in an HVAC heat exchanger

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