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A Lumped-Element Wideband 3-dB Quadrature Hybrid
IEEE microwave and wireless components letters, 2019-06, Vol.29 (6), p.385-387
2019
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Silicon Photonic Radar Receiver IC for mm-Wave Large Aperture MIMO Radar Using Optical Clock Distribution
IEEE microwave and wireless components letters, 2022-12, Vol.32 (12), p.1447-1450
2022
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Wideband Analysis and Prolongation of Surrounding TGVs Shielding Structure in 3-D ICs
IEEE microwave and wireless technology letters (Print), 2023-01, Vol.33 (1), p.1-4
2023
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Silicon Photonic Radar Transmitter IC for mm-Wave Large Aperture MIMO Radar Using Optical Clock Distribution
IEEE microwave and wireless components letters, 2021-06, Vol.31 (6), p.783-786
2021
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A 135-150 GHz High-Power Frequency Tripler With Filtering Matching Network
IEEE microwave and wireless components letters, 2022-11, Vol.32 (11), p.1327-1330
2022
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A Ka-Band MMIC LNA in GaN-on-Si 100-nm Technology for High Dynamic Range Radar Receivers
IEEE microwave and wireless components letters, 2021-02, Vol.31 (2), p.161-164
2021
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Microstrip to Ridge Empty Substrate-Integrated Waveguide Transition for Broadband Microwave Applications
IEEE microwave and wireless components letters, 2020-03, Vol.30 (3), p.257-260
2020
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C-Band Frequency-Tunable Rectifier Designed by HySIC Concept Utilizing GaAs MMIC and Si RFIC
IEEE microwave and wireless components letters, 2020-10, Vol.30 (10), p.997-1000
2020
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A Low Insertion Loss Variation Trombone True Time Delay in GaAs pHEMT Monolithic Microwave Integrated Circuit
IEEE microwave and wireless components letters, 2021-07, Vol.31 (7), p.889-892
2021
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Accurate Magnetic Coupling Coefficient Modeling of 3-D Transformer Based on TSV
IEEE microwave and wireless components letters, 2022-12, Vol.32 (12), p.1419-1422
2022
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An 18-56-GHz Wideband GaN Low-Noise Amplifier With 2.2-4.4-dB Noise Figure
IEEE microwave and wireless components letters, 2020-12, Vol.30 (12), p.1153-1156
2020
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Parallel Non-Monte Carlo Transient Noise Simulation
IEEE microwave and wireless components letters, 2021-06, Vol.31 (6), p.634-637
2021
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A Compact and High-Linearity 140-160 GHz Active Phase Shifter in 55 nm BiCMOS
IEEE microwave and wireless components letters, 2021-02, Vol.31 (2), p.157-160
2021
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A V-Band Miniaturized Bidirectional Switchless PALNA in SiGe:C BiCMOS Technology
IEEE microwave and wireless components letters, 2020-08, Vol.30 (8), p.786-789
2020
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Broadband Zero-Bias RF Field-Effect Rectifiers Based on AlGaN/GaN Nanowires
IEEE microwave and wireless components letters, 2020-01, Vol.30 (1), p.66-69
2020
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Voltage-Tunable Thin Film Graphene-Diode-Based Microwave Harmonic Generator
IEEE microwave and wireless components letters, 2021-06, Vol.31 (6), p.733-736
2021
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1-W, High-Gain, High-Efficiency, and Compact Sub-GHz Linear Power Amplifier Employing a 1:1 Transformer Balun in 180-nm CMOS
IEEE microwave and wireless components letters, 2020-08, Vol.30 (8), p.779-781
2020
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2.6-GHz Integrated LDMOS Doherty Power Amplifier for 5G Basestation Applications
IEEE microwave and wireless components letters, 2021-07, Vol.31 (7), p.881-884
2021
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A Novel Parameter Extraction Technique of Microwave Small-Signal Model for Nanometer MOSFETS
IEEE microwave and wireless components letters, 2019-11, Vol.29 (11), p.710-713
2019
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Low-Loss Millimeter-Wave SPDT Switch MMICs in a Metamorphic HEMT Technology
IEEE microwave and wireless components letters, 2020-02, Vol.30 (2), p.197-200
2020
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InGaAs MOSHEMT W-Band LNAs on Silicon and Gallium Arsenide Substrates
IEEE microwave and wireless components letters, 2020-11, Vol.30 (11), p.1089-1092
2020
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Design Methodology Using Single Resonate Block for Harmonic Impedance Matching in GaN MMIC Doherty Amplifier
IEEE microwave and wireless components letters, 2021-04, Vol.31 (4), p.397-400
2021
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Heterogeneously Integrated RF Circuits Using Highly Scaled off-the-Shelf GaN HEMT Chiplets
IEEE microwave and wireless components letters, 2020-11, Vol.30 (11), p.1061-1064
2020
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On-Chip Integrated Backshort for Relaxation of Machining Accuracy Requirements in Frequency Multipliers
IEEE microwave and wireless components letters, 2021-02, Vol.31 (2), p.188-191
2021
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Equivalent Circuit-Based Coupling Modeling of Double Bond Ribbons Interconnection Variation in Electronic Packaging
IEEE microwave and wireless components letters, 2022-11, Vol.32 (11), p.1367-1370
2022
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