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Annotation Advanced gate stacks, channels, junctions and contacts Heterogeneous integration of non Si materials substrates on Si substrates Advanced lithography and high density VLSI patterning technologies Beyond CMOS functional devices with a path for VLSI implementation Interconnect scaling and Cu alternatives chip to chip including optical interconnects Packaging technologies, through silicon vias (TSVs) and 3D system integration Advanced materials, device analysis, and modeling Theoretical understanding, operation fundamentals and reliability issues related to the above devices VLSI manufacturing concepts, technologies and yield optimization.
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