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A First-Principles Study of the SF6 Decomposed Products Adsorbed Over Defective WS2 Monolayer as Promising Gas Sensing Device

IEEE transactions on device and materials reliability, 2019-09, Vol.19 (3), p.473-483

2019

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Comprehensive Study on Trap-Induced Bias Instability via High-Pressure D 2 and N 2 Annealing

IEEE transactions on device and materials reliability, 2023-06, Vol.23 (2), p.276-280

2023

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Interfacial Charge Analysis of Heterogeneous Gate Dielectric-Gate All Around-Tunnel FET for Improved Device Reliability

IEEE transactions on device and materials reliability, 2016-06, Vol.16 (2), p.227-234

2016

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Volltext

Unveiling T max Inside GaN HEMT Based X-Band Low-Noise Amplifier by Correlating Thermal Simulations and IR Thermographic Measurements

IEEE transactions on device and materials reliability, 2023-03, Vol.23 (1), p.72-79

2023

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The Novel Structure to Enhancement I on / I off Ratio Based on Field Effect Diode

IEEE transactions on device and materials reliability, 2021-09, Vol.21 (3), p.389-393

2021

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Guest Editorial TDMR 2021 IIRW Special Section

IEEE transactions on device and materials reliability, 2022-09, Vol.22 (3), p.319-321

Ring, Matthew

2022

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Volltext

Power Cycling Reliability of Power Module: A Survey

IEEE transactions on device and materials reliability, 2016-03, Vol.16 (1), p.80-97

2016

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Volltext

Failure and Reliability Analysis of a SiC Power Module Based on Stress Comparison to a Si Device

IEEE transactions on device and materials reliability, 2017-12, Vol.17 (4), p.727-737

2017

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Volltext

Understanding BTI in SiC MOSFETs and Its Impact on Circuit Operation

IEEE transactions on device and materials reliability, 2018-06, Vol.18 (2), p.144-153

2018

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Effects of Thermo-Mechanical Fatigue and Low Cycle Fatigue Interaction on Performance of Solder Joints

IEEE transactions on device and materials reliability, 2018-12, Vol.18 (4), p.606-612

2018

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Volltext

Comparative Study of Reliability of Ferroelectric and Anti-Ferroelectric Memories

IEEE transactions on device and materials reliability, 2018-06, Vol.18 (2), p.154-162

2018

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Volltext

Characterization and Modeling of Hot Carrier Degradation Under Dynamic Operation Voltage

IEEE transactions on device and materials reliability, 2024-03, p.1-1

2024

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Data-Driven Stress/Warpage Analyses Based On Stoney Equation for Packaging Applications

IEEE transactions on device and materials reliability, 2024-03, p.1-1

2024

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Critical Insights Into Fast Charging Techniques for Lithium-Ion Batteries in Electric Vehicles

IEEE transactions on device and materials reliability, 2021-03, Vol.21 (1), p.137-152

2021

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Design Optimization of Three-Stacked Nanosheet FET From Self-Heating Effects Perspective

IEEE transactions on device and materials reliability, 2022-09, Vol.22 (3), p.396-402

2022

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Effect of Sintering Pressure on the Porosity and the Shear Strength of the Pressure-Assisted Silver Sintering Bonding

IEEE transactions on device and materials reliability, 2018-06, Vol.18 (2), p.240-246

2018

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A Review of Raman Thermography for Electronic and Opto-Electronic Device Measurement With Submicron Spatial and Nanosecond Temporal Resolution

IEEE transactions on device and materials reliability, 2016-12, Vol.16 (4), p.667-684

2016

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Volltext

Editorial for New TDMR Editor Byoung Woon Min

IEEE transactions on device and materials reliability, 2020-09, Vol.20 (3), p.486-486

Min, Byoung Woon

2020

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Volltext

Improvement of Encapsulation Technique of Organic Photovoltaics by UV-Curable Adhesive

IEEE transactions on device and materials reliability, 2023-06, Vol.23 (2), p.281-286

2023

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Volltext

Output-Power Enhancement for Hot Spotted Polycrystalline Photovoltaic Solar Cells

IEEE transactions on device and materials reliability, 2018-03, Vol.18 (1), p.37-45

2018

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Volltext

Editorial From Edmundo A. Gutiérrez-D

IEEE transactions on device and materials reliability, 2020-03, Vol.20 (1), p.3-3

Gutierrez-D, Edmundo A.

2020

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Volltext

Multiple Node Upset-Tolerant Latch Design

IEEE transactions on device and materials reliability, 2019-06, Vol.19 (2), p.387-392

Liu, Xin

2019

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Degradation and Reliability Modeling of EM Robustness of Voltage Regulators Based on ADT: An Approach and A Case Study

IEEE transactions on device and materials reliability, 2024-03, Vol.24 (1), p.1-1

2024

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Volltext

Reliability Test of 21% Efficient Flexible Perovskite Solar Cell under Concave, Convex and Sinusoidal Bending

IEEE transactions on device and materials reliability, 2023-09, Vol.23 (3), p.1-1

2023

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Investigation of the Long-term Reliability of a Velostat-Based Flexible Pressure Sensor Array for 210 Days

IEEE transactions on device and materials reliability, 2024-03, Vol.24 (1), p.1-1

2024

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Volltext

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A First-Principles Study of the SF6 Decomposed Products Adsorbed Over Defective WS2 Monolayer as Promising Gas Sensing Device

Comprehensive Study on Trap-Induced Bias Instability via High-Pressure D 2 and N 2 Annealing

Interfacial Charge Analysis of Heterogeneous Gate Dielectric-Gate All Around-Tunnel FET for Improved Device Reliability

Unveiling T max Inside GaN HEMT Based X-Band Low-Noise Amplifier by Correlating Thermal Simulations and IR Thermographic Measurements

The Novel Structure to Enhancement I on / I off Ratio Based on Field Effect Diode

Guest Editorial TDMR 2021 IIRW Special Section

Power Cycling Reliability of Power Module: A Survey

Failure and Reliability Analysis of a SiC Power Module Based on Stress Comparison to a Si Device

Understanding BTI in SiC MOSFETs and Its Impact on Circuit Operation

Effects of Thermo-Mechanical Fatigue and Low Cycle Fatigue Interaction on Performance of Solder Joints

Comparative Study of Reliability of Ferroelectric and Anti-Ferroelectric Memories

Characterization and Modeling of Hot Carrier Degradation Under Dynamic Operation Voltage

Data-Driven Stress/Warpage Analyses Based On Stoney Equation for Packaging Applications

Critical Insights Into Fast Charging Techniques for Lithium-Ion Batteries in Electric Vehicles

Design Optimization of Three-Stacked Nanosheet FET From Self-Heating Effects Perspective

Effect of Sintering Pressure on the Porosity and the Shear Strength of the Pressure-Assisted Silver Sintering Bonding

A Review of Raman Thermography for Electronic and Opto-Electronic Device Measurement With Submicron Spatial and Nanosecond Temporal Resolution

Editorial for New TDMR Editor Byoung Woon Min

Improvement of Encapsulation Technique of Organic Photovoltaics by UV-Curable Adhesive

Output-Power Enhancement for Hot Spotted Polycrystalline Photovoltaic Solar Cells

Editorial From Edmundo A. Gutiérrez-D

Multiple Node Upset-Tolerant Latch Design

Degradation and Reliability Modeling of EM Robustness of Voltage Regulators Based on ADT: An Approach and A Case Study

Reliability Test of 21% Efficient Flexible Perovskite Solar Cell under Concave, Convex and Sinusoidal Bending

Investigation of the Long-term Reliability of a Velostat-Based Flexible Pressure Sensor Array for 210 Days

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