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Inkjet printing and low power laser annealing of silver nanoparticle traces for the realization of low resistivity lines for flexible electronics

Microelectronic engineering, 2011-08, Vol.88 (8), p.2481-2483

2011

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All-inkjet-printed electrical components and circuit fabrication on a plastic substrate

Microelectronic engineering, 2012-09, Vol.97, p.251-254

2012

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TCAD simulation of SOI TFETs and calibration of non-local band-to-band tunneling model

Microelectronic engineering, 2012-10, Vol.98, p.334-337

2012

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Gold cleaning methods for electrochemical detection applications

Microelectronic engineering, 2009-04, Vol.86 (4), p.1282-1285

2009

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Photolithographic properties of tin-oxo clusters using extreme ultraviolet light (13.5nm)

Microelectronic engineering, 2014-09, Vol.127, p.44-50

2014

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Integration challenges of copper Through Silicon Via (TSV) metallization for 3D-stacked IC integration

Microelectronic engineering, 2011-05, Vol.88 (5), p.745-748

2011

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Fabrication of ZrO2 layer through electrohydrodynamic atomization for the printed resistive switch (memristor)

Microelectronic engineering, 2013-03, Vol.103, p.167-172

2013

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Conductivity enhancement of aerosol-jet printed electronics by using silver nanoparticles ink with carbon nanotubes

Microelectronic engineering, 2012-08, Vol.96, p.71-75

2012

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Synergetic effect of H2O2 and glycine on cobalt CMP in weakly alkaline slurry

Microelectronic engineering, 2014-06, Vol.122, p.82-86

2014

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Novel hydrogen gas sensor based on single ZnO nanorod

Microelectronic engineering, 2008-11, Vol.85 (11), p.2220-2225

2008

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Titanium nitride as electrode for MOS technology and Schottky diode: Alternative extraction method of titanium nitride work function

Microelectronic engineering, 2012-04, Vol.92, p.86-90

2012

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UV enhanced substrate conformal imprint lithography (UV-SCIL) technique for photonic crystals patterning in LED manufacturing

Microelectronic engineering, 2010-05, Vol.87 (5), p.963-967

2010

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Current SiC technology for power electronic devices beyond Si

Microelectronic engineering, 2006, Vol.83 (1), p.2-4

Matsunami, H.

2006

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Ground plane fin-shaped field effect transistor (GP-FinFET): A FinFET for low leakage power circuits

Microelectronic engineering, 2012-07, Vol.95, p.74-82

2012

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CVD of cobalt–tungsten alloy film as a novel copper diffusion barrier

Microelectronic engineering, 2013-06, Vol.106, p.91-95

2013

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Hierarchical roughness makes superhydrophobic states stable

Microelectronic engineering, 2007-03, Vol.84 (3), p.382-386

2007

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Atomic layer deposition of titanium nitride from TDMAT precursor

Microelectronic engineering, 2009, Vol.86 (1), p.72-77

2009

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High- k dielectrics for future generation memory devices (Invited Paper)

Microelectronic engineering, 2009-07, Vol.86 (7), p.1789-1795

2009

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Sub-10 nm patterning by focused He-ion beam milling for fabrication of downscaled graphene nano devices

Microelectronic engineering, 2014-02, Vol.114, p.70-77

2014

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The electron scattering at grain boundaries in tungsten films

Microelectronic engineering, 2014-06, Vol.122, p.5-8

Choi, Dooho

2014

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Ultra low concentrated molecular detection using super hydrophobic surface based biophotonic devices

Microelectronic engineering, 2010-05, Vol.87 (5), p.798-801

2010

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Nanotribology and nanomechanics of MEMS/NEMS and BioMEMS/BioNEMS materials and devices

Microelectronic engineering, 2007-03, Vol.84 (3), p.387-412

Bhushan, Bharat

2007

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Electrochemical investigations for copper electrodeposition of through-silicon via

Microelectronic engineering, 2011-02, Vol.88 (2), p.195-199

2011

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Fabrication of diffraction gratings for hard X-ray phase contrast imaging

Microelectronic engineering, 2007-05, Vol.84 (5), p.1172-1177

2007

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Through silicon via: From the CMOS imager sensor wafer level package to the 3D integration

Microelectronic engineering, 2010-03, Vol.87 (3), p.470-476

2010

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Inkjet printing and low power laser annealing of silver nanoparticle traces for the realization of low resistivity lines for flexible electronics

All-inkjet-printed electrical components and circuit fabrication on a plastic substrate

TCAD simulation of SOI TFETs and calibration of non-local band-to-band tunneling model

Gold cleaning methods for electrochemical detection applications

Photolithographic properties of tin-oxo clusters using extreme ultraviolet light (13.5nm)

Integration challenges of copper Through Silicon Via (TSV) metallization for 3D-stacked IC integration

Fabrication of ZrO2 layer through electrohydrodynamic atomization for the printed resistive switch (memristor)

Conductivity enhancement of aerosol-jet printed electronics by using silver nanoparticles ink with carbon nanotubes

Synergetic effect of H2O2 and glycine on cobalt CMP in weakly alkaline slurry

Novel hydrogen gas sensor based on single ZnO nanorod

Titanium nitride as electrode for MOS technology and Schottky diode: Alternative extraction method of titanium nitride work function

UV enhanced substrate conformal imprint lithography (UV-SCIL) technique for photonic crystals patterning in LED manufacturing

Current SiC technology for power electronic devices beyond Si

Ground plane fin-shaped field effect transistor (GP-FinFET): A FinFET for low leakage power circuits

CVD of cobalt–tungsten alloy film as a novel copper diffusion barrier

Hierarchical roughness makes superhydrophobic states stable

Atomic layer deposition of titanium nitride from TDMAT precursor

High- k dielectrics for future generation memory devices (Invited Paper)

Sub-10 nm patterning by focused He-ion beam milling for fabrication of downscaled graphene nano devices

The electron scattering at grain boundaries in tungsten films

Ultra low concentrated molecular detection using super hydrophobic surface based biophotonic devices

Nanotribology and nanomechanics of MEMS/NEMS and BioMEMS/BioNEMS materials and devices

Electrochemical investigations for copper electrodeposition of through-silicon via

Fabrication of diffraction gratings for hard X-ray phase contrast imaging

Through silicon via: From the CMOS imager sensor wafer level package to the 3D integration

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