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3-D TSV Six-Die Stacking and Reliability Assessment of 20- \mu m-Pitch Bumps on Large-Scale Dies

IEEE transactions on components, packaging, and manufacturing technology (2011), 2017-01, Vol.7 (1), p.33-38

2017

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Thermal compression bonding with non-conductive adhesive of 30μm pitch Cu pillar micro bumps on organic substrate with bare Cu bondpads

2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 2014, p.438-443

2014

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Thermo-compression bonding assembly process and reliability studies of Cu pillar bump on Cu/Low-K Chip

2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 2014, p.574-578

2014

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Process development and optimization for high temperature endurable flip chip interconnection in SiC high power module

2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 2014, p.225-228

2014

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Thermal Compression Bonding of 30um Pitch Cu Pillar Microbump on Organic Substrate with Bare Cu Bondpad

2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2016, p.936-942

2016

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Process development of 10μm pitch Cu-Cu low temperature bonding for 3D IC stacking

2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 2013, p.493-497

2013

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Characterization of pressure-less Ag sintering on Ni/Au surface

2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), 2015, p.1-4

2015

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Development of bonding process for high density fine pitch micro bump interconnections with wafer level underfill for 3D applications

2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 2013, p.543-548

2013

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Direct eutectic AuSn solder bumping on Al bond pad surface using laser solder ball jetting

2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 2013, p.224-229

2013

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Chip to wafer bonding for three-dimensional integration of copper low K Chip by stacking process

2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 2013, p.250-254

2013

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Intuitive and inexpensive method to evaluate flip chip bonding parameters of micro bump with wafer-level underfill material using glass substrate

2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 2013, p.219-223

2013

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Low temperature bonding studies of Au-studs and AuSn-solder bumps on Au-surface using ultrasonic energy

2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 2013, p.384-388

2013

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Fine pitch solder-less bonding using ultrasonic technique

2012 IEEE 14th Electronics Packaging Technology Conference (EPTC), 2012, p.420-425

2012

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Miniaturized Double Side Cooling Packaging for High Power 3 Phase SiC Inverter Module with Junction Temperature over 220°C

2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2016, p.1190-1196

2016

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Implantable blood flow sensor integrated on flexible circuit for vascular graft application

2012 IEEE 14th Electronics Packaging Technology Conference (EPTC), 2012, p.695-699

2012

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Thermal modeling and characterization of SiC power module under both air cooling and liquid cooling conditions

2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 2014, p.618-623

2014

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Process development of multi-die stacking using 20 um pitch micro bumps on large scale dies

2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 2014, p.318-321

2014

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High power SiC inverter module packaging solutions for junction temperature over 220°C

2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 2014, p.31-35

2014

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Wafer level underfill study for high density ultra-fine pitch Cu-Cu bonding for 3D IC stacking

2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 2014, p.400-404

2014

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3-D TSV Six-Die Stacking and Reliability Assessment of 20- \mu m-Pitch Bumps on Large-Scale Dies

Thermal compression bonding with non-conductive adhesive of 30μm pitch Cu pillar micro bumps on organic substrate with bare Cu bondpads

Thermo-compression bonding assembly process and reliability studies of Cu pillar bump on Cu/Low-K Chip

Process development and optimization for high temperature endurable flip chip interconnection in SiC high power module

Thermal Compression Bonding of 30um Pitch Cu Pillar Microbump on Organic Substrate with Bare Cu Bondpad

Process development of 10μm pitch Cu-Cu low temperature bonding for 3D IC stacking

Characterization of pressure-less Ag sintering on Ni/Au surface

Development of bonding process for high density fine pitch micro bump interconnections with wafer level underfill for 3D applications

Direct eutectic AuSn solder bumping on Al bond pad surface using laser solder ball jetting

Chip to wafer bonding for three-dimensional integration of copper low K Chip by stacking process

Intuitive and inexpensive method to evaluate flip chip bonding parameters of micro bump with wafer-level underfill material using glass substrate

Low temperature bonding studies of Au-studs and AuSn-solder bumps on Au-surface using ultrasonic energy

Fine pitch solder-less bonding using ultrasonic technique

Miniaturized Double Side Cooling Packaging for High Power 3 Phase SiC Inverter Module with Junction Temperature over 220°C

Implantable blood flow sensor integrated on flexible circuit for vascular graft application

Thermal modeling and characterization of SiC power module under both air cooling and liquid cooling conditions

Process development of multi-die stacking using 20 um pitch micro bumps on large scale dies

High power SiC inverter module packaging solutions for junction temperature over 220°C

Wafer level underfill study for high density ultra-fine pitch Cu-Cu bonding for 3D IC stacking

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