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An electrohydrodynamic polarization micropump for electronic cooling

Journal of microelectromechanical systems, 2001-03, Vol.10 (1), p.98-106

2001

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Ultrahigh Thermal Conductivity of Interface Materials by Silver-Functionalized Carbon Nanotube Phonon Conduits

Advanced materials (Weinheim), 2016-09, Vol.28 (33), p.7220-7227

2016

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Electromagnetohydrodynamic flow through a periodically grooved channel

Journal of physics. D, Applied physics, 2024-04, Vol.57 (16), p.165002

2024

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Enhancement of Hot Spot Cooling by Capped Diamond Layer Deposition for Multifinger AlGaN/GaN HEMTs

IEEE transactions on electron devices, 2020-01, Vol.67 (1), p.47-52

2020

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Experimental and numerical investigation of circular minichannel heat sinks with various hydraulic diameter for electronic cooling application

Microelectronics and reliability, 2017-06, Vol.73, p.97-105

2017

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Electrostatic Actuating Double‐Unit Electrocaloric Cooling Device with High Efficiency

Advanced energy materials, 2021-04, Vol.11 (13), p.n/a

2021

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Laser‐Tuned Surface Wettability Modification and Incorporation of Aluminum Nitride (AlN) Ceramics in Thermal Management Devices

Advanced functional materials, 2024-01

2024

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Effect of electrode geometry on performance of an EHD thin-film evaporator

Journal of microelectromechanical systems, 2005-10, Vol.14 (5), p.978-986

2005

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Volltext

Melting of PCMs Embedded in Copper Foams: An Experimental Study

Materials, 2021-03, Vol.14 (5), p.1195

2021

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A Novel Manifold Dual-Microchannel Flow Field Structure with High-Performance Heat Dissipation

Micromachines (Basel), 2022-08, Vol.13 (9), p.1420

2022

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Two phase cooling with nano-fluid for highly dense electronic systems-on-chip – A pilot study

Microelectronics and reliability, 2020-05, Vol.108, p.113640, Article 113640

2020

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Thermal performance modeling of loop heat pipes with flat evaporator for electronics cooling

Microelectronics and reliability, 2018-05, Vol.84, p.37-47

2018

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Thermal Analysis of a Microhotplate - An Experimental Study

Journal of microelectromechanical systems, 2020-06, Vol.29 (3), p.408-417

2020

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Fabrication and Thermal Characterization of Composite Cu-CNT Micropillars for Capillary-driven Phase-Change Cooling Devices

Nanoscale and microscale thermophysical engineering, 2019-10, Vol.23 (4), p.317-333

2019

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Development of Ultra-Thin Thermal Ground Planes by Using Stainless-Steel Mesh as Wicking Structure

Journal of microelectromechanical systems, 2016-10, Vol.25 (5), p.842-844

2016

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Volltext

Experimental Study of Thermal and Pressure Performance of Porous Heat Sink Subjected to Al2O3-H2O Nanofluid

Electronics (Basel), 2022-08, Vol.11 (15), p.2471

2022

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Experimental Study on Cooling Performance of a Hybrid Microchannel and Jet Impingement Heat Sink

Applied sciences, 2022-12, Vol.12 (24), p.13033

2022

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Design and Feasibility Analysis of Microscale Bumped Channel With Supersonic Flow for Electronics Cooling

Journal of microelectromechanical systems, 2016-12, Vol.25 (6), p.1033-1040

2016

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Volltext

Machine Learning (ML) Based Thermal Management for Cooling of Electronics Chips by Utilizing Thermal Energy Storage (TES) in Packaging That Leverages Phase Change Materials (PCM)

Electronics (Basel), 2021-11, Vol.10 (22), p.2785

2021

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Experimental Pool Boiling Heat Transfer Analysis with Copper–Alumina Micro/Nanostructured Surfaces Developed by a Novel Electrochemical Deposition Technique

International journal of thermophysics, 2023-07, Vol.44 (7), Article 112

2023

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Experimental Investigation of Flat Plate Cryogenic Oscillating Heat Pipe

Journal of low temperature physics, 2020, Vol.198 (1-2), p.41-55

2020

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1D and Q2D thermal resistance analysis of micro channel structure and flat plate heat pipe

Microelectronics and reliability, 2017-05, Vol.72, p.103-114

2017

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The new water-cooled cold plate for active phased array antenna using AM technology

2021 IEEE Radar Conference (RadarConf21), 2021, p.1-5

2021

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Single- and Two-Phase Thermal Transport in Microchannels With Embedded Staggered Herringbone Mixers

Journal of microelectromechanical systems, 2014-12, Vol.23 (6), p.1346-1358

2014

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Passive Cooling of Photovoltaics with Desiccants

2017 IEEE 44th Photovoltaic Specialist Conference (PVSC), 2017, p.1893-1897

2017

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An electrohydrodynamic polarization micropump for electronic cooling

Ultrahigh Thermal Conductivity of Interface Materials by Silver-Functionalized Carbon Nanotube Phonon Conduits

Electromagnetohydrodynamic flow through a periodically grooved channel

Enhancement of Hot Spot Cooling by Capped Diamond Layer Deposition for Multifinger AlGaN/GaN HEMTs

Experimental and numerical investigation of circular minichannel heat sinks with various hydraulic diameter for electronic cooling application

Electrostatic Actuating Double‐Unit Electrocaloric Cooling Device with High Efficiency

Laser‐Tuned Surface Wettability Modification and Incorporation of Aluminum Nitride (AlN) Ceramics in Thermal Management Devices

Effect of electrode geometry on performance of an EHD thin-film evaporator

Melting of PCMs Embedded in Copper Foams: An Experimental Study

A Novel Manifold Dual-Microchannel Flow Field Structure with High-Performance Heat Dissipation

Two phase cooling with nano-fluid for highly dense electronic systems-on-chip – A pilot study

Thermal performance modeling of loop heat pipes with flat evaporator for electronics cooling

Thermal Analysis of a Microhotplate - An Experimental Study

Fabrication and Thermal Characterization of Composite Cu-CNT Micropillars for Capillary-driven Phase-Change Cooling Devices

Development of Ultra-Thin Thermal Ground Planes by Using Stainless-Steel Mesh as Wicking Structure

Experimental Study of Thermal and Pressure Performance of Porous Heat Sink Subjected to Al2O3-H2O Nanofluid

Experimental Study on Cooling Performance of a Hybrid Microchannel and Jet Impingement Heat Sink

Design and Feasibility Analysis of Microscale Bumped Channel With Supersonic Flow for Electronics Cooling

Machine Learning (ML) Based Thermal Management for Cooling of Electronics Chips by Utilizing Thermal Energy Storage (TES) in Packaging That Leverages Phase Change Materials (PCM)

Experimental Pool Boiling Heat Transfer Analysis with Copper–Alumina Micro/Nanostructured Surfaces Developed by a Novel Electrochemical Deposition Technique

Experimental Investigation of Flat Plate Cryogenic Oscillating Heat Pipe

1D and Q2D thermal resistance analysis of micro channel structure and flat plate heat pipe

The new water-cooled cold plate for active phased array antenna using AM technology

Single- and Two-Phase Thermal Transport in Microchannels With Embedded Staggered Herringbone Mixers

Passive Cooling of Photovoltaics with Desiccants

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