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Liquid-cooled heat sink design methodology with technical and commercial viability considerations: Case study of a partially 3-D printed prototype

Applied thermal engineering, 2024-06, Vol.247, Article 122933

2024

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A review on coolant selection for thermal management of electronics and implementation of multiple-criteria decision-making approach

Applied thermal engineering, 2024-05, Vol.245, Article 122807

2024

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Multiple hot spot cooling with flow boiling of HFE-7000 in a multichannel pin fin heat sink

Applied thermal engineering, 2024-06, Vol.247, Article 123077

2024

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High power density thermal management of discrete semiconductor packages enabled by additively manufactured hybrid polymer-metal coolers

Applied thermal engineering, 2023-02, Vol.220, p.119726, Article 119726

2023

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Heat transfer inside cooling system based on phase change material with alumina nanoparticles

Applied thermal engineering, 2018-11, Vol.144, p.972-981

2018

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Design and demonstration of an ultra-thin planar microscale capillary pumped loop for electronics thermal management

Applied thermal engineering, 2024-07, Vol.248, Article 123096

Dhillon, Navdeep Singh

2024

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Numerical parametric study of a hotspot-targeted microfluidic cooling array for microelectronics

Applied thermal engineering, 2018-11, Vol.144, p.71-80

2018

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A fuzzy coordination control of a water membrane evaporator cooling system for aerospace electronics

Applied thermal engineering, 2021-06, Vol.191, p.116872, Article 116872

2021

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Combined effects of inclination angle and fin number on thermal performance of a PCM-based heat sink

Applied thermal engineering, 2019-08, Vol.159, p.113956, Article 113956

2019

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Employing elliptical pin-fins and nanofluid within a heat sink for cooling of electronic chips regarding energy efficiency perspective

Applied thermal engineering, 2021-01, Vol.183, p.116159, Article 116159

2021

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Liquid-cooled heat sink design for a multilevel inverter switch with considerations for heat spreading and manufacturability

Applied thermal engineering, 2023-01, Vol.219, p.119588, Article 119588

2023

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Data center energy conservation study utilizing loop heat pipes as a chip-level cooling technique and its industrial application

Applied thermal engineering, 2023-02, Vol.220, p.119715, Article 119715

2023

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Application of novel double-layer micro-jet heat sinks for energy-efficient thermal management of motor inverters in electric vehicles

Applied thermal engineering, 2023-08, Vol.231, p.120836, Article 120836

2023

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New thermal packaging with a boiling-driven heat spreader for thermal management of the power electronics

Applied thermal engineering, 2023-01, Vol.219, p.119515, Article 119515

2023

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Melting of phase change materials inside periodic cellular structures fabricated by additive manufacturing: Experimental results and numerical simulations

Applied thermal engineering, 2022-10, Vol.215, p.118969, Article 118969

2022

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Nanoparticles enhanced phase change materials (NePCMs)-A recent review

Applied thermal engineering, 2020-07, Vol.176, p.115305, Article 115305

2020

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Experimental evaluation of a thermal contact liquid cooling system for server electronics

Applied thermal engineering, 2018-01, Vol.129, p.1010-1025

2018

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Numerical study on layout of micro-channel heat sink for thermal management of electronic devices

Applied thermal engineering, 2015-09, Vol.88, p.480-490

2015

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A novel integrated flat thermosyphon heat sink for energy-efficient chip-level thermal management in data centers

Applied thermal engineering, 2024-01, Vol.236, p.121667, Article 121667

2024

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Experimental investigation on the start-up performance of a loop heat pipe with three flat disk evaporators combined

Applied thermal engineering, 2022-11, Vol.216, p.119128, Article 119128

2022

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Experimental comparison between different configurations of PCM based heat sinks for cooling electronic components

Applied thermal engineering, 2015-08, Vol.87, p.454-462

2015

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Numerical investigation of non-Newtonian water-CMC/CuO nanofluid flow in an offset strip-fin microchannel heat sink: Thermal performance and thermodynamic considerations

Applied thermal engineering, 2019-06, Vol.155, p.247-258

2019

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Experimental investigation of loop heat pipe with a large squared evaporator for cooling electronics

Applied thermal engineering, 2018-11, Vol.144, p.383-391

2018

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Efficient optimization of parallel micro-channel heat sinks based on flow resistance network model

Applied thermal engineering, 2023-10, Vol.233, p.121169, Article 121169

2023

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Experimental investigation of the thermal resistance of advanced two-phase thermosyphon heatsinks

Applied thermal engineering, 2024-02, Vol.238, p.122108, Article 122108

2024

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Liquid-cooled heat sink design methodology with technical and commercial viability considerations: Case study of a partially 3-D printed prototype

A review on coolant selection for thermal management of electronics and implementation of multiple-criteria decision-making approach

Multiple hot spot cooling with flow boiling of HFE-7000 in a multichannel pin fin heat sink

High power density thermal management of discrete semiconductor packages enabled by additively manufactured hybrid polymer-metal coolers

Heat transfer inside cooling system based on phase change material with alumina nanoparticles

Design and demonstration of an ultra-thin planar microscale capillary pumped loop for electronics thermal management

Numerical parametric study of a hotspot-targeted microfluidic cooling array for microelectronics

A fuzzy coordination control of a water membrane evaporator cooling system for aerospace electronics

Combined effects of inclination angle and fin number on thermal performance of a PCM-based heat sink

Employing elliptical pin-fins and nanofluid within a heat sink for cooling of electronic chips regarding energy efficiency perspective

Liquid-cooled heat sink design for a multilevel inverter switch with considerations for heat spreading and manufacturability

Data center energy conservation study utilizing loop heat pipes as a chip-level cooling technique and its industrial application

Application of novel double-layer micro-jet heat sinks for energy-efficient thermal management of motor inverters in electric vehicles

New thermal packaging with a boiling-driven heat spreader for thermal management of the power electronics

Melting of phase change materials inside periodic cellular structures fabricated by additive manufacturing: Experimental results and numerical simulations

Nanoparticles enhanced phase change materials (NePCMs)-A recent review

Experimental evaluation of a thermal contact liquid cooling system for server electronics

Numerical study on layout of micro-channel heat sink for thermal management of electronic devices

A novel integrated flat thermosyphon heat sink for energy-efficient chip-level thermal management in data centers

Experimental investigation on the start-up performance of a loop heat pipe with three flat disk evaporators combined

Experimental comparison between different configurations of PCM based heat sinks for cooling electronic components

Numerical investigation of non-Newtonian water-CMC/CuO nanofluid flow in an offset strip-fin microchannel heat sink: Thermal performance and thermodynamic considerations

Experimental investigation of loop heat pipe with a large squared evaporator for cooling electronics

Efficient optimization of parallel micro-channel heat sinks based on flow resistance network model

Experimental investigation of the thermal resistance of advanced two-phase thermosyphon heatsinks

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