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A reconfigurable solid-state plasma dipole antenna based on SPiN diodes

Microelectronic engineering, 2019-06, Vol.214, p.55-59

2019

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Impact of Sn on the Ti/Ge solid-state reaction: Phase formation sequence, morphological and electrical properties

Microelectronic engineering, 2022-01, Vol.252, p.111667, Article 111667

2022

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Plasma surface treatment of GeSn layers and its subsequent impact on Ni / GeSn solid-state reaction

Microelectronic engineering, 2022-03, Vol.257, p.111737, Article 111737

2022

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Influence of dual Ge/C pre-amorphization implantation on the Ni1−xPtxSi phase nucleation and growth mechanisms

Microelectronic engineering, 2021-05, Vol.244-246, p.1, Article 111571

2021

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Phase formation sequence and cobalt behavior in the Ni^sub 0.9^ Co^sub 0.1^ system during the thin film solid-state formation

Microelectronic engineering, 2018-11, Vol.200, p.19

2018

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Solid-state dewetting of single-crystal silicon on insulator: effect of annealing temperature and patch size

Microelectronic engineering, 2018-04, Vol.190, p.1-6

2018

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Experimental and computational investigation of low temperature CuSn solid-state-diffusion bonding for 3D integration

Microelectronic engineering, 2021-02, Vol.236, p.1, Article 111479

2021

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Micro-patterning of LiPON and lithium iron phosphate material deposited onto silicon nanopillars array for lithium ion solid state 3D micro-battery

Microelectronic engineering, 2011-10, Vol.88 (10), p.3172-3177

2011

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Kinetics study of NiPt(10 at.%)/Si0.7Ge0.3 solid state reactions

Microelectronic engineering, 2014-05, Vol.120, p.163-167

2014

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Demonstration of silver micro-joints for flip-chip interconnect

Microelectronic engineering, 2012-11, Vol.99, p.11-17

2012

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Direct FIB fabrication and integration of “single nanopore devices” for the manipulation of macromolecules

Microelectronic engineering, 2010-05, Vol.87 (5), p.1300-1303

2010

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Focused electron beam induced deposition meets materials science

Microelectronic engineering, 2018-01, Vol.185-186, p.9-28

2018

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Characterization of UV photodetectors with MgxZn1-xO thin films

Microelectronic engineering, 2010-11, Vol.87 (9), p.1777-1780

2010

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Electrical and physical characteristics of HfLaON-gated metal–oxide-semiconductor capacitors with various nitrogen concentration profiles

Microelectronic engineering, 2011-02, Vol.88 (2), p.159-165

2011

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All-inkjet-printed electrical components and circuit fabrication on a plastic substrate

Microelectronic engineering, 2012-09, Vol.97, p.251-254

2012

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Ni-based metallization of GeSn layers: A review and recent advances

Microelectronic engineering, 2023-01, Vol.269, p.111919, Article 111919

2023

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High-temperature lead-free solder alternatives

Microelectronic engineering, 2011-06, Vol.88 (6), p.981-989

2011

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Phase formation sequence and cobalt behavior in the Ni0.9 Co0.1 system during the thin film solid-state formation

Microelectronic engineering, 2018-11, Vol.200, p.19-25

2018

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Gold cleaning methods for electrochemical detection applications

Microelectronic engineering, 2009-04, Vol.86 (4), p.1282-1285

2009

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TCAD simulation of SOI TFETs and calibration of non-local band-to-band tunneling model

Microelectronic engineering, 2012-10, Vol.98, p.334-337

2012

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Roadmap for 22 nm and beyond (Invited Paper)

Microelectronic engineering, 2009-07, Vol.86 (7), p.1520-1528

Iwai, H.

2009

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High- k dielectrics for future generation memory devices (Invited Paper)

Microelectronic engineering, 2009-07, Vol.86 (7), p.1789-1795

2009

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Novel hydrogen gas sensor based on single ZnO nanorod

Microelectronic engineering, 2008-11, Vol.85 (11), p.2220-2225

2008

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Beyond Black’s equation: Full-chip EM/SM assessment in 3D IC stack

Microelectronic engineering, 2014-05, Vol.120, p.99-105

Sukharev, Valeriy

2014

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Nanotribology and nanomechanics of MEMS/NEMS and BioMEMS/BioNEMS materials and devices

Microelectronic engineering, 2007-03, Vol.84 (3), p.387-412

Bhushan, Bharat

2007

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Zeitschrift / SeriePhysica Status Solidi. B, Basic Solid State Physics

Zeitschrift / SerieMicroelectronic Engineering

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A reconfigurable solid-state plasma dipole antenna based on SPiN diodes

Impact of Sn on the Ti/Ge solid-state reaction: Phase formation sequence, morphological and electrical properties

Plasma surface treatment of GeSn layers and its subsequent impact on Ni / GeSn solid-state reaction

Influence of dual Ge/C pre-amorphization implantation on the Ni1−xPtxSi phase nucleation and growth mechanisms

Phase formation sequence and cobalt behavior in the Ni^sub 0.9^ Co^sub 0.1^ system during the thin film solid-state formation

Solid-state dewetting of single-crystal silicon on insulator: effect of annealing temperature and patch size

Experimental and computational investigation of low temperature CuSn solid-state-diffusion bonding for 3D integration

Micro-patterning of LiPON and lithium iron phosphate material deposited onto silicon nanopillars array for lithium ion solid state 3D micro-battery

Kinetics study of NiPt(10 at.%)/Si0.7Ge0.3 solid state reactions

Demonstration of silver micro-joints for flip-chip interconnect

Direct FIB fabrication and integration of “single nanopore devices” for the manipulation of macromolecules

Focused electron beam induced deposition meets materials science

Characterization of UV photodetectors with MgxZn1-xO thin films

Electrical and physical characteristics of HfLaON-gated metal–oxide-semiconductor capacitors with various nitrogen concentration profiles

All-inkjet-printed electrical components and circuit fabrication on a plastic substrate

Ni-based metallization of GeSn layers: A review and recent advances

High-temperature lead-free solder alternatives

Phase formation sequence and cobalt behavior in the Ni0.9 Co0.1 system during the thin film solid-state formation

Gold cleaning methods for electrochemical detection applications

TCAD simulation of SOI TFETs and calibration of non-local band-to-band tunneling model

Roadmap for 22 nm and beyond (Invited Paper)

High- k dielectrics for future generation memory devices (Invited Paper)

Novel hydrogen gas sensor based on single ZnO nanorod

Beyond Black’s equation: Full-chip EM/SM assessment in 3D IC stack

Nanotribology and nanomechanics of MEMS/NEMS and BioMEMS/BioNEMS materials and devices

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