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Organic electronics, 2010-07, Vol.11 (7), p.1176-1179
2010
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Materials science & engineering. R, Reports : a review journal, 2014-09, Vol.83, p.1-59
2014
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Organic electronics, 2013-03, Vol.14 (3), p.768-774
2013
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International journal of thermal sciences, 2015-01, Vol.87, p.103-109
2015
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International journal of heat and mass transfer, 2016-06, Vol.97, p.337-352
2016
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Neuron (Cambridge, Mass.), 2020-10, Vol.108 (1), p.66-92
2020
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Sensors and actuators. A. Physical., 2018-10, Vol.281, p.130-140
2018
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International journal of heat and mass transfer, 2021-08, Vol.175, p.121192, Article 121192
2021
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Sensors and actuators. A. Physical., 2020-10, Vol.313, p.112191, Article 112191
2020
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Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment, 2021-06, Vol.1001, p.165247, Article 165247
2021
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Sensors and actuators. A. Physical., 2022-02, Vol.334, p.113366, Article 113366
2022
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Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment, 2017-07, Vol.871
2017
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Sensors and actuators. B, Chemical, 2018-12, Vol.275, p.237-243
2018
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Journal of magnetism and magnetic materials, 2020-11, Vol.513, p.167240, Article 167240
2020
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Sensors and actuators. A. Physical., 2020-11, Vol.315, p.112365, Article 112365
2020
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Sensors and actuators. A. Physical., 2013-04, Vol.192, p.49-57
2013
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Sensors and actuators. A. Physical., 2018-08, Vol.279, p.284-292
2018
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Signal processing. Image communication, 2022-01, Vol.100, p.116517, Article 116517
2022
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Radiation physics and chemistry (Oxford, England : 1993), 2019-02, Vol.155, p.213-216
2019
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Microelectronics and reliability, 2015-02, Vol.55 (3-4), p.654-661
2015
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Communications in nonlinear science & numerical simulation, 2012-11, Vol.17 (11), p.4328-4335
2012
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Optics and laser technology, 2021-10, Vol.142, p.107177, Article 107177
2021
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Technovation, 2007-12, Vol.27 (12), p.744-765
2007
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Microelectronic engineering, 2009-07, Vol.86 (7), p.1789-1795
- Kittl, J.A.
- Opsomer, K.
- Popovici, M.
- Menou, N.
- Kaczer, B.
- Wang, X.P.
- Adelmann, C.
- Pawlak, M.A.
- Tomida, K.
- Rothschild, A.
- Govoreanu, B.
- Degraeve, R.
- Schaekers, M.
- Zahid, M.
- Delabie, A.
- Meersschaut, J.
- Polspoel, W.
- Clima, S.
- Pourtois, G.
- Knaepen, W.
- Detavernier, C.
- Afanas’ev, V.V.
- Blomberg, T.
- Pierreux, D.
- Swerts, J.
- Fischer, P.
- Maes, J.W.
- Manger, D.
- Vandervorst, W.
- Conard, T.
- Franquet, A.
- Favia, P.
- Bender, H.
- Brijs, B.
- Van Elshocht, S.
- Jurczak, M.
- Van Houdt, J.
- Wouters, D.J.
2009
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Microelectronic engineering, 2008-12, Vol.85 (12), p.2330-2333
2008
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