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3-D Die Stacking With 55 μm Pitch Interconnections on Advanced Ground-Rule Laminate for Artificial Intelligence System
IEEE transactions on components, packaging, and manufacturing technology (2011), 2021-05, Vol.11 (5), p.875-878
2021
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CMOS-Compatible Wearable Sensors Fabricated Using Controlled Spalling
IEEE sensors journal, 2019-09, Vol.19 (18), p.7868-7874
2019
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Hybrid Au-Adhesive Bonding Using Planar Adhesive Structure for 3-D LSI
IEEE transactions on components, packaging, and manufacturing technology (2011), 2014-05, Vol.4 (5), p.762-768
2014
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Study on Hybrid Au-Underfill Resin Bonding Method With Lock-and-Key Structure for 3-D Integration
IEEE transactions on components, packaging, and manufacturing technology (2011), 2013-04, Vol.3 (4), p.558-565
2013
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Volume-controllable Solder Bumping Technology to Package Substrate Using Injection Molded Solder for Fine-pitch Flip Chip
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023, p.585-589
2023
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Hybrid Au-Au bonding technology using planar adhesive structure for 3D integration
2013 IEEE 63rd Electronic Components and Technology Conference, 2013, p.1153-1157
2013
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Heterogeneous Integration on Organic Interposer Substrate with fine-pitch RDL and 40 micron pitch Micro-bumps
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023, p.872-877
2023
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Functional Testing of AI Cores through Thinned 3D I/O Buffer Dies in 3D Die-Stacked Modules
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2022, p.977-980
2022
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Flip chip assembly method employing differential heating/cooling for large dies with coreless substrates
2013 IEEE 63rd Electronic Components and Technology Conference, 2013, p.667-673
2013
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Differential heating/cooling chip joining method to prevent chip package interaction issue in large die with ultra low-k technology
2012 IEEE 62nd Electronic Components and Technology Conference, 2012, p.430-435
2012
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Assembly and packaging of non-bumped 3D chip stacks on bumped substrates
2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 2014, p.1372-1377
2014
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Hybrid Au-underfill resin bonding with lock-and-key structure
2012 IEEE 62nd Electronic Components and Technology Conference, 2012, p.258-262
2012
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Hybrid solder-adhesive bonding using simple resin planarization technique for 3D LSI
2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, 2012, p.81-81
2012
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Thermal stress analysis of 3D die stacks with low-volume interconnections
2010 IEEE CPMT Symposium Japan, 2010, p.1-4
2010
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