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A wafer-scale 3-D circuit integration technology

IEEE transactions on electron devices, 2006-10, Vol.53 (10), p.2507-2516

2006

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A Miniaturized 256-Channel Neural Recording Interface With Area-Efficient Hybrid Integration of Flexible Probes and CMOS Integrated Circuits

IEEE transactions on biomedical engineering, 2022-01, Vol.69 (1), p.334-346

2022

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IEEE_Xplore

An 80-Tile Sub-100-W TeraFLOPS Processor in 65-nm CMOS

IEEE journal of solid-state circuits, 2008-01, Vol.43 (1), p.29-41

2008

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IEEE_Xplore

Investigation of Passive Transmission Lines for the MIT-LL SFQ5ee Process

IEEE transactions on applied superconductivity, 2019-08, Vol.29 (5), p.1-7

2019

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IEEE_Xplore

Physics-Based Inductance Extraction for Via Arrays in Parallel Planes for Power Distribution Network Design

IEEE transactions on microwave theory and techniques, 2010-09, Vol.58 (9), p.2434-2447

2010

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IEEE_Xplore

Unified and Integrated Circuit Antenna in Front End-A Proof of Concept

IEEE transactions on microwave theory and techniques, 2019-01, Vol.67 (1), p.347-364

2019

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IEEE_Xplore

Prolonged 500 °C Demonstration of 4H-SiC JFET ICs With Two-Level Interconnect

IEEE electron device letters, 2016-05, Vol.37 (5), p.625-628

2016

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IEEE_Xplore

Hybrid interconnect network for on-chip low-power clock distribution

Electronics letters, 2019-03, Vol.55 (5), p.244-246

2019

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Three-Dimensional Integrated Circuits and the Future of System-on-Chip Designs

Proceedings of the IEEE, 2006-06, Vol.94 (6), p.1214-1224

Patti, R.S.

2006

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IEEE_Xplore

A 13.56-MHz RFID System Based on Organic Transponders

IEEE journal of solid-state circuits, 2007-01, Vol.42 (1), p.84-92

2007

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IEEE_Xplore

Group-Delay Engineered Noncommensurate Transmission Line All-Pass Network for Analog Signal Processing

IEEE transactions on microwave theory and techniques, 2010-09, Vol.58 (9), p.2392-2407

2010

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IEEE_Xplore

Wavelength Division Multiplexing Based Photonic Integrated Circuits on Silicon-on-Insulator Platform

IEEE journal of selected topics in quantum electronics, 2010-01, Vol.16 (1), p.23-32

2010

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IEEE_Xplore

8 Gb 3-D DDR3 DRAM Using Through-Silicon-Via Technology

IEEE journal of solid-state circuits, 2010-01, Vol.45 (1), p.111-119

2010

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IEEE_Xplore

Petabit-Scale Silicon Photonic Interconnects With Integrated Kerr Frequency Combs

IEEE journal of selected topics in quantum electronics, 2023-01, Vol.29 (1: Nonlinear Integrated Photonics), p.1-20

2023

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Fully Integrated Graphene and Carbon Nanotube Interconnects for Gigahertz High-Speed CMOS Electronics

IEEE transactions on electron devices, 2010-11, Vol.57 (11), p.3137-3143

2010

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IEEE_Xplore

Demonstration of Single-Flux-Quantum 64-B Lookup Table With Cryo-CMOS Decoders for Reconfiguration

IEEE transactions on applied superconductivity, 2022-11, Vol.32 (8), p.1-5

2022

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IEEE_Xplore

Rectilinear routing algorithm for crosstalk minimisation in 2D and 3D IC

IET computers & digital techniques, 2020-11, Vol.14 (6), p.263-271

2020

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TSV-Based 3-D ICs: Design Methods and Tools

IEEE transactions on computer-aided design of integrated circuits and systems, 2017-10, Vol.36 (10), p.1593-1619

2017

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IEEE_Xplore

Towards the Integration of InP Photonics With Silicon Electronics: Design and Technology Challenges

Journal of lightwave technology, 2021-02, Vol.39 (4), p.999-1009

2021

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IEEE_Xplore

Modeling of Conductor, Dielectric, and Radiation Losses in Substrate Integrated Waveguide by the Boundary Integral-Resonant Mode Expansion Method

IEEE transactions on microwave theory and techniques, 2008-12, Vol.56 (12), p.3153-3161

2008

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IEEE_Xplore

A Review of Recent Research on Heat Transfer in Three-Dimensional Integrated Circuits (3-D ICs)

IEEE transactions on components, packaging, and manufacturing technology (2011), 2021-05, Vol.11 (5), p.802-821

2021

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IEEE_Xplore

Practical Strategies for Power-Efficient Computing Technologies

Proceedings of the IEEE, 2010-02, Vol.98 (2), p.215-236

2010

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IEEE_Xplore

Packages for Terahertz Electronics

Proceedings of the IEEE, 2017-06, Vol.105 (6), p.1121-1138

Song, Ho-Jin

2017

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De-embedding transmission line measurements for accurate modeling of IC designs

IEEE transactions on electron devices, 2006-02, Vol.53 (2), p.235-241

2006

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IEEE_Xplore

Interconnect Routing for Large-Scale RSFQ Circuits

IEEE transactions on applied superconductivity, 2019-08, Vol.29 (5), p.1-5

2019

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IEEE_Xplore

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A wafer-scale 3-D circuit integration technology

A Miniaturized 256-Channel Neural Recording Interface With Area-Efficient Hybrid Integration of Flexible Probes and CMOS Integrated Circuits

An 80-Tile Sub-100-W TeraFLOPS Processor in 65-nm CMOS

Investigation of Passive Transmission Lines for the MIT-LL SFQ5ee Process

Physics-Based Inductance Extraction for Via Arrays in Parallel Planes for Power Distribution Network Design

Unified and Integrated Circuit Antenna in Front End-A Proof of Concept

Prolonged 500 °C Demonstration of 4H-SiC JFET ICs With Two-Level Interconnect

Hybrid interconnect network for on-chip low-power clock distribution

Three-Dimensional Integrated Circuits and the Future of System-on-Chip Designs

A 13.56-MHz RFID System Based on Organic Transponders

Group-Delay Engineered Noncommensurate Transmission Line All-Pass Network for Analog Signal Processing

Wavelength Division Multiplexing Based Photonic Integrated Circuits on Silicon-on-Insulator Platform

8 Gb 3-D DDR3 DRAM Using Through-Silicon-Via Technology

Petabit-Scale Silicon Photonic Interconnects With Integrated Kerr Frequency Combs

Fully Integrated Graphene and Carbon Nanotube Interconnects for Gigahertz High-Speed CMOS Electronics

Demonstration of Single-Flux-Quantum 64-B Lookup Table With Cryo-CMOS Decoders for Reconfiguration

Rectilinear routing algorithm for crosstalk minimisation in 2D and 3D IC

TSV-Based 3-D ICs: Design Methods and Tools

Towards the Integration of InP Photonics With Silicon Electronics: Design and Technology Challenges

Modeling of Conductor, Dielectric, and Radiation Losses in Substrate Integrated Waveguide by the Boundary Integral-Resonant Mode Expansion Method

A Review of Recent Research on Heat Transfer in Three-Dimensional Integrated Circuits (3-D ICs)

Practical Strategies for Power-Efficient Computing Technologies

Packages for Terahertz Electronics

De-embedding transmission line measurements for accurate modeling of IC designs

Interconnect Routing for Large-Scale RSFQ Circuits

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