Sie befinden Sich nicht im Netzwerk der Universität Paderborn. Der Zugriff auf elektronische Ressourcen ist gegebenenfalls nur via VPN oder Shibboleth (DFN-AAI) möglich. mehr Informationen...
Angewandte Chemie (International ed.), 2020-10, Vol.59 (43), p.19037-19041
International ed. in English, 2020

Details

Autor(en) / Beteiligte
Titel
Bioinspired Supramolecular Packing Enables High Thermo‐Sustainability
Ist Teil von
  • Angewandte Chemie (International ed.), 2020-10, Vol.59 (43), p.19037-19041
Auflage
International ed. in English
Ort / Verlag
Germany: Wiley Subscription Services, Inc
Erscheinungsjahr
2020
Link zum Volltext
Quelle
Alma/SFX Local Collection
Beschreibungen/Notizen
  • Bottom‐up self‐assembled bioinspired materials have attracted increasing interest in a variety fields. The use of peptide supramolecular semiconductors for optoelectronic applications is especially intriguing. However, the characteristic thermal unsustainability limits their practical application. Here, we report the thermal sustainability of cyclo‐ditryptophan assemblies up to 680 K. Non‐covalent interactions underlie the stability mechanism, generating a low exciton‐binding energy of only 0.29 eV and a high thermal‐quenching‐activation energy of up to 0.11 eV. The contributing forces comprise predominantly of aromatic interactions, followed by hydrogen bonding between peptide molecules, and, to a lesser extent, water‐mediated associations. This thermal sustainability results in a temperature‐dependent conductivity of the supramolecular semiconductors, showing 93 % reduction of the resistance from 320 K to 440 K. Our results establish thermo‐sustainable peptide self‐assembly for heat‐sensitive applications. A simple aromatic dipeptide, cyclo‐ditryptophan, is reported to crystallize into supramolecular semiconductors with thermal sustainability up to 680 K. Non‐covalent interactions underlie the driving forces of the thermal sustainability, generating a high thermal‐quenching‐activity energy of up to 0.11 eV, thus resulting in a 93 % reduction of the conductive resistance from 320 K to 440 K.

Weiterführende Literatur

Empfehlungen zum selben Thema automatisch vorgeschlagen von bX