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Creep-fatigue life assessment for three kinds of solders
Ist Teil von
Materials at high temperatures, 2012-11, Vol.29 (4), p.315-321
Ort / Verlag
Leeds: Taylor & Francis
Erscheinungsjahr
2012
Link zum Volltext
Quelle
Taylor & Francis
Beschreibungen/Notizen
This paper presents a creep-fatigue life evaluation for three kinds of solders of Sn-37Pb, Sn- 3.5Ag and Sn - 3.0Ag - 0.5Cu. Strain controlled push - pull creep-fatigue tests were performed for solid bar specimens under fast-fast, fast-slow, slow-fast and strain-hold strain waveforms and the effect of strain waveforms on creep-fatigue lives is discussed. Sn- 3.5Ag and Sn- 3.0Ag - 0.5Cu solders showed stronger creep-fatigue resistance compared to Sn -37Pb solder. The applicability of the linear damage rule, the strain range partitioning method and the grain boundary sliding model is discussed for predicting creep-fatigue lives of the three solders. The strain range partitioning method and the grain boundary sliding model satisfactorily predicted creep-fatigue lives within a small scatter.