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IEEE transactions on components, packaging, and manufacturing technology (2011), 2020-12, Vol.10 (12), p.2027-2036
2020



IEEE transactions on components, packaging, and manufacturing technology (2011), 2019-11, Vol.9 (11), p.2168-2176
2019

IEEE transactions on components and packaging technologies, 2001-06, Vol.24 (2), p.122-141
2001

IEEE transactions on industry applications, 2009-11, Vol.45 (6), p.2073-2079
2009

IEEE transactions on power electronics, 2006-11, Vol.21 (6), p.1541-1547
2006


Journal of microelectromechanical systems, 2001-03, Vol.10 (1), p.98-106
2001


IEEE transactions on components and packaging technologies, 2008-03, Vol.31 (1), p.23-31
2008

International journal of electrical power & energy systems, 2020-10, Vol.121, p.106138, Article 106138
2020
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IEEE transactions on components, packaging, and manufacturing technology (2011), 2017-08, Vol.7 (8), p.1228-1239
2017

IEEE transactions on components, packaging, and manufacturing technology (2011), 2019-12, Vol.9 (12), p.2352-2365
2019


IEEE transactions on antennas and propagation, 2023-06, Vol.71 (6), p.5067-5078
2023
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2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2021, p.86-92
2021

IEEE transactions on industry applications, 2007-05, Vol.43 (3), p.648-656
2007

IEEE transactions on power electronics, 2019-06, Vol.34 (6), p.5027-5031
2019

IEEE transactions on industrial electronics (1982), 2018-09, Vol.65 (9), p.7085-7094
2018
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IEEE transactions on industry applications, 2017-09, Vol.53 (5), p.4406-4413
2017

Proceedings of the IEEE, 2006-08, Vol.94 (8), p.1549-1570
2006

IEEE transactions on components, packaging, and manufacturing technology (2011), 2021-04, Vol.11 (4), p.616-624
2021

IEEE transactions on electron devices, 2020-01, Vol.67 (1), p.47-52
2020
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