Materials letters, 2003, Vol.57 (7), p.1345-1350
2003
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Details
- Autor(en) / Beteiligte
- Titel
- Effect of rapid quenching on Sb grain-boundary segregation in Cu
- Ist Teil von
- Materials letters, 2003, Vol.57 (7), p.1345-1350
- Ort / Verlag
- Amsterdam: Elsevier B.V
- Erscheinungsjahr
- 2003
- Quelle
- Access via ScienceDirect (Elsevier)
- Beschreibungen/Notizen
- Cu–2 wt.% Sb alloys in the form of 3-mm rod and 0.10-mm-thick ribbon were prepared and the Sb grain-boundary segregation was studied by using X-ray mapping in the analytical electron microscope. The rod and ribbon were prepared by Cu mold casting and single roller melt spinning, respectively. These two methods correspond to cooling rates of 10 2 and 10 6 K/s, respectively. Despite the difference in cooling rates, Sb grain-boundary segregation was revealed in both alloys.
- Sprache
- Englisch
- Identifikatoren
- ISSN: 0167-577XeISSN: 1873-4979DOI: 10.1016/S0167-577X(02)00985-0Titel-ID: cdi_proquest_miscellaneous_27865689
- Format
- –
- Schlagworte
- Analytical electron microscope, Applied sciences, Condensed matter: structure, mechanical and thermal properties, Cu–Sb alloy, Defects and impurities in crystals, microstructure, Electron microscopy, Equations of state, phase equilibria, and phase transitions, Exact sciences and technology, Grain and twin boundaries, Grain boundary, Grain-boundary segregation, Metals. Metallurgy, Physics, Rapid quenching, Solubility, segregation, and mixing, phase separation, Structure of solids and liquids, crystallography