Details

Autor(en) / Beteiligte

• Bazu, M. I
• Bajenescu, Titu I.,

Titel

Failure analysis : a practical guide for manufacturers of electronic components and systems

Beschreibungen/Notizen

• Description based upon print version of record.
• Includes bibliographical references and index.
• FAILURE ANALYSIS; Contents; Series Editor's Foreword; Foreword by Dr Craig Hillman; Series Editor's Preface; Preface; About the Authors; 1 Introduction; 1.1 The Three Goals of the Book; 1.2 Historical Perspective; 1.2.1 Reliability Prehistory; 1.2.2 The Birth of Reliability as a Discipline; 1.2.3 Historical Development of Reliability; 1.2.4 Tools for Failure Analysis; 1.3 Terminology; 1.4 State of the Art and Future Trends; 1.4.1 Techniques of Failure Analysis; 1.4.2 Failure Mechanisms; 1.4.3 Models for the Physics-of-Failure; 1.4.4 Future Trends; 1.5 General Plan of the Book; References
• 2 Failure Analysis - Why?2.1 Eight Possible Applications; 2.2 Forensic Engineering; 2.2.1 FA at System Level; 2.2.2 FA at Component Level; 2.3 Reliability Modelling; 2.3.1 Economic Benefits of Using Reliability Models; 2.3.2 Reliability of Humans; 2.4 Reverse Engineering; 2.5 Controlling Critical Input Variables; 2.6 Design for Reliability; 2.7 Process Improvement; 2.7.1 Reliability Assurance; 2.8 Saving Money through Early Control; 2.9 A Synergetic Approach; 2.9.1 Synergies of Technological Factors; 2.9.2 Test Structures; 2.9.3 Packaging Reliability
• 2.9.4 Synergies of Operational Stress Factors2.9.5 Synergetic Team; References; 3 Failure Analysis - When?; 3.1 Failure Analysis during the Development Cycle; 3.1.1 Concurrent Engineering; 3.1.2 Failure Analysis during the Design Stage; 3.1.3 Virtual Prototyping; 3.1.4 Reliability Testing during the Development Cycle; 3.2 Failure Analysis during Fabrication Preparation; 3.2.1 Reliability Analysis of Materials; 3.2.2 Degradation Phenomena in Polymers used in Electron Components; 3.3 FA during Fabrication; 3.3.1 Manufacturing History; 3.3.2 Reliability Monitoring; 3.3.3 Wafer-Level Reliability
• 3.3.4 Yield and Reliability3.3.5 Packaging Reliability; 3.3.6 Improving Batch Reliability: Screening and Burn-In; 3.4 FA after Fabrication; 3.4.1 Standard-Based Testing; 3.4.2 Knowledge-Based Testing; 3.5 FA during Operation; 3.5.1 Failure Types during Operation; 3.5.2 Preventive Maintenance of Electronic Systems; References; 4 Failure Analysis - How?; 4.1 Procedures for Failure Analysis; 4.2 Techniques for Decapsulating the Device and for Sample Preparation; 4.2.1 Decapping Techniques; 4.2.2 Decapsulation Techniques; 4.2.3 Cross-Sectioning; 4.2.4 Focused Ion Beam; 4.2.5 Other Techniques
• 4.3 Techniques for Failure Analysis4.3.1 Electrical Techniques; 4.3.2 Optical Microscopy; 4.3.3 Scanning Probe Microscopy (SPM); 4.3.4 Microthermographical Techniques; 4.3.5 Electron Microscopy; 4.3.6 X-Ray Techniques; 4.3.7 Spectroscopic Techniques; 4.3.8 Acoustic Techniques; 4.3.9 Laser Techniques; 4.3.10 Holographic Interferometry; 4.3.11 Emission Microscopy; 4.3.12 Atom Probe; 4.3.13 Neutron Radiography; 4.3.14 Electromagnetic Field Measurements; 4.3.15 Other Techniques; References; 5 Failure Analysis - What?; 5.1 Failure Modes and Mechanisms at Various Process Steps; 5.1.1 Wafer Level
• 5.1.2 Packaging
• Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processes. The models have been developed from the physical and chemical phenomena that are responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal. Reliability engineers nee
• English