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Materials science forum, 2022-05, Vol.1062, p.131-135
- Rouchier, Séverin
- Drouin, Alexis
- Bouville-Lallart, Adeline
- Vladimirova, Kremena
- Troutot, Nicolas
- Schwarzenbach, Walter
- Lavaitte, Guillaume
- Thomas, Shawn
- Servant, Florence
- Gaudin, Gweltaz
- Bosch, Daphnée
- Rolland, Emmanuel
- Cela, Enrica
- Widiez, Julie
- Gelineau, Guillaume
- Bethoux, Jean Marc
- Chapelle, Audrey
- Maleville, Christophe
- Leow, Yen Lin
- Allibert, Frédéric
- Boulet, Romain
- Berre, Guillaume
- Duboust, Alain
- Bhargava, Shivan
- Viravaux, Laurent
- Navone, Christelle
- Radu, Ionut
2022
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2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM), 2022, p.85-87
- Daval, N.
- Drouin, A.
- Biard, H.
- Viravaux, L.
- Radisson, D.
- Rouchier, S.
- Gaudin, G.
- Widiez, J.
- Allibert, F.
- Rolland, E.
- Vladimirova, K.
- Gelineau, G.
- Troutot, N.
- Navone, C.
- Berre, G.
- Bosch, D.
- Leow, Y.L
- Duboust, A.
- Bethoux, J-M.
- Boulet, R.
- Chapelle, A.
- Cela, E.
- Lavaitte, G.
- Bouville-Lallart, A.
- Bhargava, S.
- Schwarzenbach, W.
- Maddalon, C.
- Radu, I.
- Odoul, S.
- Delprat, D.
- Bonnin, O.
- Maleville, C.
2022
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2022 International Conference on IC Design and Technology (ICICDT), 2022, p.55-56
- Schwarzenbach, W.
- Rouchier, S.
- Berre, G.
- Boulet, R.
- Ledoux, O.
- Cela, E.
- Drouin, A.
- Chapelle, A.
- Monnoye, S.
- Biard, H.
- Alassaad, K.
- Viravaux, L.
- Mohamed, N. Ben
- Radisson, D.
- Picun, G.
- Lavaitte, G.
- Bouville-Lallart, A.
- Roi, J.
- Widiez, J.
- Abadie, K.
- Rolland, E.
- Fournel, F.
- Gelineau, G.
- Mazen, F.
- Moulin, A.
- Moulin, C.
- Delprat, D.
- Daval, N.
- Odoul, S.
- Sandri, P.
- Maleville, C.
2022
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The Plant cell, 2020-04, Vol.32 (4), p.833-852
2020
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2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D), 2019, p.20-20
2019
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The Plant journal : for cell and molecular biology, 2018-02, Vol.93 (3), p.515-533
- Lang, Daniel
- Ullrich, Kristian K.
- Murat, Florent
- Fuchs, Jörg
- Jenkins, Jerry
- Haas, Fabian B.
- Piednoel, Mathieu
- Gundlach, Heidrun
- Van Bel, Michiel
- Meyberg, Rabea
- Vives, Cristina
- Morata, Jordi
- Symeonidi, Aikaterini
- Hiss, Manuel
- Muchero, Wellington
- Kamisugi, Yasuko
- Saleh, Omar
- Blanc, Guillaume
- Decker, Eva L.
- Gessel, Nico
- Grimwood, Jane
- Hayes, Richard D.
- Graham, Sean W.
- Gunter, Lee E.
- McDaniel, Stuart F.
- Hoernstein, Sebastian N.W.
- Larsson, Anders
- Li, Fay‐Wei
- Perroud, Pierre‐François
- Phillips, Jeremy
- Ranjan, Priya
- Rokshar, Daniel S.
- Rothfels, Carl J.
- Schneider, Lucas
- Shu, Shengqiang
- Stevenson, Dennis W.
- Thümmler, Fritz
- Tillich, Michael
- Villarreal Aguilar, Juan C.
- Widiez, Thomas
- Wong, Gane Ka‐Shu
- Wymore, Ann
- Zhang, Yong
- Zimmer, Andreas D.
- Quatrano, Ralph S.
- Mayer, Klaus F.X.
- Goodstein, David
- Casacuberta, Josep M.
- Vandepoele, Klaas
- Reski, Ralf
- Cuming, Andrew C.
- Tuskan, Gerald A.
- Maumus, Florian
- Salse, Jérome
- Schmutz, Jeremy
- Rensing, Stefan A.
2018
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The Plant journal : for cell and molecular biology, 2017-12, Vol.93 (3)
- Lang, Daniel
- Ullrich, Kristian K.
- Murat, Florent
- Fuchs, Jorg
- Jenkins, Jerry
- Haas, Fabian B.
- Piednoel, Mathieu
- Gundlach, Heidrun
- Van Bel, Michiel
- Meyberg, Rabea
- Vives, Cristina
- Morata, Jordi
- Symeonidi, Aikaterini
- Hiss, Manuel
- Muchero, Wellington
- Kamisugi, Yasuko
- Saleh, Omar
- Blanc, Guillaume
- Decker, Eva L.
- van Gessel, Nico
- Grimwood, Jane
- Hayes, Richard D.
- Graham, Sean W.
- Gunter, Lee E.
- McDaniel, Stuart F.
- Hoernstein, Sebastian N. W.
- Larsson, Anders
- Li, Fay -Wei
- Perroud, Pierre -Francois
- Phillips, Jeremy
- Ranjan, Priya
- Rokshar, Daniel S.
- Rothfels, Carl J.
- Schneider, Lucas
- Shu, Shengqiang
- Stevenson, Dennis W.
- Thummler, Fritz
- Tillich, Michael
- Villarreal Aguilar, Juan C.
- Widiez, Thomas
- Wong, Gane Ka-Shu
- Wymore, Ann
- Zhang, Yong
- Zimmer, Andreas D.
- Quatrano, Ralph S.
- Mayer, Klaus F. X.
- Goodstein, David
- Casacuberta, Josep M.
- Vandepoele, Klaas
- Reski, Ralf
- Cuming, Andrew C.
- Tuskan, Gerald A.
- Maumus, Florian
- Salse, Jerome
- Schmutz, Jeremy
- Rensing, Stefan A.
2017
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2017 Symposium on VLSI Technology, 2017, p.T74-T75
2017
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Journal of applied physics, 2017-02, Vol.121 (5)
2017
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Revue de chirurgie orthopédique et traumatologique, 2016-11, Vol.102 (7), p.S132-S132
2016
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2016 21st International Conference on Ion Implantation Technology (IIT), 2016, p.1-4
2016
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Revue de chirurgie orthopédique et traumatologique, 2016-06, Vol.102 (4), p.389-389
2016
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2015 IEEE 12th International Conference on Group IV Photonics (GFP), 2015, p.169-170
2015
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2015 Symposium on VLSI Technology (VLSI Technology), 2015, p.T48-T49
- Batude, P.
- Fenouillet-Beranger, C.
- Pasini, L.
- Lu, V.
- Deprat, F.
- Brunet, L.
- Sklenard, B.
- Piegas-Luce, F.
- Casse, M.
- Mathieu, B.
- Billoint, O.
- Cibrario, G.
- Turkyilmaz, O.
- Sarhan, H.
- Thuries, S.
- Hutin, L.
- Sollier, S.
- Widiez, J.
- Hortemel, L.
- Tabone, C.
- Samson, M.-P
- Previtali, B.
- Rambal, N.
- Ponthenier, F.
- Mazurier, J.
- Beneyton, R.
- Bidaud, M.
- Josse, E.
- Petitprez, E.
- Rozeau, O.
- Rivoire, M.
- Euvard-Colnat, C.
- Seignard, A.
- Fournel, F.
- Benaissa, L.
- Coudrain, P.
- Leduc, P.
- Hartmann, J.-M
- Besson, P.
- Kerdiles, S.
- Bout, C.
- Nemouchi, F.
- Royer, A.
- Agraffeil, C.
- Ghibaudo, G.
- Signamarcheix, T.
- Haond, M.
- Clermidy, F.
- Faynot, O.
- Vinet, M.
2015
Volltextzugriff (PDF)
2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D), 2014, p.59-59
2014
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2013 25th International Symposium on Power Semiconductor Devices & IC's (ISPSD), 2013, p.97-100
2013
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2012 24th International Symposium on Power Semiconductor Devices and ICs, 2012, p.77-80
2012
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2012 Twenty-Seventh Annual IEEE Applied Power Electronics Conference and Exposition (APEC), 2012, p.169-175
2012
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2011 Symposium on VLSI Technology - Digest of Technical Papers, 2011, p.164-165
2011
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2010 International Electron Devices Meeting, 2010, p.2.6.1-2.6.4
2010
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2009 IEEE International SOI Conference, 2009, p.1-2
2009
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IEEE electron device letters, 2009-07, Vol.30 (7), p.748
2009
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IEEE electron device letters, 2009-07, Vol.30 (7), p.748-750
2009
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MRS proceedings, 2009, Vol.1185 (1), p.43-48, Article 1185-II04-08
2009
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Solid-state electronics, 2007-04, Vol.51 (4), p.537-542
2007
Volltextzugriff (PDF)
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