Details

Autor(en) / Beteiligte

• Institute of Electrical and Electronics Engineers,

Titel

2017 18th International Conference on Electronic Packaging Technology (ICEPT)

Ort / Verlag

Piscataway, N.J. : IEEE,

Erscheinungsjahr

2017

Link zum Volltext

• IEEE Electronic Library (IEL)

Beschreibungen/Notizen

• Includes bibliographical references and index.
• The conference will exchange the latest developments in the field of electronic packaging technology through exhibitions, special lectures, special reports, thematic forums, club reports, posters and other forms of experience.
• Description based on publisher supplied metadata and other sources.