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An electrohydrodynamic polarization micropump for electronic cooling

Journal of microelectromechanical systems, 2001-03, Vol.10 (1), p.98-106

2001

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Ultrahigh Thermal Conductivity of Interface Materials by Silver-Functionalized Carbon Nanotube Phonon Conduits

Advanced materials (Weinheim), 2016-09, Vol.28 (33), p.7220-7227

2016

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Probing Growth-Induced Anisotropic Thermal Transport in High-Quality CVD Diamond Membranes by Multifrequency and Multiple-Spot-Size Time-Domain Thermoreflectance

ACS applied materials & interfaces, 2018-02, Vol.10 (5), p.4808-4815

2018

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Experimental and numerical investigation of circular minichannel heat sinks with various hydraulic diameter for electronic cooling application

Microelectronics and reliability, 2017-06, Vol.73, p.97-105

2017

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Laser‐Tuned Surface Wettability Modification and Incorporation of Aluminum Nitride (AlN) Ceramics in Thermal Management Devices

Advanced functional materials, 2024-01

2024

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Distribution optimization of thermal through-silicon via for 3D chip based on thermal-mechanic coupling

Microelectronics, 2023-04, Vol.134, p.105723, Article 105723

2023

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Effect of electrode geometry on performance of an EHD thin-film evaporator

Journal of microelectromechanical systems, 2005-10, Vol.14 (5), p.978-986

2005

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Volltext

A Novel Manifold Dual-Microchannel Flow Field Structure with High-Performance Heat Dissipation

Micromachines (Basel), 2022-08, Vol.13 (9), p.1420

2022

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Two phase cooling with nano-fluid for highly dense electronic systems-on-chip – A pilot study

Microelectronics and reliability, 2020-05, Vol.108, p.113640, Article 113640

2020

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Thermal performance modeling of loop heat pipes with flat evaporator for electronics cooling

Microelectronics and reliability, 2018-05, Vol.84, p.37-47

2018

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Thermal Analysis of a Microhotplate - An Experimental Study

Journal of microelectromechanical systems, 2020-06, Vol.29 (3), p.408-417

2020

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Volltext

Fabrication and Thermal Characterization of Composite Cu-CNT Micropillars for Capillary-driven Phase-Change Cooling Devices

Nanoscale and microscale thermophysical engineering, 2019-10, Vol.23 (4), p.317-333

2019

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Development of Ultra-Thin Thermal Ground Planes by Using Stainless-Steel Mesh as Wicking Structure

Journal of microelectromechanical systems, 2016-10, Vol.25 (5), p.842-844

2016

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Volltext

Design and Feasibility Analysis of Microscale Bumped Channel With Supersonic Flow for Electronics Cooling

Journal of microelectromechanical systems, 2016-12, Vol.25 (6), p.1033-1040

2016

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Volltext

1D and Q2D thermal resistance analysis of micro channel structure and flat plate heat pipe

Microelectronics and reliability, 2017-05, Vol.72, p.103-114

2017

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Single- and Two-Phase Thermal Transport in Microchannels With Embedded Staggered Herringbone Mixers

Journal of microelectromechanical systems, 2014-12, Vol.23 (6), p.1346-1358

2014

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Volltext

Excellent transverse power generation and cooling performances of artificially tilted thermoelectric film devices

Nano energy, 2019-12, Vol.66, p.104145, Article 104145

2019

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Numerical Investigation of Miniature Ejector Refrigeration System Embedded with a Capillary Pump Loop

Micromachines (Basel), 2017-07, Vol.8 (8), p.235

2017

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Effect of cooling fluids on high frequency electric and magnetic fields in microelectronic systems with integrated TSVs

Microelectronics, 2017-06, Vol.64 (C), p.19-28

2017

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Experimentation and modeling of the steady-state and transient thermal performances of a helicoidally grooved cylindrical heat pipe

Microelectronics and reliability, 2016-07, Vol.62, p.102-112

2016

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Pressure Drop of Microchannel Plate Fin Heat Sinks

Micromachines (Basel), 2019-01, Vol.10 (2), p.80

2019

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Experimental and numerical investigation of flow and thermal effects on flexible printed circuit board

Microelectronics and reliability, 2017-05, Vol.72, p.5-17

2017

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In Situ Assembly in Confined Spaces of Coated Particle Scaffolds as Thermal Underfills with Extraordinary Thermal Conductivity

ACS applied materials & interfaces, 2015-01, Vol.7 (1), p.838-844

2015

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Piezoelectric oscillating cantilever fan for thermal management of electronics and LEDs — A review

Microelectronics and reliability, 2016-08, Vol.63, p.342-353

Maaspuro, Mika

2016

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An electrohydrodynamic polarization micropump for electronic cooling

Ultrahigh Thermal Conductivity of Interface Materials by Silver-Functionalized Carbon Nanotube Phonon Conduits

Hot-Carrier Cooling in High-Quality Graphene Is Intrinsically Limited by Optical Phonons

Probing Growth-Induced Anisotropic Thermal Transport in High-Quality CVD Diamond Membranes by Multifrequency and Multiple-Spot-Size Time-Domain Thermoreflectance

Experimental and numerical investigation of circular minichannel heat sinks with various hydraulic diameter for electronic cooling application

Laser‐Tuned Surface Wettability Modification and Incorporation of Aluminum Nitride (AlN) Ceramics in Thermal Management Devices

Distribution optimization of thermal through-silicon via for 3D chip based on thermal-mechanic coupling

Effect of electrode geometry on performance of an EHD thin-film evaporator

A Novel Manifold Dual-Microchannel Flow Field Structure with High-Performance Heat Dissipation

Two phase cooling with nano-fluid for highly dense electronic systems-on-chip – A pilot study

Thermal performance modeling of loop heat pipes with flat evaporator for electronics cooling

Thermal Analysis of a Microhotplate - An Experimental Study

Fabrication and Thermal Characterization of Composite Cu-CNT Micropillars for Capillary-driven Phase-Change Cooling Devices

Development of Ultra-Thin Thermal Ground Planes by Using Stainless-Steel Mesh as Wicking Structure

Design and Feasibility Analysis of Microscale Bumped Channel With Supersonic Flow for Electronics Cooling

1D and Q2D thermal resistance analysis of micro channel structure and flat plate heat pipe

Single- and Two-Phase Thermal Transport in Microchannels With Embedded Staggered Herringbone Mixers

Excellent transverse power generation and cooling performances of artificially tilted thermoelectric film devices

Numerical Investigation of Miniature Ejector Refrigeration System Embedded with a Capillary Pump Loop

Effect of cooling fluids on high frequency electric and magnetic fields in microelectronic systems with integrated TSVs

Experimentation and modeling of the steady-state and transient thermal performances of a helicoidally grooved cylindrical heat pipe

Pressure Drop of Microchannel Plate Fin Heat Sinks

Experimental and numerical investigation of flow and thermal effects on flexible printed circuit board

In Situ Assembly in Confined Spaces of Coated Particle Scaffolds as Thermal Underfills with Extraordinary Thermal Conductivity

Piezoelectric oscillating cantilever fan for thermal management of electronics and LEDs — A review

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