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Thermal compression bonding with non-conductive adhesive of 30μm pitch Cu pillar micro bumps on organic substrate with bare Cu bondpads

2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 2014, p.438-443

2014

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Thermo-compression bonding assembly process and reliability studies of Cu pillar bump on Cu/Low-K Chip

2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 2014, p.574-578

2014

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Process development and optimization for high temperature endurable flip chip interconnection in SiC high power module

2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 2014, p.225-228

2014

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Thermal Compression Bonding of 30um Pitch Cu Pillar Microbump on Organic Substrate with Bare Cu Bondpad

2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2016, p.936-942

2016

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Process development of 10μm pitch Cu-Cu low temperature bonding for 3D IC stacking

2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 2013, p.493-497

2013

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Characterization of pressure-less Ag sintering on Ni/Au surface

2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), 2015, p.1-4

2015

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Development of bonding process for high density fine pitch micro bump interconnections with wafer level underfill for 3D applications

2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 2013, p.543-548

2013

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Direct eutectic AuSn solder bumping on Al bond pad surface using laser solder ball jetting

2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 2013, p.224-229

2013

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Chip to wafer bonding for three-dimensional integration of copper low K Chip by stacking process

2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 2013, p.250-254

2013

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Intuitive and inexpensive method to evaluate flip chip bonding parameters of micro bump with wafer-level underfill material using glass substrate

2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 2013, p.219-223

2013

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Low temperature bonding studies of Au-studs and AuSn-solder bumps on Au-surface using ultrasonic energy

2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 2013, p.384-388

2013

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A Novel Method of CoW Bonding for High Density Ultra-Fine Pitch IC Stacking Application

International Journal of Mechanical Engineering and Robotics Research, 2016

2016

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Miniaturized Double Side Cooling Packaging for High Power 3 Phase SiC Inverter Module with Junction Temperature over 220°C

2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2016, p.1190-1196

2016

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Thermal modeling and characterization of SiC power module under both air cooling and liquid cooling conditions

2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 2014, p.618-623

2014

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Process development of multi-die stacking using 20 um pitch micro bumps on large scale dies

2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 2014, p.318-321

2014

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High power SiC inverter module packaging solutions for junction temperature over 220°C

2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 2014, p.31-35

2014

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Wafer level underfill study for high density ultra-fine pitch Cu-Cu bonding for 3D IC stacking

2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 2014, p.400-404

2014

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Imported Monkeypox, Singapore

Emerging infectious diseases, 2020-08, Vol.26 (8), p.1826-1830

2020

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Outbreak of Zika virus infection in Singapore: an epidemiological, entomological, virological, and clinical analysis

The Lancet infectious diseases, 2017-08, Vol.17 (8), p.813-821

2017

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Making In Vitro Tumor Models Whole Again (Adv. Healthcare Mater. 14/2023)

Advanced healthcare materials, 2023-06, Vol.12 (14), p.n/a

2023

Volltextzugriff (PDF)

Impact of the Types and Relative Quantities of IGHV Gene Mutations in Predicting Prognosis of Patients With Chronic Lymphocytic Leukemia

Frontiers in oncology, 2022-07, Vol.12, p.897280-897280

2022

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An arbitrary Lagrangian Eulerian method for moving-boundary problems and its application to jumping over water

Journal of computational physics, 2005-09, Vol.208 (1), p.289-314

2005

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CYP17 polymorphisms in relation to risks of prostate cancer and benign prostatic hyperplasia: A population‐based study in China

International journal of cancer, 2003-11, Vol.107 (2), p.271-275

2003

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Practical Synthesis of Anti-Methicillin-Resistant Staphylococcus Aureus (MRSA) Carbapenem L-742,728

Journal of organic chemistry, 1998-08, Vol.63 (16), p.5438-5446

1998

Volltextzugriff (PDF)

UV-Irradiation-Induced Refractive Index Increase of Ge-Doped Silica Films

Materials science forum, 2005-01, Vol.475-479, p.1837-1840

2005

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Thermal compression bonding with non-conductive adhesive of 30μm pitch Cu pillar micro bumps on organic substrate with bare Cu bondpads

Thermo-compression bonding assembly process and reliability studies of Cu pillar bump on Cu/Low-K Chip

Process development and optimization for high temperature endurable flip chip interconnection in SiC high power module

Thermal Compression Bonding of 30um Pitch Cu Pillar Microbump on Organic Substrate with Bare Cu Bondpad

Process development of 10μm pitch Cu-Cu low temperature bonding for 3D IC stacking

Characterization of pressure-less Ag sintering on Ni/Au surface

Development of bonding process for high density fine pitch micro bump interconnections with wafer level underfill for 3D applications

Direct eutectic AuSn solder bumping on Al bond pad surface using laser solder ball jetting

Chip to wafer bonding for three-dimensional integration of copper low K Chip by stacking process

Intuitive and inexpensive method to evaluate flip chip bonding parameters of micro bump with wafer-level underfill material using glass substrate

Low temperature bonding studies of Au-studs and AuSn-solder bumps on Au-surface using ultrasonic energy

A Novel Method of CoW Bonding for High Density Ultra-Fine Pitch IC Stacking Application

Miniaturized Double Side Cooling Packaging for High Power 3 Phase SiC Inverter Module with Junction Temperature over 220°C

Thermal modeling and characterization of SiC power module under both air cooling and liquid cooling conditions

Process development of multi-die stacking using 20 um pitch micro bumps on large scale dies

High power SiC inverter module packaging solutions for junction temperature over 220°C

Wafer level underfill study for high density ultra-fine pitch Cu-Cu bonding for 3D IC stacking

Imported Monkeypox, Singapore

Outbreak of Zika virus infection in Singapore: an epidemiological, entomological, virological, and clinical analysis

Making In Vitro Tumor Models Whole Again (Adv. Healthcare Mater. 14/2023)

Impact of the Types and Relative Quantities of IGHV Gene Mutations in Predicting Prognosis of Patients With Chronic Lymphocytic Leukemia

An arbitrary Lagrangian Eulerian method for moving-boundary problems and its application to jumping over water

CYP17 polymorphisms in relation to risks of prostate cancer and benign prostatic hyperplasia: A population‐based study in China

Practical Synthesis of Anti-Methicillin-Resistant Staphylococcus Aureus (MRSA) Carbapenem L-742,728

UV-Irradiation-Induced Refractive Index Increase of Ge-Doped Silica Films

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