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New concepts and breakthroughs in VLSI processes and devices including Memory, Logic, I O, and I F (RF Analog MS, Imager, MEMS, etc ) Advanced gate stack and interconnect in VLSI processes and devices Advanced lithography and fine patternig technologies for high density VLSI New functional devices beyond CMOS with a path for VLSI implantation Packing of VLSI devices including 3D system integration Processes and devices modeling of VLSI devices Reliability related to the above devices.
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