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Performances of Two-Phase Cooling Technologies that Uses Water as Working Fluid under Sub-Ambient Pressures
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2021, p.86-92
2021
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Experimental Hydraulic Performance Investigation of Fan Enclosure and Competing Effects
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2023, p.1-5
2023
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Thermal Characterization of Single-Phase Immersion Cooling Capability
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2023, p.1-6
2023
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Thermal Testing of Arrays of PHP Finned Plates for Enhanced Air-Cooling of Electronics
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2023, p.1-5
2023
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Microprocessor Performance with Multiple Cooling Approaches
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2022, p.1-8
2022
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Boiling and Condensation of a Dielectric Liquid in a Closed Enclosure for Electronics Cooling Applications
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2022, p.1-7
2022
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Thermal-Fluid Study of Jet-in-Crossflow Cooling in Comparison with Pure Jet Impingement and Pure Crossflow Cooling Methods Applicable in Hotspot Treatment
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2023, p.1-9
2023
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Analysis of Jet and Cross Flow Interaction with Application in Hotspot Electronics Cooling
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2022, p.1-9
2022
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Preparation, applications and challenges of nanofluids in electronic cooling: A systematic review
Materials today : proceedings, 2021, Vol.43, p.366-372
2021
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Optimization of Metal Foam Heat Sinks for Electronic Air Cooling: Part I: Porosity
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2023, p.1-5
2023
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Numerical Study of Thermal Transport in Channel Flows Enhanced with Single and Multi Air Jet Impingement Cooling and Structured Target Surfaces
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2021, p.1224-1232
2021
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Experimental Analysis of a Dual-Evaporator Thermosyphon Cooling System for CPUs and GPUs
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2022, p.1-7
2022
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Direct Numerical Simulation of Synthetic Jet Coupled to Forced Convection Cooling in a Channel Flow
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2023, p.1-8
2023
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Two-phase flow in compressed copper foam with R134a for high heat flux thermal management: Effects of foam compression ratio and refrigerant operating conditions on thermohydraulic performance
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2023, p.1-10
2023
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A Numerical Study of Compact Fin Array Geometries to Improve Additively Manufactured Heat Exchanger Performance
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2023, p.1-8
2023
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Asymmetric Sawtooth and Cavity-Enhanced Nucleation-Driven Transport (ASCENT) Experiment aboard the International Space Station - Microgravity Outcomes
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2023, p.1-7
2023
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Electronic Cooling of Nodal-Point Semimetals Around Room Temperature
2020 IEEE International Conference on Plasma Science (ICOPS), 2020, p.499-499
2020
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Multi-Scale Electroplated Porous Coating for Immersion Cooling of Electronics
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2022, p.1-7
2022
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Transient study of phase change material based hybrid heat sink for electronics cooling application
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2022, p.1-7
2022
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Numerical Analysis of Passive Manifold Microchannel Heat Exchanger Enhancements
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2022, p.1-10
2022
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Development of a mathematical model for prediction of heat transfer coefficient in micro-channel heat sink
Materials today : proceedings, 2022, Vol.54, p.753-757
2022
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Study of the Impact of the Airflow and Filling Ratio on the Thermal Performances of a Two-Phase Immersion Cooling Prototype
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2022, p.1-6
2022
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Phase Change Material-Based Cooling Systems Subject to Periodic Heating: Lumped Analysis and Experimental Verification
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2023, p.1-7
2023
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Dielectric Fluids for the Direct Forced Convection Cooling of Power Electronics
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2021, p.1-6
2021
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Performance Comparison of Various Thermal Interface Materials Used with Metal Foams
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2023, p.1-7
2023
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