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1. Introduction -- 2. Cleaning -- 3. Shock Processing -- 4. Subtractive Processing -- 5. Generation and Modification of Particles -- 6. Surface Modification, Deposition of Thin Films, Welding and Cladding -- 7. Physics and Chemistry of Laser-Liquid-Solid Interactions -- 8. Liquids and their Properties -- 9. References -- 10. Glossary -- 11. Indexes
Includes bibliographical references (p. [387]-422) and index
Laser processing of solid materials has been commonly performed in gas ambient. Having the workpiece immersed into liquid, having a liquid film on it, or soaking the material with liquid gives several advantages such as removal of the debris, lowering the heat load on the workpiece, and confining the vapour and plasma, resulting in higher shock pressure on the surface. Introduced in the 1980s, neutral liquids assisted laser processing (LALP) has proved to be advantageous in the cutting of heat-sensitive materials, shock peening of machine parts, cleaning of surfaces, fabrication of micro-optical components, and for generation of nanoparticles in liquids. The liquids used range from water through organic solvents to cryoliquids.^