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Microelectronic engineering, 2022-06, Vol.262, p.111833, Article 111833
2022
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IEEE transactions on semiconductor manufacturing, 2021-08, Vol.34 (3), p.280-285
2021
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An Output-Capacitor-Free Synthesizable Digital LDO Using CMP-Triggered Oscillator and Droop Detector
2023
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Materials science in semiconductor processing, 2023-03, Vol.156, p.107276, Article 107276
2023
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Materials science in semiconductor processing, 2021-02, Vol.122, p.105500, Article 105500
2021
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IEEE transactions on information theory, 2015-07, Vol.61 (7), p.4028-4033
2015
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Microelectronic engineering, 2020-10, Vol.234, p.111437, Article 111437
2020
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Materials science in semiconductor processing, 2023-03, Vol.156, p.107278, Article 107278
2023
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Microelectronics and reliability, 2011-09, Vol.51 (9-11), p.1856-1859
2011
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IEEE transactions on geoscience and remote sensing, 2024, Vol.62, p.1-14
2024
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IEEE transactions on components, packaging, and manufacturing technology (2011), 2020-04, Vol.10 (4), p.1-1
2020
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Microelectronic engineering, 2017-11, Vol.183-184, p.1-11
2017
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Materials science in semiconductor processing, 2023-09, Vol.164, p.107637, Article 107637
2023
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Microelectronic engineering, 2021-03, Vol.241, p.111544, Article 111544
2021
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Microelectronic engineering, 2018-12, Vol.202, p.1-8
2018
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IEEE geoscience and remote sensing letters, 2023, Vol.20, p.1-5
2023
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Microelectronic engineering, 2022-05, Vol.261, p.111808, Article 111808
2022
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Materials science in semiconductor processing, 2022-03, Vol.140, p.106353, Article 106353
2022
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Microelectronic engineering, 2014-06, Vol.122, p.82-86
2014
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IEEE transactions on computers, 2022-07, Vol.71 (7), p.1626-1639
2022
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IEEE transactions on computers, 2023-10, Vol.72 (10), p.1-14
2023
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Microelectronic engineering, 2018-08, Vol.195, p.36-40
2018
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Microelectronic engineering, 2019-08, Vol.216, p.111090, Article 111090
2019
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Digital signal processing, 2020-06, Vol.101, p.102708, Article 102708
2020
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Study on enhancement and mechanism of K2SO4 in CMP slurries for copper film polishing removal effect
2023
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